• Title/Summary/Keyword: IT Package

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The Effect of Package Gloss on Purchase Intention: Mediating Role of Perceived Corporate Eco-friendliness and Perceived Quality (패키지 광택이 제품 구매의도에 미치는 영향: 기업 친환경성 인식과 품질인식의 매개효과를 중심으로)

  • Hye Bin Rim;Ga Hyeon Lim;Eun Yeong Doh;So-Dam Jang;Byung-Kwan Lee
    • Science of Emotion and Sensibility
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    • v.25 no.4
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    • pp.53-62
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    • 2022
  • This study was conducted to investigate the effects of the gloss of a product's packaging on purchase intention and the mediating role of perceived corporate eco-friendliness and perceived quality in food area. The participants were randomly assigned to product package condition (glossy vs. matte) and after observing ketchup and potato chips, they responded to questions on about perceived corporate eco-friendliness, perceived quality, and purchase intention. The participants reported their opinion that companies that manufactured matte package products would likely use more organic ingredients and would be more eco-friendly than companies that manufactured glossy package products. The more the participants perceived a company to be eco-friendly, the better they evaluated the company's product quality and the higher their purchase intention. This study has theoretical and practical implications, in that it extends the study of the product package in relation to its effect on corporate image, and it proposes a practical use of matte product package for improving the eco-friendly image of the company. Limitations and further research were also discussed.

Reliability Issue in LOC Packages

  • Lee, Seong-Min
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1995.11a
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    • pp.3-3
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    • 1995
  • Plastic IC encapsulation utilizing lead on chip(LOC) die attach technique allows higher device density per unit package area, and faster current speed and easter leadframe design. Nevertheless, since the top surface of the chip is directly attached to the area of the leadframe with a double-sided adhesive tape in the LOC package, it tends to be easily damaged by the leadframe, leading to limitation in its utilization. In this work, it is detailed how the damage of the chip surface occurs, and it is influenced and improved by the LOC construct.

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Image Processing Software Package(IMAPRO) for IBM PC VGA (IBM PC VGA용 화상처리 소프트웨어(IMAPRO))

  • 徐在榮;智光薰
    • Korean Journal of Remote Sensing
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    • v.8 no.1
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    • pp.59-69
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    • 1992
  • The IMAPRO sotfware package was mainly focused to provide an algorithm which is capable of displaying various color composite images on IBM PC, VGA(Video Graphic Array) card with no special hardware. It displays the false color images using a low-cost eight-bit place refresh buffer. This produces similar quality to the one obtained from image board with three eight-bit plane. Also, it provides user friendly menu driven method for the user who are not familier with technical knowladge of image processing. It may prove useful for universities, institute and private company where expensive hardware is not available.

Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates (박형 기판을 사용한 Package-on-Package용 상부 패키지와 하부 패키지의 Warpage 분석)

  • Park, D.H.;Shin, S.J.;Ahn, S.G.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.2
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    • pp.61-68
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    • 2015
  • Warpage analysis has been performed for top and bottom packages of thin package-on-packages processed with different epoxy molding compounds (EMCs). Warpage deviation was measured for packages molded with the same EMCs and also the warpage deviations of top and bottom substrates themselves were characterized in order to identify the major factor causing the package warpage. For the top and bottom packages processed with thin substrates, the warpage deviation of the substrates was large, which made it difficult to figure out the effect of EMC properties on the package warpage. Top packages, where the molding area of $13mm{\times}13mm$ covered the most of the substrate area ($14mm{\times}14mm$), exhibited similar warpage behavior with changing the temperature. On the other hand, bottom packages, where the molding area was only $8mm{\times}8mm$, exhibited the complex warpage behavior due to simultaneous occurrence of (+) and (-) warpages on the same package. Accordingly, the bottom packages showed dissimilar temperature-warpage behavior even being processed with the same EMCs.

A study on the liquor package design of international competitive advantage - Focused on Soju and Sake - (국제 경쟁력을 위한 술 포장디자인 연구 - 국내소주 및 일본 Sake 중심으로 -)

  • 장욱선
    • Archives of design research
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    • v.16 no.3
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    • pp.151-160
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    • 2003
  • Packages have been used for a wide variety of purposes, for protection, for display, for transportation of goods, or for keeping personal belongings. According to the demands of society and the times, liquor packages have been specialized and have appeared in almost every shape and size without restriction to cine particular type of material. In spite of its rapid development and wide application in our society, liquor package design has rarely been considered as a subject of comprehensive study. Majoring in package design, I have become especially interested in the area of liquor package design. I would like to explore liquor package design from several aspects. With the advent of new market and the rise of a new consumer society, advertising and mass media have expanded rapidly. While convenience of use is not a major issue, serving size certainly are quality, appeal of heritage and health concerns. Heritage is a major consumer appeal in Whisky, Beer, Wine and spirits. Designers have drawn heavily on the tradition of alcoholic products, have used type and graphics to create the illusion of heritage for new products. A sidelight to the heritage aspect of spirits package is the evolution of outer boxes for international liquors. International liquors package design illustrated the past and current themes. The design is contemporary and spare. Colored panels correlated to the liquor flavor used on clean white, black, gold boxes. While this research does not deny the impact of structural innovation and convenience package design , it does deny the existence of a graphic plateau. It is assumed therefore, that development in technology can facilitate communication between East and West. This can be accomplished because as containers of products are used in social setting, their form will gradually apply strong influence to the need for economical, easily handled, easily utilized packaging. Typically, ethnic package designs are those packages containing products which are prepared and marketed to a category of people who are prepared and marketed to a culture traits. They are liquor products sold in the metropolitan New York area which are marketed specially to Asians, Hispanics, or Eurpean population. These cultural groups share numerous traits including religion, language, dietary habits and traditional drinking styles. Therefore, the products which are familiar or common in their native countries are often imported or marketed there to serve them. These packages and products are frequently found on the shelves of supermarkets in predominantly ethnic areas. That is Korea, Japan if packaging is correctly design it would appeal to the American market. My research is that oriental beverage -Soju is good example of this precept. Assumedly, there must be a degree of subjectivity since it is a mean in which the consumers can relate to its advertising. This degree to relate and identify is the degree to which the package will be remembered and purchased. Subjectivity is intimately related to purchases since there is no such thing as a rational purchase in a society that operates on mass consumption. It is essential that packages become more personal human, entertaining, and more like advertising in order to maximize merchandising potential.

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Interfacial Fracture Behavior of Epoxy Adhesives for Electronic Components (전자부품용 에폭시 접착제의 계면 파괴 거동 연구)

  • Kang, Byoung-Un
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.3
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    • pp.1479-1487
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    • 2011
  • In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

Wilting Phenomena and Vitamin C Content of Spinach during Consignment (시금치의 유통중 조위(凋萎)현상과 Vitamin C의 함량)

  • Kim, Sang-Ock
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.14 no.1
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    • pp.23-26
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    • 1985
  • This experiment was investigated on weight loss, vitamin C content, and its relationship to evaluate visual quality during spinach consignment from a viewpoint of consumer. Vitamin C content of spinach leaf, 35.38mg% fresh weight, was 3 times higher than those of stem. Under $20^{\circ}C$ of spinach consignment, the spinach was edible in a half day of unpackage and 3 days with package. However, under $10^{\circ}C$ of spinach consignment, it was good through 6-7 days with unpackged and 10 days with package. Weight and vitamin C content of stem and leaf in spinach during consignment were closely related to the temperature condition at $20^{\circ}C$ than at $10^{\circ}C$ in both of package and unpackage. The regression equation of relationship between loss(X) and vitamin C loss(Y) of spinach, during consignment with Package and unpackage at $20^{\circ}C$ and $10^{\circ}C$ was Y=21.30X+40.32(r=0.69.)

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A Study on Design of High Luminance Hybrid LED Package and Ultra-fine Machining of Optical Pattern (고효율 Hybrid LED 패키지 설계 및 초정밀 광학패턴 가공에 관한 연구)

  • Jeon, E.C.;Je, T.J.;Whang, K.H.
    • Transactions of Materials Processing
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    • v.19 no.8
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    • pp.474-479
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    • 2010
  • Newly suggested hybrid LED package can reduce the number of LED processes and enhance light efficacy in virtue of its integrated optical patterns. Square-type pyramid pattern was chosen for the integrated optical pattern in this study, and it was proved that the pattern enhances illuminance about three times and luminance about two and half times by optical simulation. Square-type pyramid patterns of 0.02mm height and 0.04mm pitch were successively machined on a copper mold which is necessary for imprinting the integrated pattern. Hybrid LED package with integrated optical pattern will be manufactured with ultra-fine machined mold in future study.

One Package DC/DC Converter for Mobile Phone's Sub-OLED (모바일 폰 외부 OLED용 DC/DC 컨버터 패키지 개발)

  • Oh Se-Wook;Kim Seong-Il
    • Proceedings of the KIPE Conference
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    • 2004.07a
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    • pp.321-324
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    • 2004
  • This paper presents a package IC containing some components of DC/DC converter block for mobile phone's sub OLED(Organic Light Emitting Display). Package IC contains a load switch, a control IC, a diode, a switch for on/off operation, and a switch for changing output voltage. It operates with switching frequency of 100kHz, within the range of input voltage, $3.2V\~5.5V$. Duty ratio can be changed up to $93\%$, and maximum power efficiency is $85\%$. This package IC is loaded onto three model of 1.2W mobile phone's sub-OLED.

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