• Communications of the Korean Mathematical Society
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• v.21 no.2
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• pp.293-320
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• 2006

Using calculus inequalities and embedding theorems in $R^1$, we establish $W^1_2$-estimates for the solutions of prey-predator population model with cross-diffusion and self-diffusion terms. Two cases are considered; (i) $d_1\;=\;d_2,\;{\alpha}_{12}\;=\;{\alpha}_{21}\;=\;0$, and (ii) $0\;<\;{\alpha}_{21}\;<\;8_{\alpha}_{11},\;0\;<\;{\alpha}_{12}\;<\;8_{\alpha}_{22}$. It is proved that solutions are bounded uniformly pointwise, and that the uniform bounds remain independent of the growth of the diffusion coefficient in the system. Also, convergence results are obtained when $t\;{\to}\;{\infty}$ via suitable Liapunov functionals.

• Bulletin of the Korean Chemical Society
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• v.12 no.6
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• pp.625-628
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• 1991

Using uniform flat plate-like samples of ZSM-5 zeolites, diffusion coefficients were measured volumetrically for the diffusion of xylene, ethyltoluene and diethylbenzene by direct measurement of sorption rate. Toluene disproportionation over H(100)-, K(72)-and Cs(82)-ZSM-5 at 773 K and toluene methylation, toluene ethylation and ethylbenzene ethylation over Cs(75)-ZSM-5 at 623 K were carried out. The selective formation of para xylene during the toluene disproportionation, presumably due to the increased tortuosity over Cs-ZSM-5, could be explained by smaller diffusion coefficient in Cs-ZSM-5 than in K-and H-ZSM-5. The para selectivity increased in the order; toluene methylation < toluene ethylation < ethylbenzene ethylation. As the chain length of the alkyl substituent in dialkylbenzenes is increased, the para selectivity of the products was improved. It may be attributed to the differences in the ratios of diffusion coefficient of para products to that of ortho ones. Diffusion coefficient of m-xylene was about 1 order of magnitude smaller than that of o-xylene.

• IE interfaces
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• v.25 no.3
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• pp.327-337
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• 2012

The development of information and communication technology affects people's life in social, cultural, and economic aspects. When this happens in public sector, it gives way more benefits than in private sector because of its high accessibility by public. Among the technological public services in Korea, call center service which provides administrative services by telephone and internet had been spotlighted as a new type of communication between people in demand and public service provider. Public call center service is expected to be continuously diffused in years due to its accessibility and convenience for public users. This study analyzes diffusion pattern of public call center service in Korea using Bass model and tries to suggest appropriate diffusion strategies. For practical cases, three most popular public call centers in Korea are analyzed in light of diffusion pattern and operating strategies. Our analyses identify that public call centers in Korea are facing continuous diffusion in two years and there exist certain strategies to efficiently expedite the diffusion.

• Journal of Advanced Research in Ocean Engineering
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• v.2 no.2
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• pp.48-60
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• 2016

Accurate simulation of free-surface wave flows around a ship is very important for better hull-form design. In this paper, a computational fluid dynamics (CFD) code which is based on the open source libraries, OpenFOAM, was developed to predict the wave patterns around a ship. Additional anti-diffusion source term for minimizing a numerical diffusion, which was caused by convection differencing scheme, was considered in the volume-fraction transport equation. The influence of the anti-diffusion source term was tested by applying it to free-surface wave flow around the Wigley and KCS model ships. In results, the wave patterns and hull wave profiles of the Wigley and KCS model ships for various anti-diffusion coefficients showed quite close patterns. While, the band width of the water volume-fraction values between 0.1 to 0.9 at the Wigley and KCS model hull surfaces was narrowed by considering the anti-diffusion term. From the results, anti-diffusion source term decreased free-surface smearing.

• Journal of the Korean Recycled Construction Resources Institute
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• v.3 no.1
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• pp.22-33
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• 2015

Chloride ions in RC (Reinforced Concrete) structures can cause very severe corrosion in reinforcement steel. It is generally informed that chloride penetration can be considerably accelerated by enlarged chloride diffusion due to cracks. These cracks play a role in main routes through which chloride ions penetrate into the concrete, and also lead to steel corrosion in RC structures exposed to chloride attack, such as port and ocean structures. In this paper, field survey including evaluation of crack and chloride concentration distribution in concrete is performed to investigate an effect of crack on chloride diffusion. The service life of cracked concrete exposed to the marine environmental condition is estimated considering the crack effect on chloride diffusion. For this purpose, diffusion coefficients in cracked concrete are obtained based on the field survey. Using the relationship between diffusion coefficients in the cracked concrete and the crack widths, service life of the cracked concrete is predicted in a probabilistic framework. A bimodal distribution with two peaks, consisting of a weighted sum of two normal distributions is introduced to describe chloride diffusion of the concrete wharf with crack.

• Korean Journal of Materials Research
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• v.12 no.12
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• pp.955-961
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• 2002

2.7vol%TiNi/6061 Al composites with TiNi shape memory alloy as reinforcement were fabricated by vacuum hot press. It was investigated by OM, SEM, EPMA and XRD analysis for the behavior of diffusion layer formation on various heat treatment condition. Thickness of diffusion layer was increased proportionally according to heat treatment time. The layer was formed by the mutual diffusion of TiNi and Al. The diffusion rate from TiNi fiber to Al matrix was faster than that of reverse diffusion path. The more diffused layer was formed in Al matrix. The diffusion at interface layer was consisted of $A1_3$Ti, $Al_3$Ni analyzed by EPMA, XRD results.

• Computers and Concrete
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• v.10 no.1
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• pp.79-93
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• 2012

This paper estimates theoretically the diffusion-reaction behaviour of sulfate ion in concrete caused by environmental sulfate attack. Based on Fick's second law and chemical reaction kinetics, a nonlinear and nonsteady diffusion-reaction equation of sulfate ion in concrete, in which the variable diffusion coefficient and the chemical reactions depleting sulfate ion concentration in concrete are considered, is proposed. The finite difference method is utilized to solve the diffusion-reaction equation of sulfate ion in concrete, and then it is used to simulate the diffusion-reaction process and the concentration distribution of sulfate ion in concrete. Afterwards, the experiments for measuring the sulfate ion concentration in concrete are carried out by using EDTA method to verify the proposal model, and results show that the proposed model is basically in agreement with the experimental results. Finally, Numerical example has been completed to investigate the diffusion-reaction behavior of sulfate ion in the concrete plate specimen immersed into sulfate solution.

• Journal of the Korean Recycled Construction Resources Institute
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• v.9 no.3
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• pp.375-382
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• 2021

Self-healing concrete is in the spotlight in that it can effectively extend the lifespan of concrete structures by healing cracks in the structure by themselves without additional repairing or retrofiting actions. Currently, self-healing concrete is a field that is being actively studied around the world, but since most studies focus on the improvement of healing performance, there is a lack of methods to rationally evaluate the self-healing performance of concrete. Although the gas diffusion test method has been developed for the use in the performance evaluation of self-healing concrete, it has revealed that for gas diffusion through the matrix affect the crack diffusion coefficients depending on the environmental conditions such as the saturation of the specimen, the temperature, and humidity during the experiment. Therefore, in this study, the method has been proposed to eliminate the influence of the matrix diffusion when calculating the crack diffusion coefficient. In addition, a pre-conditioning process was introduced to shorten the experimental time. As a result, the crack width could be estimated with an error level of less than 3% in the test time of about 20 minutes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.9
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• pp.108-115
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• 2018

Time is considered as an important factor to understand the diffusion behavior of single generation technology. However, multiple generation technology required additional factors in addition to time to understand the diffusion behavior. This study defined the diffusion path of multiple generation technology based on dimensions of 'time, price, and performance' after extracting price and technical performance factors and traced the diffusion path of semiconductor industry based on defined dimensions. The case study of semiconductor industry indicated that the diffusion path is determined maximizing the integrated area of price and performance. This study has theoretical implications in that it analyzed the diffusion behavior of multiple generation technology based on multiple dimensions and can forecast the diffusion behavior at matured as well as early stage technology. Also, this study has practical implications for R&D and marketing managers to understand time-to-market, exit time, and economical as well as technical requirements.