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Grinding Technologies of the In-feed Grinding Machine with Air Bearing Spindle  

안대균 (한국공작기계 기술연구소)
김동석 (한국공작기계 기술연구소)
하상백 (한국공작기계 기술연구소)
이상직 (한국공작기계 기술연구소)
Publication Information
Journal of the Korean Society for Precision Engineering / v.20, no.5, 2003 , pp. 5-10 More about this Journal
Keywords
Air Bearing Spindle; In-Feed Grinding Machine; Inclination of Chuck Table; Flatness; Form Accuracy;
Citations & Related Records
연도 인용수 순위
  • Reference
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2 TSO, 'A Study Of Surface Profile on Grinding of Silicon Wafer,' Proceeding of Abrasive Technology, pp. 219-225, 2001
3 Ahn, D. K., et. al., 'The Trend of wafer Grinding Technology and Improvement of Machining Accuracy,' KSPE Fall Conference 2001, pp. 300-304, 2001
4 Pei, Z. J., Strasbaugh, A., 'Fine Grinding of Silicon Wafers,' Int. J. of Machine Tools & Manufacture, Vol. 41, pp. 659-672, 2001   DOI   ScienceOn