• 제목/요약/키워드: IT Package

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패키지 딜 방식의 해외 에너지자원 획득에 관한 플랜트EPC기업참여 촉진방안연구 (Promoting Policy to Involve Plant EPC Companies for Package Deal to Acquisite Overseas Energy Resources)

  • 김영균;허진혁;문승재;이재헌;유호선
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2009년도 하계학술발표대회 논문집
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    • pp.338-343
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    • 2009
  • Promoting policy to involve plant EPC companies for package deal has been studied to acquisite overseas energy resources. The effectiveness of the package deal with the plant EPC companies has not been successful because participation of the plant EPC companies is very low. It is difficult for the plant EPC companies to join the packaged deal due to the lack of the whole responsibility organization to support that plant EPC companies participate in package deal. The followings are suggested as the ways to promote the participation of the plant EPC companies for package deal in this study. 1) financial and policy support of governmen 2) specialization of the advanced countries.

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에너지자원획득을 위한 패키지 딜에서의 민관협력방안연구 (Public-Private Cooperation in the Package Deal for Overseas Energy Resources Acquisition)

  • 박대영;허진혁;이태수;문승재;이재헌;유호선
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 하계학술발표대회 논문집
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    • pp.1123-1127
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    • 2008
  • The public-private cooperation in package deal has been studied for the overseas energy resources acquisition. The effectiveness of the package deal has not been successful because the deal has led by the government organizations. It is difficult for the plant EPC companies to join the packaged deal due to the lack of the whole responsibility organization to support the participation of the package deal. The followings are suggested as the ways to strengthen of the public-private cooperation in this study. 1) the relevant public enterprise privatization 2) establishment of the joint model for leading the plant EPC companies to the package deal 3) establishment of the whole responsibility organization for the public-private cooperation.

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에너지자원획득을 위한 패키지딜 적용시 민관협력 강화 방안 (Public-Private Cooperation in the Package Deal for Overseas Energy Resources Acquisition)

  • 박대영;허진혁;이태구;문승재;이재헌;유호선
    • 플랜트 저널
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    • 제4권2호
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    • pp.73-78
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    • 2008
  • The public-private cooperation in package deal has been studied for the overseas energy resources acquisition. The effectiveness of the package deal has not been successful because the deal has led by the government organizations. It is difficult for the plant EPC companies to join the packaged deal due to the lack of the whole responsibility organization to support the participation of the package deal. The followings are suggested as the ways to strengthen of the public-private cooperation in this study. 1) the relevant public enterprise privatization 2) establishment of the joint model for leading the plant EPC companies to the package deal 3) establishment of the whole responsibility organization for the public-private cooperation.

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LED Driver ICs칩의 소형화를 위한 Chip on Chip 기술에 관한 연구 (Study on Chip on Chip Technology for Minimizing LED Driver ICs)

  • 강이구
    • 한국전기전자재료학회논문지
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    • 제29권3호
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    • pp.131-134
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

실리콘 리플렉터를 적용한 고효율 고출력 LED 패키지 개발 (Development of High Efficiency and High Power LED Package for Applying Silicone-Reflector)

  • 정희석;이영식;이정근;강한림;황명근
    • 조명전기설비학회논문지
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    • 제27권9호
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    • pp.1-5
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    • 2013
  • We developed high-efficient 6W-LED package with simple structure by applying Heat Slug and silicone-reflector. LED package was manufactured in $8.5{\times}8.5mm$ sized multi-chip structure having thickness of $500{\mu}m$ achieved by bonding silicon-reflector with prepreg on top of the plate after implementing the reflector placed on copper substrate Half Etching by thickness of $200{\mu}m$. The luminous flux, luminous efficacy, correlated color temperature, color rendering index and thermal resistance of developed LED was evaluated, and it verified the application of products by applying it to 120W-LED road luminaires through simulation. The luminous efficacy of LED package reached over 130lm/W, and it is possible to be manufactured into 120W-LED road luminaires using 18 packages. In addition, the simulation results showed average of horizontal illuminance and overall illuminance uniformity that is suitable for three-lane road.

인트라넷을 활용한 멀티미디어 학내망 구축 솔류션의 개발 (Development of Multimedia Education-Network Construction Solution Based on Intranet)

  • 고일석
    • 한국시뮬레이션학회논문지
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    • 제9권4호
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    • pp.59-66
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    • 2000
  • Computer has been many effect in diverse field of mankind and it brings development of educational field like CAI. Also development of internet and If bring rapid growth of cyber school and it is required multimedia environment and efficient cyber school construction package for efficient management. In this paper we develop multimedia education-network construction package for cyber school using intranet. It will reduce the cost of management and construction for small and medium size cyber school, and it will raise efficiency of cyber school.

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A Study on ERP Package Assessment Model in Business Firms

  • Lee, Sun-Kyu;Yim, Ki-Heung
    • 한국디지털정책학회:학술대회논문집
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    • 한국디지털정책학회 2004년도 International Conference on Digital Policy & Management
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    • pp.343-358
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    • 2004
  • Many IT specialists say that ERP (Enterprise Resource Planning) is the best way to manage resources in enterprise effectively. Actually lots of companies are using ERP solutions in the hope of getting competitiveness and employing global standard business practice. Wishing to take advantage of ERP S/W, companies have a preference for purchasing it and outsourcing ERP project. This paper is focusing on ERP Package assessment model in business firms. This paper finds out what differences there are in purchasing ERP S/W for organization characteristics and building characteristics, and suggests some guidelines of S/W development to venders. The results would be strong implications for ERP vendors. Especially this paper identify what the reasons and the checkpoints are when firms introduce ERP S/W. To do this, this paper used empirical data obtained from companies in South Korea and analyzed it using statistical software.

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A Study on ERP package Assessment Model in Business Firms

  • 임기흥
    • 디지털융복합연구
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    • 제2권2호
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    • pp.101-118
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    • 2004
  • Many IT specialists say that ERP (Enterprise Resource Planning) is the best way to manage resources in enterprise effectively Lots of companies are using ERP solutions in the hope of getting competitiveness and employing global standard business practice. Wishing to take advantage of ERP S/W, companies have a preference for purchasing it and outsourcing ERP project. This paper focuses on ERP Package assessment model in business firms. This paper finds out what differences there are in purchasing ERP S/W for organization characteristics and building characteristics, and suggests some guidelines of S/W development to vendors. The results would be strong implications for ERP vendors. Especially this paper identifies what the reasons and the checkpoints are when firms introduce ERP S/W. To do this, this paper uses empirical data obtained from companies in South Korea and analyzes it using statistical software.

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수치해석을 이용한 임베딩 패키지 솔더 조인트의 신뢰성에 미치는 에이징 효과 연구 (Study on Effects of Solder Joint aging on the Reliability of Embedded Package Solder Joints using Numerical analysis)

  • 조승현;장준영;고영배
    • 마이크로전자및패키징학회지
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    • 제25권1호
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    • pp.17-22
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    • 2018
  • 본 논문에서는 임베딩 패키지의 솔더 조인트 신뢰성에 미치는 솔더 조인트의 에이징 효과를 유한요소법에 의한 수치해석을 통해 연구하였다. SAC305 솔더 조인트의 에이징 시간은 0, 60, 180 일이 적용되었고 신뢰성 분석을 위해 패키지 휨, ECS(Equivalent Creep Strain) 및 TSED(Total Strain Energy Density)이 분석되었다. 연구결과에 따르면 임베딩 패키지의 휨이 비임베딩 패키지에 비해 감소하여 임베딩 패키지내 솔더 접합부의 신뢰성이 높을 것으로 예측되었다. 또한, 에이징 시간이 길수록 임베디드 패키지의 휨이 감소하지만 솔더 조인트의 신뢰성 수명도 감소할 것으로 분석되었다.

알루미늄 양극산화를 사용한 LED COB 패키지 (ED COB Package Using Aluminum Anodization)

  • 김문정
    • 한국산학기술학회논문지
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    • 제13권10호
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    • pp.4757-4761
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    • 2012
  • 알루미늄 기판 및 양극산화 공정을 사용하여 LED Chip on Board(COB) 패키지를 제작하였다. 선택적 양극산화 공정을 적용하여 알루미늄 기판 상에 알루미나를 형성하고 이를 COB 패키지 절연층으로 사용하였으며, 비아홀 내부가 충진된 구조의 Thermal Via를 구현하였다. 패키지 기판 종류에 따른 열저항 및 발광효율 변화를 파악하기 위해 알루미늄 기판과 알루미나 기판을 제작하고 이를 각각 비교 분석하였다. Thermal Via가 적용된 알루미늄 기판이 51%의 열저항 개선 및 14%의 발광효율 향상 특성을 보여주었다. 이러한 결과는 선택적 양극산화 공정 및 Thermal Via 구조적용으로 COB 패키지의 방열 특성이 향상되었음을 의미한다. 또한 동일한 전력 소모시 LED 칩 개수에 따른 COB 패키지의 열저항 및 발광효율 변화를 분석함으로써 다수 칩의 효율적인 배치가 열저항 및 발광효율을 증가시킬 수 있음을 확인하였다.