• Journal of the Korean Society for Precision Engineering
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• v.24 no.6
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• pp.51-57
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• 2007

Creep-feed grinding is an effective technology processes to increase the productivity and efficiency in form grinding. This method has, however, some problems which the progress of abrasive wear around the cutting edge is remarkable, grinding force become intense and burn marks on the ground surface occur frequently. In order to solve this problems, it is proposed in this study to dress the grinding wheel continuously during the grinding process. The purpose of this research is. therefore, that CNC creep-feed grinding machine which has a continuous dressing device developed and some grinding experiments for determination of dressing conditions carried out.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.62-69
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• 1993

The accuracy of machine tools is the major factor concerned with the acuracy of the processed work. The feed errors of feed system in machine tool, therfore, make the machining errors of work directly on processing. In this point, this study focused on the generative elements of feed errors in CNC cylindrical grinding machine, such as supporting method of ball screw, the effect of pitch and yaw error and the position detecting method in servo system when operating its shaft of grinding wheel head. Furthermore, in order to improve the driving accuracy of this machine tool, feed errors are measured by a laser interferometer. Results obtained in this study provide some useful informations to attain high accuracy of CNC machine tool.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.5-10
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• 2003

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.172-179
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• 2005

A high-precision centerless grinding machine has been recognized as a core equipment performing the finish outer-diameter grinding process of ferrules which are widely used as fiber optic connectors. In this study, in order to realize the high-precision centerless grinding machine, the structural characteristic analysis and evaluation are carried out on the virtual prototype consisted of the steel bed, hydrostatic GW and RW spindle systems, hydrostatic RW feed mechanism, RW swivel mechanism, and on-machine GW and RW dressers. The loop stiffnesses of centerless grinding machine are estimated based on the relative deformations between GW and RW caused by the grinding forces. And the simulated results illustrate that the concrete-filled bed has the considerable effect on the improvement of the structural stiffness of centerless grinding machine.