• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1821-1824
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• 2008

A novel in-mold packaging process has been developed to manufacture devices with closed channels. In this unified process, fabrication of open channels and forming the rigid cover on top of them are sequentially integrated in the same mold. The entire process is comprised of two phases. In the first phase, the open channels are fabricated under an exquisitely controlled temperature and pressure using the conventional micro injection molding technology. In the second phase, the closed channels are fabricated by conducting the injection molding process using the molded structure with the open channels as a mold insert. As a result, the in-mold technology can eliminate the bonding processes such as heating, ultrasonic or chemical processes for cohesion between the channel and the cover, which have been required in conventional methods.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.3
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• pp.66-72
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• 2016

The applicability of rice husk fiber as a raw material for eco-friendly pulp mold was evaluated in this study. The higher demand of environmental friendly packaging material resulted in the more interest for the natural fiber based pulp mold. The rice husk which is an abundant agricultural byproduct in Asia could be defiberized by an alkaline digestion process. The changes in the pulp mold making process and the properties of pulp mold by the addition of the rice husk were investigated. The addition of rice husk fiber to the pulp mold made with OCC or UBKP resulted in the increase in drainage at the pulp mold forming process. In case of UBKP pulp mold, the addition of rice husk fiber increased the drying efficiency after pulp mold forming since the structure of pulp mold became more bulkier by the addition of the rice husk fiber. Those results showed the rice husk fiber could be applied to the pulp mold manufacturing as one of the eco-friendly natural fiber resources.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.36 no.3
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• pp.52-59
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• 2004

The greater Increase of the demand for environmental friendly materials especially for packaging industry leads to the larger interest in the reusable and recycable materials such as pulp mold. Although the pulp mold has great characteristics for packaging, some deficiency compared with other packaging material like EPS(Expandable Polystyrene) need to be overcome, for example, the relative higher cost. In this report, since the water drainage rate at the forming zone of a wet pulp mold process could have a great influence on the economical efficiency not only by increasing machine speed but also reducing the drying energy, the optimum ways for increasing drainage were investigated The mechanism of vacuum drainage In pulp mold forming was successfully evaluated by using RDA(Retention and Darinage Analyzer). Since the conditions of stock were greatly affected by the pulping time of low consistency pulper, the optimum pupling time was investigated with considerations of all stock preparation processes. The change of stock temperature and the addition of polyelectrolyte could improve the vacuum drainage rate. It was founded that the wire mesh types of mold former had a little influence on the retention because of the relatively mild vacuum drainage. However, the bigger size of dewatering hole showed better drainage rate and could reduce the plugging and con lamination of mold.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.53-57
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• 2001

A short shot is an incomplete molded part caused by insufficient material injection into the mold. Remedial actions to control the process conditions can be taken by injection molding experts based on their knowledge and experiences. However, it is very difficult for non-experts to avoid short shot by finding the proper process conditions such as mold temperature, melt temperature and filling time. In this paper, an intelligent generator of optimal process conditions based upon fully logic algorithm is proposed so that trial and error can be minimized and non-experts an well at experts can also find the optimal process conditions.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.47-50
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• 2021

Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.36 no.3
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• pp.83-90
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• 2004

Pulp mold is one of the famous environmental friendly materials, which made from re cycled materials such as old newsprints through the environmental friendly processes. Furthermore, the used pulp mold can be easily recycled and the pulp mold itself is biodegradable. However, the higher cost and some deficiency in physical properties of pulp mold have been considered as issues to be overcome for a substitute for polymeric packaging materials such as EPS (Expandable Polystyrene). The way for the optimization of a pulp mold mill was proposed in this report. The possible reduction of drying energy was calculated by using a computer simulation method, which could Provide the detailed information about mass balance of overall process. The simulated results showed a great possible curtailment of production cost by improving the forming systems, for example, increasing the temperature and the dryness of a wet pulp mold.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.76-81
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• 2007

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

• Design & Manufacturing
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• v.2 no.2
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• pp.15-19
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• 2008

In this paper, the automatic assembly and packaging system was developed for PET blow molding products. The PET blow molding products mainly are used in groceries case and are in great demand. Generally, the molding process is compose of 4 processes such as plastic resin injection, molding, ejecting and packaging. In case of packaging process, although amount of work per hour is very large, all processes are still performed by the manual work. For this reason, the automatic packaging system was developed with the function of automatic hand-grip part assembly. For the development of system, the existing processes and the shape of molding product were analyzed and specifications were deducted. Finally, the automatic assembly and packaging system was developed and applied to the manufacturing field.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.