• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.35-40
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• 2008

Investigation on immersion gold layers was carried out using TEM analysis for the purpose of understanding the defect of immersion gold layer. The immersion gold layers prepared with three different types of baths were observed. The results showed that the defect structure of immersion gold layer is strongly dependent on the types of gold baths. Spherical defects of average 10 nm size were located along the grain boundaries for the specimen formed at KAu$(CN)_2$ bath containing no reducing agent. In the case of the specimen processed at KAu$(CN)_2$ bath containing a reducing agent, the spherical defects of 5-10 nm size were distributed randomly in grains as well as at grain boundaries. However, such defects disappeared almost completely when $Na_{3}Au(SO_3)_2$ bath was used to fabricate an immersion gold.

• Journal of the Korean Society of Clothing and Textiles
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• v.34 no.7
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• pp.1162-1174
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• 2010

Excavated gold brocade, often shows signs of serious damage and contamination from environmental factors such as exposure to soil or human remains. Therefore, most of the conservation procedures are focused on the consolidation of the gold thread and on cleaning with water or organic solvents. Indiscreet cleaning using solvents could damage the gold leaf, which identifies the features of fabric. There is a need to develop cleaning protocols appropriate for relics through the careful analysis of the condition of the relics. This study finds the appropriate cleaning method for the excavated gold brocade. Four different cleaning methods, vacuum cleaning, kneaded rubber eraser cleaning, immersion wet cleaning, and absorption wet cleaning were applied to the excavated gold brocade. The degree of cleaning and damage were examined depending on the cleaning methods, changes to the physical condition (before and after cleaning) were also analyzed through the surface observation. Although immersion cleaning showed the best cleaning result, this method had a risk of damage to the gold thread. Absorption wet cleaning safely eliminated the various soluble contaminants and the rotten smell of relics. Kneaded rubber eraser was suitable for the excavated gold brocade fabric because it can be applied to selective parts, intentionally excluding some sensitive parts such as the gold thread. The vacuum cleaning method required special attention because of a possibility of suctioning off loosely attached gold leaf. Dual cleaning, the kneaded rubber eraser cleaning, followed by the absorption cleaning was the most effective method to preserve and clean excavated gold brocade.

• Journal of Surface Science and Engineering
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• v.50 no.3
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.

• Journal of Surface Science and Engineering
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• v.43 no.3
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• pp.142-147
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• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.55-61
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• 2010

An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.132-132
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• 2013

본 연구는 R/F-PCB(Rigid/Flexible Printed circuit Board)의 Cu Pattern에 최종 표면처리 방법으로 사용되는 ENIG(Electroless Ni/Immersion Gold) 공정을 대체하여 ECIG(Electroless Co/Immersion Gold)공정을 적용하고자 하는 것으로 무전해 니켈 도금의 장점인 고경도, 내마모성, 납땜성, 내식성을 가지면서 니켈 도금의 취약점인 연성을 개선한 도금액을 개발하고자 하였다. 개발된 도금액을 이용하여 Cu Pattern에 도금할 경우 일반 무전해 니켈 도금에서 나타나는 불량 원인 중 하나인 Space 부분에 도금이 되는 현상이 현저히 감소하였으며, 연성 또한 향상됨을 관찰할 수 있었다.

• Applied Microscopy
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• v.46 no.3
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• pp.167-169
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• 2016

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.1
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• pp.13-22
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• 1991

This study investigated the effects of surface treatment on the tensile bond strength of resinbonded prosthesis. The Rexillium III specimens were treated with $50{\mu}m\;Al_2O_3$ blasting. Type IV gold alloy specimens were treated with $400^{\circ}C$ heating and tin plating method. All specimens were bonded with MBAS composite resin cement and followed by immersion test into the $37^{\circ}C$ water bath for 7 days. The specimens were debonded in tension with an Instron machine and observed with SEM. The modes of failure were recorded also. The following conclusions were obtained : 1. The tensile bond strength decreased in following order. $50{\mu}m\;Al_2O_3$ basted Resillium III group, Type IV gold alloy group treated with $400^{\circ}C$ heat and tin plating type IV gold alloy group, and statistical significant differences were observed(p<0.05). 2. The tensile bond strength decreased in all groups after 7 days immersion test, but statistical significant differences were observed in Rexillium III specimens only. 3. The sharp and irregular surface were observed in Rexillium III, but $400^{\circ}C$ heat treated and tin plated groups had round and broad surface in SEM. 4. The models of bond failure were cohesive-adhesive failure mainly.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.77-77
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• 2014

솔더링과 와이어본딩이 가능한 ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) 를 중심으로 미세회로 기판에 적용할 수 있는 표면처리 및 공정 약품을 소개하고자 한다.

• Clean Technology
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• v.19 no.2
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• pp.84-89
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• 2013

The running blots between patterns during electroless nickel electroless palladium immersion gold (ENEPIG) surface finish of printed circuit board (PCB) are investigated and a proper solution is presented. Computational chemistry is first employed to understand the process and experiments are then designed to verify the proposed ideas. A $PdCl_2$ activator which has relatively weak chemical bonding to the epoxy resin is introduced to prevent the formation of palladium seeds on the epoxy resin and a couple of operational measures such as increasing HCl concentration and lowering the temperature of Pd activation process are executed to prevent a further hydrolysis of $PdCl_2$ to more stable $Pd(OH)_2$ in aqueous solution. Computational chemistry provides thermodynamic backgrounds for experiments and their results. This combined approach is expected to be very useful in the research of relevant processes.