• Title/Summary/Keyword: Imprint

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Imprint Cytologic Feature of Extraskeletal Osteosarcoma - A Case Report - (골외골육종의 압착도말 소견 - 1예 보고 -)

  • Gu, Mi-Jin;Bae, Young-Kyung;Kim, Mi-Jin;Choi, Joon-Hyuk;Choi, Won-Hee
    • The Korean Journal of Cytopathology
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    • v.11 no.1
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    • pp.59-63
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    • 2000
  • Extraskeletal osteosarcoma is an uncommon tumor originated from soft tissue without evidence of skeletal involvement. It usually affects adults and its common locations are extremity, buttock, and retroperitoneum. Although the histologic feature of this tumor is well known, there have been few reports on the fine needle aspiration cytologic findings. We report the imprint cytologic feature of extraskeletal osteosarcoma. The patient was a 49-year-old man with a mass of the left anterior chest for 2 years. On the Imprint preparation, the smears showed malignant round, polygonal or spindle cells with coarsely clumped chromatin and occasionally prominent nucleoli. The malignant cells occur singly, in clusters, or associated with amorphous eosinophilic osteoid. Mitotic figures are also seen.

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Fabrication of Nanometer-sized Pattern on PMMA Plate Using AAO Membrane As a Template for Nano Imprint Lithography (AAO 나노기공을 나노 임프린트 리소그래피의 형틀로 이용한 PMMA 나노패턴 형성 기술)

  • Lee, Byoung-Wook;Hong, Chin-Soo;Kim, Chang-Kyo
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.5
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    • pp.420-425
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    • 2008
  • PMMA light guiding plate with nano-sized pattern was fabricated using anodized aluminum oxide membrane as a template for nano imprint lithography. Nano-sized pore arrays were prepared by the self-organization processes of the anodic oxidation using the aluminum plate with 99.999% purity. Since the aluminum plate has a rough surface, the aluminum plate with thickness of 1mm was anodized after the pre-treatments of chemical polishing, and electrochemical polishing. The surface morphology of the alumina obtained by the first anodization process was controlled by the concentration of electrochemical solution during the first anodization. The surface morphology of the alumina was also changed according to temperature of the solution during chemical polishing performed after first anodization. The pore widening process was employed for obtaining the one-channel with flat surface and height of the channel because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of two-channel with rough surface. It is shown from SPM results that the nano-sized pattern on PMMA light guiding plate fabricated by nano imprint lithography method was well transferred from that of anodized aluminum oxide template.

High density line patterns fabricated by thermal imprint (Thermal imprint를 이용한 고밀도 line패턴 형성방법)

  • Lee, Sang-Moon;Kwak, Jung-Bok;Lee, Hwan-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.270-270
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    • 2008
  • We present details of experimental results in the fabrication of high density line patterns, using imprint technique that can provide a simple and comparatively cost-effective manufacturing means. Barrier array structures for display or interconnects for semiconductor applications were the aims of this study. For pattern fabrication, a polymer layer (Ajinomoto GX-13 dielectric film) with a thickness of 38um that can act as either an insulating or a dielectric layer was laminated on a substrate. Fine tracks were then formed using a patterned stamp under isostatic pressure. The line width was ranged between 10 to 60 mm. A self-assembled monolayer (SAM) of fluorinated alkylchlorosilane [$CF_3(CF_2)5(CH_2)2SiCl_3$] as an anti-sticking layer was coated on the surface of the stamp prior to thermal imprint to improve the de-molding characteristic.

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Manufactured Flexible Active Matrix Backplanes using Self-Alighed Imprint Lithography (SAIL)

  • Kwon, Oh-Seung;Marcia-Almanza-Workman, Marcia-Almanza-Workman;Braymen, Steve;Cobene, Robert;Elder, Richard;Garcia, Robert;Gomez-Pancorbo, Fernando;Hauschildt, Jason;Jackson, Warren;Jam, Mehrban;Jeans, Albert;Jeffrey, Frank;Junge, Kelly;Kim, Han-Jun;Larson, Don;Luo, Hao;Maltabes, John;Mei, Ping;Perlov, Craig;Smith, Mark;Stieler, Dan;Taussig, Carl
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.138-141
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    • 2009
  • Progress in the development of a fully roll-to-roll selfaligned imprint process for producing active matrix backplanes with submicron aligned features on flexible substrates is reported. High performance transistors, crossovers and addressable active matrix arrays have been designed and fabricated using imprint lithography. Such a process has the potential of significantly reducing the costs of large area displays. The progress, current status and remaining issues of this new fabrication technology are reported.

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Numerical Investigation of Micro Thermal Imprint Process of Glassy Polymer near the Glass Transition Temperature (열방식 마이크로 임프린트 공정을 위한 고분자 재료의 수치적 모델링과 해석)

  • Lan, Shuhuai;Lee, Soo-Hun;Lee, Hye-Jin;Song, Jung-Han;Sung, Yeon-Wook;Kim, Moo-Jong;Lee, Moon-G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.45-52
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    • 2009
  • The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.

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A Study on the Imprinting Process for an Optical Interconnection of PLC Device (광소자의 광 정렬 및 연결 구조 구현용 임프린트 공정 연구)

  • Kim, Young Sub;Cho, Sang Uk;Kang, Ho Ju;Jeong, Myung Yung
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.12
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    • pp.1376-1381
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    • 2012
  • Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

Thermal properties and mechanical properties of dielectric materials for thermal imprint lithography

  • Kwak, Jeon-Bok;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.242-242
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    • 2006
  • Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

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Development of Thermal Imprint System for Net-Shape Manufacturing of Multi-layer Ceramic Structure (세라믹 정형 가공을 위한 성형기 개발)

  • Park, C.K.;Rhim, S.H.;Hong, J.P.;Lee, J.K.;Yoon, S.M.;Ko, J.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.10a
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    • pp.401-404
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    • 2008
  • In the present investigation, a high precision thermal imprint system for micro ceramic products was developed and the net-shape manufacturing of multi-layer ceramic reflector for LED (Light Emitting Diode) was conducted with a precision metal die. Workpiece used in the present investigation were the multi-layer laminated ceramic sheets with pre-punched holes. The cavity with arbitrary angle was formed on the circular and rectangular holes of the ceramic sheets. During the imprinting process, the ambient temperature of the imprint system was kept over the transition temperature of the ceramic sheet and then rapidly cooled. The results in this paper show that the present method can be successfully applied to the fabrication of very small size hole array for ceramic reflector in a one step operation.

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Sub 150nm Soft-Lithography using the monomer based thermally curable resin (Monomer based thermally curable resin을 이용한 150nm 급 Soft-Lithography)

  • Yang K.Y.;Hong S.H.;Lee H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.676-679
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    • 2005
  • Nano imprint Lithography (NIL) is regarded as one of the next-generation lithography technologies with EUV lithography, immersion lithography, Laser interference lithography. Because a Si wafer stamp and a quartz stamp, used to imprinting usually are very expensive and easily broken, it is suggested that master stamp is duplicated by PDMS and the PDMS stamp uses to imprint .For using the PDMS stamp, a thermally curable monomer resin was used for the imprinting process to lower pressure and temperature. As a result, NIL patterns were successfully fabricated.

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Fabrication of 3-D structures using hybrid imprint lithography (Hybrid Imprint Lithography 공정을 이용한 3D 구조물 제작)

  • Sin, Sang-Hyun;Kim, Han-Hyoung;Yang, Seung-Kook;Lee, Jong-Geun;O, Beom-Hoan;Lee, Seung-Gol;Lee, Il-Hang;Park, Se-Geun
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.509-510
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    • 2008
  • Hybrid Imprint Lithography (HIL) is proposed where photolithography and imprinting processes are employed. Fabrication step of multilevel or three dimensional patterns is suggested. The method of controlling residual layer thickness after imprinting is developed. The thickness of residual layer changes lineally with imprinting time and can be controlled. Polymer patterns fabricated by this HIL is demonstrated.

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