• Transactions on Control, Automation and Systems Engineering
• /
• 제4권1호
• /
• pp.2-8
• /
• 2002

This paper discusses haptic display for grasping a virtual object by two fingers. Much research has been done on fundamental analysis for stability of haptic display. But it is difficult to apply the results immediately to grasping situations by two fingers, since the studies usually deal with a single device and a single object and the fingertip force in grasping situations has two components, internal and external components. The conventional methods, which specify the coupling impedance at each contact point separately, have no other alternative but to specify the impedance for the sum of the internal and external components. So even if only the impedance for the external force should be changed, the impedance for the internal force is also changed at the same time. In this paper, a new method, in which the coupling impedance is specified separately for the internal and external forces, is proposed and the stability of the proposed method is discussed using passivity analysis for 1 -DOF(Degree-Of-Freedom) system. Finally, some experiments are performed to study the effects of the proposed method.

• 한국조명전기설비학회:학술대회논문집
• /
• 한국조명전기설비학회 2008년도 춘계학술대회 논문집
• /
• pp.313-316
• /
• 2008

This paper presents the error factors of Fall-of-potential test method used in measurements of the grounding-system impedance. This test methods inherently can introduce two possible errors in the measurements of grounding-system impedance: (1) ground mutual resistance due to current flow through ground from the ground electrode to the current probe, (2) ac mutual coupling between the current test lead and the potential test lead. The errors of ground mutual resistances and ac mutual coupling are expressed by the equation in calculating grounding impedance. These equations were calculated by Matlab that is commercial tool using mathematical calculation. The results of calculation were applied to correct grounding impedance.

• 전기학회논문지
• /
• 제57권7호
• /
• pp.1223-1228
• /
• 2008

While a high frequency source is used for measuring the ground impedance, there are several factors having an effect on the measured value. A primary factor of the measurement error is the ac mutual coupling between current and potential test leads. The mutual coupling causes the test current to induce a voltage into the potential test lead that adds to the actual ground potential rise and produces a significant measurement error as the length of the test leads paralleled is prolonged. In order to avoid the mutual coupling, it is recommended that the ground impedance be measured by angled arrangement of test leads. The mutual impedance due to the inductive coupling with an angle of $90^{\circ}$ was calculated at $0^{\circ}$ by Campbell/Foster Method. With an angle of $180^{\circ}$, the mutual impedance was calculated large value enough to introduce a fairly large margin of error, however, the measured value of ground impedance was close to the value at $90^{\circ}$.

• 소음진동
• /
• 제8권6호
• /
• pp.1137-1143
• /
• 1998

This paper describes the method to measure of the vibrational power transmitted from the vibration source to the supporting structure in the horizontal direction. Generally, it is impossible to measure horizontal forces at the coupling points. However. the vibrational Power transmitted in the horizontal direction can be measured by using indirect method that is based on the mechanical impedance and velocities at the coupling points. We proposed the method to estimate the vibrational power when the vibration source and supporting structure cannot be separated. In this paper. the vibrational power transmitted in the horizontal direction is also estimated by using this method. The estimated and measured results of the mobilities at the coupling point and vibrational power in the horizontal direction are compared. It is shown that the estimated results agree well with the measured results. For the supporting structure with multiple coupling points, the other coupling points should be considered for measuring the vibrational power transmitted through one coupling points. We examine the effects of other coupling points and measure the vibrational power without considering the other coupling points.

• 소음진동
• /
• 제8권2호
• /
• pp.306-312
• /
• 1998

This paper proposes a method for estimating the vibrational power supplied by a machine that generates excitation force to its supporting structure via the coupling points. The basis of the method is that the vibrational power can be calculated using the mechanical impedance and the velocity at the coupling points on the supporting structure. First, a method is described to estimate the mobilities at the coupling points when the machine is not separable from the supporting structure, then the vibrational power is calculated using the estimated mobilities and measured velocities at the coupling points. The mobilities are estimated from the result of impulsive testing of the coupled structure. The method is investigated using an experimental model. The estimated and measured values of the mobilities and the vibrational power are compared. It is shown that the estimated values agree well with the measured values.

• 대한기계학회논문집A
• /
• 제25권4호
• /
• pp.555-563
• /
• 2001

Support dynamics are often important in rotordynamic analyses. It may well happen in real situation of machines such as centrifugal pumps or turbines operating on flexible structure. This paper presents the applications of the impedance coupling method and the improved rotor model for including the support effects on the interaction with the rotor. The impedance coupling techniques are based on the FRFs of each substructure. Its dynamic stiffness matrix can be assembled to generate the system matrix, which satisfy the constraint conditions in the connection coordinates. And, the improved rotor uses the simplified spring-mass models as support properties. The equivalent support models are directly incorporated into the finite element rotor model. To verify the suggested analytical procedures, the results are compared to those of the pump system.

• 한국전자파학회논문지
• /
• 제14권4호
• /
• pp.377-383
• /
• 2003

동(copper) 케이블을 이용한 xDSL 초고속서비스가 널리 보급됨에 따라 외부 전자파에 의한 통신케이블의 전자파 결합특성을 해hi하기 위해 케이블 쉴드층의 전달임피던스가 중요하게 되었다. 본 논문에서는 xDSL 서비스를 제공하기 위해 사용되는 대표적인 형태의 통신케이블에 대해 IEC 96-1의 line injection method를 이용하여 전달임피던스를 측정하였다. 또한 injection line의 위치, 내부 도체의 위치가 전달임피던스에 어떻게 영향을 주는지를 분석하였으며, 이를 근거로 통신케이블의 전달임피던스 특성 모델을 제시하였다.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 1997년도 춘계학술대회논문집; 경주코오롱호텔; 22-23 May 1997
• /
• pp.662-668
• /
• 1997

Since the structural impedance is much greater than that of medium in the most cases, we often assume that the structure is rigid and that the structural vibration is independent of medium, i.e. we usually calculate the vibration of the structure first, and then obtain the radiation sound from it. This assumption is no longer satisfied when the structural stiffness is small or the fluid impedance is comparable to it. This situation often happens in underwater acoustics. Although many researchers have studied about structural-fluid coupling, we have difficulties in solving the problem analytically. Therefore the numerical method using powerful computation leads us to obtain the various coupling problem. To understand the physical coupling phenomena, visualization of sound field by a geometrically simple system(plate-cavity coupled system) is performed experimentally. Acoustic holographic method is used to estimate sound field.

• Journal of Power Electronics
• /
• 제13권6호
• /
• pp.1080-1089
• /
• 2013

In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.

• Journal of Power Electronics
• /
• 제17권1호
• /
• pp.282-293
• /
• 2017

There exists a strong coupling between real and reactive power owing to the complex impedances in droop based islanded microgrids (MGs). The existing virtual impedance methods consider improvements of the impedance matching for sharing of the voltage controlled power (VCP) (reactive power for Q-V droop, and real power for P-V droop), which yields a 1-DOF (degree of freedom) tunable virtual impedance. However, a weak impedance matching for sharing of the frequency controlled power (FCP) (real power for $P-{\omega}$ droop, and reactive power for $Q-{\omega}$ droop) may result in FCP overshoots and even oscillations during load transients. This in turn results in VCP oscillations due to the strong coupling. In this paper, a 2-DOF tunable adaptive virtual impedance method considering impedance matching for both real and reactive power (IM-PQ) is proposed to improve the power sharing performance of MGs. The dynamic response is promoted by suppressing the coupled power oscillations and power overshoots while realizing accurate power sharing. In addition, the proposed power sharing controller has a better parametric adaptability. The stability and dynamic performances are analyzed with a small-signal state-space model. Simulation and experimental results are presented to investigate the validity of the proposed scheme.