• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.45-49
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• 2006

In this paper, a new method that monitors the quantity of particles using ion-counter in vacuum environment is introduced. In-situ particle monitoring (ISPM) system is composed by Gerdien type ion-counter (house-made), DC power supply and electrometer. The ion-counter applied by positive voltage detects only positive charged particles. Therefore the particles to be detected should be in known charge state for further data analysis. ion-counter is installed at the exhaust line of process equipment where the pressure loss is structurally low. ISPM system performance has been verified with SMPS (Scanning Mobility Particle Sizer) system. The correlation coefficient is above 0.98 at the particle size range of $20{\sim}300nm$ in diameter with identified charge distribution under $0.1{\sim}10.0$ Torr.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.255-258
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• 2006

In this paper, the new method which is monitoring quantity of particles using by ion-counter has been developed. ISPM system is composed by Gerdien type ion-counter (house-made), DC power supply and electrometer. Ion-counter applied positive voltage could detect only positive charged particles. Therefore charged particles to Boltzmann equilibrium distribution or to some identified charge distribution can be detected by ion-counter. Ion-counter could install on the exhaust line of process equipment since pressure loss is structurally low. ISPM system has been certified by comparison with the result of SMPS (Scanning Mobility Particle Sizer) system. The relation coefficiency is above 0.98 about $20{\sim}300nm$ particles with identified charge distribution under $0.1{\sim}10.0$ Torr.

• Particle and aerosol research
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• v.6 no.3
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• pp.139-145
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• 2010

In this study, we investigated the particle formation during the deposition of borophosphosilicate glass (BPSG) and phosphosilicate glass (PSG) films in thermal chemical vapor deposition reactor using in-situ particle monitor (ISPM) and particle beam mass spectrometer (PBMS) which installed in the reactor exhaust line. The particle current and number count are monitored at set-up, stabilize, deposition, purge and pumping process step in real-time. The particle number distribution at stabilize step was measured using PBMS and compared with SEM image data. The PBMS and SEM analysis data shows the 110 nm and 80 nm of mode diameter for BPSG and PSG process, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.261-261
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• 2010

본 연구에서는 PBMS (Particle Beam Mass Spectrometer)와 ISPM (In-Situ Particle Monitor)을 연계하여 BPSG (Borophosphosilicate Glass) 및 PSG (Phosphosilicate Glass) 박막 증착을 위한 CVD (chemical vapor deposition) 공정 중 발생하는 오염입자 발생특성에 대해 비교 평가하였다. 소스는 TEB (Triethylborate), TEPO (Triethylphosphate) 및 TEOS (Tetraethoxysilane)를 사용하였고, 운반가스 및 반응가스로 He과 $O_2$ 및 $O_3$를 사용하였다. 증착온도와 압력은 각각 $450^{\circ}C$, 200 Torr 이었다. 반응기의 배기라인에 PBMS와 ISPM을 설치하고 500 nm 이하의 입자에 대해 공정단계별 시간에 따른 모니터링 결과 전 공정에 걸쳐 동일한 패턴의 입자발생분포를 보였으며, 특히 PBMS의 경우 ISPM의 입자측정한계인 260 nm 이하의 입자크기도 측정할 수 있었다. 입자발생이 안정적으로 일어나는 증착공정 중 PBMS를 통하여 입자크기를 측정한 결과 BPSG의 경우 약 110 nm, PSG의 경우 약 80 nm의 분포를 나타내었다. 이를 통해 TEB 소스가 배제된 PSG의 경우 BPSG의 경우보다 입자의 성장이 지체됨을 확인하였다. 측정에 대한 신뢰성을 확보하기 위해 PBMS 내의 TEM (Transmission Electron Microscopy) grid를 이용하여 입자를 샘플링 하였고, TEM 분석을 실시한 결과 PBMS 측정결과와 잘 일치하였다. 또한 EDS (Energy Dispersive Spectroscopy) 분석을 통하여 입자성분에 대해 검증하였다.

• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.178-180
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• 2002

In this Paper, we conducted a experimental study to measure a particle size distribution and mass spectrum with the special instrument such as ISPM and Q-MS. Also, we set up a total measuring system for monitoring the particle in the process chamber.

• The monthly packaging world
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• s.200
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• pp.126-131
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• 2009

뉴질랜드는 11월 1일자로 목재포장재에 대한 검역요건을 국제기준 ISPM No. 15 개정 채택에 맞게 개정했다. 특별요건으로 규제 병해충, 토양 등 부착물, 수피 등이 없어야 하며 요건에 따라 소독처리되고 증명되어야한다. 본 고에서는 개정된 뉴질랜드 목재포장재 검역 요건에 대해 살펴본다.

• Journal of the Korean Vacuum Society
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• v.20 no.2
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• pp.86-92
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• 2011

The diagnosis studies of the process of chemical vapor deposition were carried out by using in-situ particle monitor (ISPM) and self-plasma optical emission spectroscopy (SPOES). We used the two kinds of equipments such as the silicon plasma enhanced chemical vapor deposition system with silane gas and the borophosphosilicate glass depositon system for monitoring. Using two sensors, we tried to verify the diagnostic and in-situ sensing ability of by-product gases and contaminant particles at the deposition and cleaning steps. The processes were controlled as a function of precess temperature, operating pressure, plasma power, etc. and two sensors were installed at the exhaust line and contiguous with each other. the correlation of data (by-product species and particles) measured by sensors were also investigated.

• Journal of the Korean Wood Science and Technology
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• v.36 no.6
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• pp.41-48
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• 2008

The required energy for the heat treatment of pine log was evaluated in this study. A proper heat treatment of pine log infected by pinewood nematode (Bursaphelenchus xylophilus) can prevent spreading of the infection by pinewood nematode and make the infected pinewood valuable again. The FAO (Food and Agriculture Organization of the United Nations) heat treatment standard for various types of infected wood for which a heat treatment of the core part of the wood is necessary is 30 minutes at $56^{\circ}C$, taking into account the international standards for phytosanitary measures (ISPM No. 15). In this study, the energy consumption during the heat treatment was separated into two kinds of energy, initial energy for heating kiln drier and to reach set point temperature and relative humidity and the required energy supplementing heat loss. The initial required energy per unit time is greater than that during the treatment. The energy consumption per unit time varied little during the heat treatment. As a result, the set point relative humidity with set dry bulb temperature and density of wood dependent on moisture content are very important factors to change energy consumption in the experiment. The heat treatment at higher temperature and higher humidity levels requires more energy consumption but less treatment time. It is expected that a more effective energy program could be planed for the heat treatment of pine log through this study.

• Journal of the Korean Wood Science and Technology
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• v.35 no.6
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• pp.50-56
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• 2007

FAO standard for heat sterilization of wood, International standards for phytosanitary measures (ISPM) No.15, must meet heat-treated wood core temperature to be higher than $56^{\circ}C$ and keep the temperature for more than 30 minutes. This study was carried out to analyze the heat treatment characteristics of domestic pinewood sterilized with the FAO standard. To enhance the effectiveness of heat treatment process in mountainous district energy consumption and time required to reach target temperature were evaluated at various temperature and relative humidity conditions and moisture contents of wood. Heat-treatment of high temperature and high humidity reduced the required heating time. Lower humidity levels at same temperature reduced energy consumption per unit time. However, lower humidity levels could not reduce total energy consumption greatly because longer treatment time was required at that condition. It is necessary to estimate energy consumption and predict treatment time in dynamic heating and cooling situations, because it frequently happens not to meet optimum treatment condition due to poor surrounding climates and operation performance of heat treatment facility in real field.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.43-43
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• 2010

반도체 및 디스플레이의 진공부품은 알루미늄 모제에 전해연마법(electrolytic polishing), 양극산화피막법(anodizing), 플라즈마 용사법(plasma spray) 등을 사용하여 $Al_2O_3$ 피막을 성장시켜 사용되고 있다. 반도체 제조공정 중 30~40% 이상의 비중을 차지하는 식각(etching) 및 증착(deposition) 공정의 대부분 은 플라즈마에 의해 화학적, 물리적 침식이 발생하여 피막에 손상을 일으켜 피막이 깨지거나 박리되면서 다량의 particle을 생성함으로써 생산수율에도 문제를 야기 시킨다. 본 연구에서는 이러한 진공부품의 하나인 etcher용 상부전극을 양극산화피막법(Anodizing)으로 $Al_2O_3$ 피막을 성장시킨 샘플을 제작하여 플라즈마 처리에 따른 내전압, 식각율, 표면 미세구조의 변화를 관찰하였고 이를 종합적으로 고려하여 etcher용 상부전극의 Life Time 평가 방법을 연구하였다. 이러한 실험을 통해 플라즈마 처리 후 피막에 크랙이 발생되는 것을 확인할 수 있었고 피막의 손상으로 전기적 특성이 감소되는 것을 확인할 수 있었다. 또한 플라즈마 처리 중 ISPM 장비를 이용하여 플라즈마 공정에서 발생하는 오염입자를 실시간으로 측정할 수 있는 방법을 연구하였다. 이러한 결과를 이용하여 진공공정에서 사용되는 코팅부품이 플라즈마에 의한 손상정도를 정량화 하고 etcher용 상부전극의 Life Time 평가 방법을 개발하여 부품 양산업체의 진공장비용 코팅부품의 개발 신뢰성 향상이 가능할 것으로 기대된다.