• Title/Summary/Keyword: In situ fracture technique

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Short Segment Pedicle Screw Fixation with Augmented Intra-Operative Vertebroplasty in Unstable Thoraco-Lumbar Fracture - Preliminary Report - (불안정성 흉·요추부 골절에 대한 단 분절 척추경 나사못 고정술 및 추체 보강 성형술 - 예 비 보 고 -)

  • Kim, Young Woo;Oh, Sung Han;Yoon, Do Heum;Chin, Dong Kyu;Cho, Yong Eun;Kim, Young Soo
    • Journal of Korean Neurosurgical Society
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    • v.30 no.11
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    • pp.1271-1277
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    • 2001
  • Objectives : Since vertebroplasty has been introduced, we performed short segment pedicle screw fixation with augmented intra-operative vertebroplasty in patients with unstable thoraco-lumbar fracture. Our intentions are to demonstrate the efficacy and indication of this new technique compare to conventional methods. Material and Methods : The surgery comprised of pedicle screw fixations on one level above and below the fracture site, and the fractured level itself, if pedicle is intact, and intra-operative vertebroplasty under the fluoroscopic guide with in-situ postero-lateral bone graft. Also, in cases of bone apposition, we removed those with small impactor through a transfascetal route. During the last 2 years, we performed in seven(7) unstable thoraco-lumbar fracture patients who consisted of two different characteristics, those four(4) with primary or secondary osteoporosis and three(3) of young and very healthy. All patients were followed clinically by A.S.I.A. score and radiography. Results : Mean follow up period was 14 months. We observed well decompressed state via transfascetal route in cases of bone fragments apposition and no hardware pullout in osteoporotic cases, no poly-methyl-methacrylate (PMMA) leakage through the fracture sites into the spinal canal, and no kyphotic deformities in both cases during follow-up periods. All patients demonstrated solid bony fusion except one following osteoporotic compression fracture on other sites. Conclusions : In the management of unstable thoraco-lumbar fracture, we believe that this short segment pedicle screw fixation with augmented intra-operative vertebroplasty reduce the total length or levels of pedicle screw fixation without post-operative kyphotic deformity.

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Microstructure and Mechanical Properties of Squeeze Cast AZ91 Mg/Al Borate Whisker Composites (용탕단조법으로 제조된 AZ91 Mg/Al Borate 휘스커 복합재료의 미세조직 및 기계적 특성)

  • Kim, Kwang-Chun;Cho, Young-Su;Lee, Sung-Hak;Park, Ik-Min
    • Journal of Korea Foundry Society
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    • v.16 no.6
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    • pp.537-549
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    • 1996
  • This study aims at investigating the correlation of microstructure and mechanical properties of the AZ91 Mg/Al borate whisker composites fabricated by squeeze csting technique with a variation of applied pressure. Microstructure observation and in-situ fracture tests were conducted on the composites to identify the microfracture process. Detailed microstructural analyses indicated that the grain refinement could be achieved with applied pressure and the little change in volume fraction on reinforcing whiskers could be carried out. It was also found clearly from in-situ observation of crack initiation and propagation that in the composite processed by the lower applied pressure, microcracks were initiated earily at whisker/matrix interfaces, thereby resulting in the drop in strength. In the composite processed by the higher applied pressure, on the other hand, planar slip lines were well developed in the matrix, and then propagated through whiskers without whisker/matrix decohesion. Thus, the effect of the applied pressure on microstructure and mechanical properties can be explained by grain refinement, increased amounts of reinforcements, and improvement of whisker/matrix interfacial strength as the applied pressure in increased.

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Effects of Tungsten Addition on Tensile Properties of a Refractory Nb-l8Si-l0Ti-l0Mo-χW (χ=0, 5, 10 and 15 mot.%) In-situ Composites at 1670 K

  • 김진학;Tatsuo Tabaru;Hisatoshi Hirai
    • Transactions of Materials Processing
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    • v.8 no.3
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    • pp.233-233
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    • 1999
  • To investigate the effect of tungsten addition on mechanical properties, we prepared refractory (62χ)Nb-18Si-l00Mo-l0Ti-χW (χ=0, 5, 10 and 15 mol.%) in-situ composites by the conventional arc-casting technique, and then explored the microstructure, hardness and elastic modulus at ambient temperature and tensile properties at 1670 K. The microstructure consists of relatively fine (Nb, Mo, W, Ti)/sub 5/Si₃, silicide and a Nb solid solution matrix, and the fine eutectic microstructure becomes predominant at a Si content of around 18 mol.%. The hardness of (Nb, Mo, W, Ti(/sub 5/Si₃, silicide in a W-free sample is 1680 GPa, and goes up to 1980 GPa in a W 15 mol.% sample. The hardness, however, of Nb solid solution does not exhibit a remarkable difference when the nominal W content is increased. The elastic modulus shows a similar tendency to the hardness. The optimum tensile properties of the composites investigated are achieved at W 5 mol.% sample, which exhibits a relatively good ultimate strength of 230 MPa and an excellent balance of yield strength of 215 MPa, and an elongation of 3.7%. The SEM fractography generally indicates a ductile fracture in the W-free sample, and a cleavage rupture in W-impregnated ones.

Crack propagation behavior of in-situ structural gradient Ni/Ni-aluminide//Ti/Ti-aluminide laminate materials (Ni/Ni-aluminide//Ti/Ti-aluminide 구조경사형 층상재료의 균열 전파 거동)

  • Chung, D.S.;Kim, J.K.;Cho, H.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.15 no.6
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    • pp.269-275
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    • 2005
  • Ni/Ni-aluminide/Ti/Ti-aluminide laminate composite, considered as a functionally gradient material, was manufactured by thin foil hot press technique. Thick intermetallic layers of NiAl and $TiAl_3$ were formed by a self-propagating high-temperature synthesis (SHS) reaction, and thin continuous taters of $Ni_3Al$ and TiAl were formed by a solid-state diffusion. Fracture resistance with loading along the crack arrester direction is higher than crack divider direction due to the interruption of crack growth in metal layers. The $Ni_3Al$ and NiAl intermetallic layer showed cleavage and intergranular fracture behavior, respectively, while the fracture mode of $TiAl_3$ layer was found to be an intragranular cleavage. The debonding between metal and intermetallic layer and the pores were observed in the Ni/Ni-aluminide layers, resulting in the lower fracture resistance. With the results of acoustic emission (AE) source characterization the real time of failure and the effect of AE to crack growth could be monitored.

Monitoring and Analysis on Die Loads in Multi-stage Cold Forging Process Using Piezo-Sensors (금형블록에 장착된 압조센서를 활용한 다단 냉간단조 공정의 모니터링 및 분석)

  • Kang, S.M.;Kang, K.J.;Yeom, S.R.;Lee, K.H.;Kim, J.Y.
    • Transactions of Materials Processing
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    • v.31 no.1
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    • pp.5-10
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    • 2022
  • In multi-stage cold forging process, to enhance the productivity and product quality, in-site process monitoring technique by implanting sensors such as piezo-sensor and acoustic emission sensor has been continuously studied. For accurate analysis of the process, the selection of appropriate sensors and implantation positions are very important. Until now, in a multi-state forging machine, wedge parts located at the end of punch-set are used but it is difficult to analyze minute changes in die block-set. In this study, we also implanted sensors to the die part (die spacer) and compared signals from both sensors and found that sensing signals from die part showed enhanced process monitoring results.

Mechanical Behavior of Directionally Solicified (Y2O3)ZrO2/Al2O3 Eurtctic Fibers

  • Park, Deok-Yong;Yang, Jenn-Ming
    • Journal of the Korean Ceramic Society
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    • v.41 no.1
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    • pp.1-8
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    • 2004
  • The microstructural features and mechanical behavior of directionally solidified $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fibers after extended beat treatment in oxidizing environment were investigated. The fiber was grown continuously by an Edge-defined Film-fed Growth (EFG) technique. The microstructure was characterized using X-Ray Diffraction (XRD) and Scanning Electron Microscopy(SEM). The microstructure of the fiber in the as-fabricated state consists of highly oriented colonv and fine lamellar microstructure along the fiber axis. Tensile strength of the $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber remained unchanged with heat treatment at temperatures between $1200^{\circ}C$ and $1500^{\circ}C$ up to 300h. The weibulls modulus remained fairly constant after extended thermal exposure. The fracture toughness and crack propagation behavior were investigated. The fracture toughness ($K_{1C}$) of the $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber in the as-fabricated state were measured to be 3.6 ${\pm}$ 0.5 MPa${\cdot}m^{1/2}$ by an indentation technique and 2.2 ${\pm}$ 0.2 MPa${\cdot}m^{1/2}$ by assuming elliptical flaw of a semi-infinite solid, respectively. The $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber showed a radial (Palmqvist) crack type and exhibited an orthotropic crack growth behavior under 100 g load.

Fabrication of Electroconductive $Si_3N_4$-TiN Ceramic Composites by In-Situ Reaction Sintering (In-Situ 반응소결에 의한 전도성 $Si_3N_4$-TiN 복합세라믹스 제조)

  • Lee, Byeong-Taek;Yun, Yeo-Ju;Park, Dong-Su;Kim, Hae-Du
    • Korean Journal of Materials Research
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    • v.9 no.6
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    • pp.577-582
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    • 1999
  • In order to make the electroconductive $Si_3N_4$-TiN composities, the Si-Ti(N) compacts were nitrided at $1450^{\circ}C$ for 20hours, and then they were post-sintered by a gas-pressure-sintering technique at 1TEX>$1950^{\circ}C$ for 3.5 hours. As starting powders, commercial si powder of about $10\mu\textrm{m}$, two types of Ti powders of 100 and 325 mesh, and fine-sized TiN of $2.5\mu\textrm{m}$ powders were used. In the $Si_3N_4$-TiN sintered bodies used Ti powders, the relative density and fracture strength and electrical conductivity are low due to the existence of large amounts of coarse pores. However, in the $Si_3N_4$-TiN composite used TiN powder, the fracture toughness, fracture strength and electrical resistivity were $5.0MPa{\cdot}m^{1/2}$, 624MPa and $1400{\omega}cm$, respectively. The dispersion of TiN particles in the composite inhibited the growth of $Si_3N_4$ in the shape of rod and made strong strain field contrasts at the $Si_3N_4$-TiNinterfaces. It was recognized that microstructural control is required to improve the electrical conductivity and mechanical properties of $Si_3N_4$-TiN composites by dispersing TiN particles homogeneously.

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Nanodispersion-Strengthened Metallic Materials

  • Weissgaerber, Thomas;Sauer, Christa;Kieback, Bernd
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.441-448
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    • 2002
  • Dispersions of non-soluble ceramic particles in a metallic matrix can enhance the strength and heat resistance of materials. With the advent of mechanical alloying it became possible to put the theoretical concept into practice by incorporating very fine particles in a flirty uniform distribution into often oxidation- and corrosion- resistant metal matrices. e.g. superalloys. The present paper will give an overview about the mechanical alloying technique as a dry, high energy ball milling process for producing composite metal powders with a fine controlled microstructure. The common way is milling of a mixture of metallic and nonmetallic powders (e.g. oxides. carbides, nitrides, borides) in a high energy ball mill. The heavy mechanical deformation during milling causes also fracture of the ceramic particles to be distributed homogeneously by further milling. The mechanisms of the process are described. To obtain a homogeneous distribution of nano-sized dispersoids in a more ductile matrix (e.g. aluminium-or copper based alloys) a reaction milling is suitable. Dispersoid can be formed in a solid state reaction by introducing materials that react with the matrix either during milling or during a subsequent heat treatment. The pre-conditions for obtaining high quality materials, which require a homogeneous distribution of small dis-persoids, are: milling behaviour of the ductile phase (Al, Cu) will be improved by the additives (e.g. graphite), homogeneous introduction of the additives into the granules is possible and the additive reacts with the matrix or an alloying element to form hard particles that are inert with respect to the matrix also at elevated temperatures. The mechanism of the in-situ formation of dispersoids is described using copper-based alloys as an example. A comparison between the in-situ formation of dispersoids (TiC) in the copper matrix and the milling of Cu-TiC mixtures is given with respect to the microstructure and properties, obtained.

Analysis of Complications after Treatment of Calcaneal Fracture (종골 골절 일차 치료 후 발생한 합병증에 대한 분석)

  • Suh, Dong-Hyun;Park, Yong-Wook;Kim, Do-Young;Lee, Sang-Soo;Yoon, Tae-Kyung;Park, Hyun-Chul;Kang, Seung-Wan
    • Journal of Korean Foot and Ankle Society
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    • v.8 no.1
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    • pp.46-51
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    • 2004
  • Purpose: Problematic late sequelae are common following a calcaneal fracture regardless of the initial treatment. We retrospectively evaluated the painful conditions and reviewed the results of the operative treatment in patients with previously treated calcaneal fractures. Materials and Methods: Between October 1996 and September 2001, forty-three patients who underwent subsequent surgical treatment for late sequelae of calcaneal fracture were reviewed. The initial treatment consisted of only immobilization in a cast in 7 patients, closed reduction with pin fixation (Essex-Lopresti technique) in 22 and open reduction and internal fixation in 14. Painful conditions in the hind foot included subtalar arthritis in 31 patients, calcaneofibular impingement in 13, peroneal tendinitis in 6, displaced posterior bony fragment in 3, sural neuritis in 2, subtalar and midtarsal arthritis in 1 and displaced plantar bony fragment in 1. The surgical procedures for the late complications were performed at a mean of 19 months (range, 6 to 35 months) after the injury and consisted of lateral wall ostectomy and in situ subtalar fusion in 28 patients, only lateral wall ostectomy in 5 patients, lateral wall ostectomy and subtalar distraction arthrodesis in 3, removal of displaced posterior bony fragment in 3, sural nerve transposition in the peroneus brevis in 2, triple arthrodesis in 1 and removal of displaced plantar bony fragment in 1. Mean postoperative follow up period was 57 months (range, 33 to 82 months). The results of treatment were evaluated on the basis of pain, improvement in the ability to perform activities of daily living, to return to work or to a pre-injury level of activity. Results: Pain was partially relieved in 38 patients (88%), but not relieved in 5. Function improved in 34 patients (79%), and 32 (74%) returned to work or to a pre-injury level of activity. There was a trend that the longer the interval between the injury and the operation, the longer the subsequent interval until the patient returned to full activities or work. Conclusion: Meticulous physical examination and intensive prompt treatment for remaining pain after initial treatment of calcaneal fractures are recommended for patient's satisfaction and returning to work.

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Effect of Dual-Dicing Process Adopted for Silicon Wafer Separation on Thermal-Cycling Reliability of Semiconductor Devices (실리콘 웨이퍼에 2중 다이싱 공정의 도입이 반도체 디바이스의 T.C. 신뢰성에 미치는 영향)

  • Lee, Seong-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.1-4
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    • 2009
  • This work shows how the adoption of a dual-dicing process for silicon wafer separation affects the thermal-cycling reliability (i.e. $-65^{\circ}C$ to $150^{\circ}C$) of the semiconductor devices utilizing lead-on-chip (LOC) die attach technique. In-situ examinations show that conventional single-dicing process directly attacks the edge region of diced devices but dual-dicing process effectively protects the edge region of diced devices from dicing-induced mechanical damage. Probably, this is because the preferential and sacrificial fracture of notched regions induced on the active surface of wafers saves the edge regions. It was also investigated through thermal-cycling tests that the number of thermal-cycling induced failures is much lower at the dual-dicing process than the single-dicing process.

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