• The monthly packaging world
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• s.101
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• pp.164-167
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• 2001

• Korean Journal of Adult Nursing
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• v.13 no.3
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• pp.385-396
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• 2001

The purpose of this study is to present an actual example for procedures for developing a PBL package based on philosophical backgrounds derived from Problem-based learning. To perform a systemic study on the operations of an intergrated curricula under multidisciplines, a research team made up of several professors with different academic backgrounds was formed. Among the four situations for the patients with perception-adjustment disorder, especially a procedure for the development of PBL package which can be used in the emergency room situation has been proposed. The little(2000)'s PBL package model has been applied for this study. Tha package includes course objectives, learning objectives, concept map, situation scenario, tutor guide, and evaluation method. It is believed that learning objectives achievement procedures designed as a part of a problem-based learning package development procedures for the nursing of patients with perception-adjustment can be achieved at the same level as the learning objectives for the science of nursing founded by the Korean Nurses Association.

• Journal of Radiation Protection and Research
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• v.22 no.4
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• pp.251-261
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• 1997

A package to transport the high level radioactive materials is required to withstand the hypothetical accident conditions as well as normal transport conditions according to IAEA standards and domestic regulations. The regulations require that the package should maintain the shielding, thermal and structural integrities to release no radioactive material. In general, safety evaluation of packages is performed by experimental methods using scale model and/or analytical methods using computer codes. This paper presents the safety evaluation of package to transport the radioisotopes produced in the HANARO to the radioisotope production facility. Radiation shielding, thermal and structural analyses were peformed using the computer codes. It has been verified that the package is safe under hypothetical accident conditions as well as normal transport conditions.

• The KIPS Transactions:PartD
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• v.9D no.4
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• pp.629-638
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• 2002

As the application area of software grows bigger and the importance of software quality increases, software quality evaluation method is also getting a lot of attention. To evaluate the software quality properly, we need an objective and concrete evaluation mechanism. In general, practitioners customize the international standards to their own needs for this purpose. Package software documents plat an important role in software quality evaluation because it provides the information that helps customers use the software effectively and conveniently. h great deal of efforts has been made in terms of international standards for documentation and documentation process. However, those international standards are too abstract to be applied directly to domestic software packages. In this paper, we developed a guidelines and checklists for writing and evaluating package software documents. Our research basically followed ISO 12119, ISO 9127 and some related research results. Also we proved the effectiveness of this research through actual tests with package softwares.

• Journal of Korean Institute of Architectural Sustainable Environment and Building Systems
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• v.12 no.6
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• pp.543-556
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• 2018

Zero energy building was attended for energy consumption minimization by the energy saving technology about building heating and cooling energy consumption and the renewable energy production facility. So the government has supported the zero energy building supply for decreasing green gas emissions. The study about inventory of zero energy building has many proceeding. That inventory need the information of material and equipment. So information of material and equipment about zero energy building must be included for the zero energy building realization. Actually the database of zero energy building inventory construction through the inventory established studies has difficult because the database need many information. In this study, author proposed the test methods and performance reference for upload at inventory. It was constructed to material - module - package. Also the author analyzed the construction of the technical package for zero energy building. The author separated performance category to the energy performance for energy analysis and other performance for confirmed the durability, stability and etc. This performance category proposed the table. The test methods of material and equipment in the passive package and active package proposed to the international standard and korea standard basically korea standard. Also the performance reference was proposed to korea legal standard and various standard by this study results. And the authors proposed the table of performance value, test methods, performance reference. By result of this study, the test methods and performance reference will be used the basic data for inventory of zero energy building.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of Korea Multimedia Society
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• v.9 no.4
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• pp.490-504
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• 2006

It needs to control each objects on various platform and transmit multimedia data to multiple receivers which are for developing a multimedia service with multimedia live streaming in a distributed environment. In this paper, we present a DLS (Distributed Live Streaming) package which support l:N multimedia live streaming in a distributed environment. Also, it has extended RMI which is a distributed object technology and JMF using multimedia transmission/processing. A java-based DLS package has been designed to separate a transmission and a control for more efficient distributed processing. It is possible to apply in development of multimedia service supported 1:N transmission and runned independently to any platform.

• Journal of the East Asian Society of Dietary Life
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• v.16 no.3
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• pp.242-250
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• 2006

The purpose of this study was to identify tourist product factor combinations which confer the highest utility to tourists and to establish the relative importance of factors in terms of their contribution to total utility across gender. Among 250 questionnaires, 230 questionnaires were utilized for the analysis. $X^2$ analysis, Conjoint model, Max. Utility model, BTL model, Logit model, K-means cluster analysis, and one-way anova analysis were used for this study. The findings from this study were as follows. First, the Pearson's R and Kendall's tau statistics showed that the model fitted the data well across gender. Second, it was found that total respondents and three clusters regarded taste price as the very important factor across gender. Third, it was found that the male and female tourists most preferred product with light red color, shaped package, and highly pungent taste sold at a cheap price in factory. Fourth, it was found that the male tourists most preferred simulation product with light red color, shaped package, and highly pungent taste sold at a cheap price in factory. The female tourists most preferred simulation product with light red color, shaped package, and mild taste sold at a cheap price in factory. Finally, the results of the study provide some insights into the types of effective product designs that can be successfully developed by marketers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.