Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Fabrication of 3-D structures using hybrid imprint lithography

Hybrid Imprint Lithography 공정을 이용한 3D 구조물 제작

  • Sin, Sang-Hyun (Department of Information Engineering, Inha University) ;
  • Kim, Han-Hyoung (Department of Information Engineering, Inha University) ;
  • Yang, Seung-Kook (Department of Information Engineering, Inha University) ;
  • Lee, Jong-Geun (Digital & Industrial Electron Engineering, Bucheon College) ;
  • O, Beom-Hoan (Department of Information Engineering, Inha University) ;
  • Lee, Seung-Gol (Department of Information Engineering, Inha University) ;
  • Lee, Il-Hang (Department of Information Engineering, Inha University) ;
  • Park, Se-Geun (Department of Information Engineering, Inha University)
  • 신상현 (인하대학교 정보공학부) ;
  • 김한형 (인하대학교 정보공학부) ;
  • 양승국 (인하대학교 정보공학부) ;
  • 이종근 (부천대학, 디지털 산업전자과) ;
  • 오범환 (인하대학교 정보공학부) ;
  • 이승걸 (인하대학교 정보공학부) ;
  • 이일항 (인하대학교 정보공학부) ;
  • 박세근 (인하대학교 정보공학부)
  • Published : 2008.06.18
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Abstract

Hybrid Imprint Lithography (HIL) is proposed where photolithography and imprinting processes are employed. Fabrication step of multilevel or three dimensional patterns is suggested. The method of controlling residual layer thickness after imprinting is developed. The thickness of residual layer changes lineally with imprinting time and can be controlled. Polymer patterns fabricated by this HIL is demonstrated.

Keywords