• Title/Summary/Keyword: IR Camera

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A Study on Heat Generation and Machining Accuracy According to Material of Ultra-precision Machining (초정밀가공의 재질에 따른 발열과 가공정밀도에 관한 연구)

  • Lee, Gyung-Il;Kim, Jae-Yeol
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.1
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    • pp.63-68
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    • 2018
  • At present, ultra-precision cutting technology has been studied in Korean research institutes, focusing on development of ultra-precision cutting tool technology and ultra-precision control engineering. However, the developed technologies are still far behind advanced countries. It focuses on metals including aluminum, copper and nickel, and nonmetals including plastics, silicone and germanium which require high precision while using a lathe. It is hard to implement high precision by grinding the aforementioned materials. To address the issue, the ultra-precision cutting technology has been developing by using ultra-precision machine tools very accurate and strong, and diamond tools highly abrasion-resistant. To address this issue, this study aims to conduct ultra-precision cutting by using ECTS (Error Compensation Tool Servo) to improve motion precision of elements and components, and compensate for motion errors in real time. An IR camera is used for analyzing cutting accuracy differences depending on the heat generated in diamond tools in cutting to examine the heat generated in cutting to study cutting accuracy depending on generated heat.

Wide-Field Near-IR Photometric Study for Spatial Distribution of Stars around Globular Clusters in the Galactic Bulge

  • Chang, Cho-Rhong;Chun, Sang-Hyun;Han, Mi-Hwa;Jung, Mi-Young;Lim, Dong-Wook;Sohn, Young-Jong
    • Bulletin of the Korean Space Science Society
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    • 2009.10a
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    • pp.29.4-30
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    • 2009
  • Extra-tidal feature of the globular clusters such as tidal tails and halos can be a crucial evidence of the merging scenario of the Galaxy formation in the dynamical point of view. To search for such an extra-tidal feature of globular clusters located in the Galactic bulge(RGC<3kpc), we obtained wide-field near-infrared JHKs images of 6 metal-poor ([Fe/H]<-1.0) clusters and 3 metal-rich ([Fe/H]>-1.0) clusters. Observations were carried out using IRSF 1.4m telescope and SIRIUS near-infrared camera, during 2006~2007. The obtained images have a total maximum field-of-view of ~ $21'\times 21'$. To select clusters' member stars and minimize the field star contaminations, we applied CMD masking algorithm. Smoothed surface density contour maps with selected stars for each cluster show overdensity features around the tidal radius and beyond. Also, radial surface density profiles within the tidal radius of the clusters show an overdensity feature as a change of slope of the radial profile. The results add further observational constraints of the formation of the Galactic bulge.

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Heating Behavior of Silicon Carbide Fiber Mat under Microwave

  • Khishigbayar, Khos-Erdene;Seo, Jung-Min;Cho, Kwang-Youn
    • Journal of the Korean Ceramic Society
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    • v.53 no.6
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    • pp.707-711
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    • 2016
  • A small diameter of SiC fiber mat can produce much higher heat under microwave irradiation than the other types of SiC materials. Fabrication of high strength SiC fiber consists of iodine vapor curing on polycarbosilane precursor and heat treatment process. The curing stage of polycarbosilane fiber was maintained at $150-200^{\circ}C$ in a vacuum condition under the iodine vapor to fabricate a high thermal radiation SiC fiber. The structure and morphology of the fibers were characterized by Fourier transform infrared (FTIR) spectroscopy, thermogravimetric analysis (TG) and scanning electron microscopy (SEM). In this study, the thermal properties of SiC fiber mats under microwave have been analyzed with an IR thermal camera and its image analyzer. The prepared SiC fiber mats radiated high temperature with extremely high heating rate up to $1100^{\circ}C$ in 30 seconds. The fabricated SiC fiber mats were not oxidized after the heat radiation process under the microwave irradiation.

Direct Bonding Characteristics of 2" 3C-SiC Wafers for Harsh Environment MEMS Applications (극한 환경 MEMS용 2" 3C-SiC기판의 직접접합 특성)

  • 정귀상
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.8
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    • pp.700-704
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    • 2003
  • This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 % and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module

  • Chuluunbaatar, Zorigt;Kim, Nam Young
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.39C no.3
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    • pp.234-238
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    • 2014
  • Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

Properties of Temperature and Brightness Applied on Frequency in Electrodeless Fluorescent Lamp (무전극 형광램프의 주파수 변화에 따른 온도 및 광속 특성)

  • Lee, Joo-Ho;Choi, Gi-Seung;Kim, Nam-Goon;Park, Noh-Joon;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1733-1734
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    • 2006
  • In recent, it became necessary to develop the technology about electrodeless fluorescent lamp according to demand of the electrodeless fluorescent lamp system that used higher efficiency and advantage of long lifetime. Inductively coupled plasma is commonly used for electrodeless lamp due to its ease of plasma generation. An electric power efficiency of electrodeless fluorescent lamp has big relative property of gas in lamp, gas pressure, lamp formation, ingredients of magnetic substance and shape and action frequency etc. We used magnetic substance that open self-examination material of electrodeless fluorescent lamp antenna. Ferrite that is used in this experiment was Mn-Zn type. We have examined temperature and flux characteristic by frequency. Considering using frequency 2.65[MHz], Frequency was changed from 2.05[MHz] to 3.05[MHz] to recognize flux and temperature change of lamp. I used LMS(Lighting Measurement System) to measure flux and IR Camera to measure temperature of lamp.

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Direct Bonding of Si II 1.3$\mu\textrm{m}$-SiO$_2$/1.3$\mu\textrm{m}$-SiO$_2$ II SOI substrates prepared by FLA method (선형접합기를 이용한 Si II 1.3$\mu\textrm{m}$-SiO$_2$/1.3$\mu\textrm{m}$-SiO$_2$ II SOI 기판의 직접접합)

  • 송오성;이영민;이상현;이진우;강춘식
    • Journal of the Korean institute of surface engineering
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    • v.34 no.1
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    • pp.33-38
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    • 2001
  • 10cm-diameter Si(100)∥$1.3\mu\textrm{m}$-X$1.3_2$X$1.3\mu\textrm{m}$-$SiO_2$∥Si(100) afers were prepared using a fast linear annealing (FLA) equipment. 1.3$\mu\textrm{m}$-thick $SiO_2$ films were grown by dry oxidation process. After cleaning and premating the wafers in a class 100 clean room, they were heat treated using with the FLA and conventional electric furnace. Bonded area and bond strength of wafer pairs were measured using a infrared (IR) camera and razor blade crack opening method, respectively. It was confinmed that the bonded area by FLA was around 99% and the bond strength value reached 2172mJ/$\m^2$, which is equivalent to theoritical bond strength. Our result implies that thick $SiO_2$ SOI may be prepared more easily by using $SiO_2$$SiO_2$ bonding interfaces then those of Si/$SiO_2$'s.

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Visualization and classification of hidden defects in triplex composites used in LNG carriers by active thermography

  • Hwang, Soonkyu;Jeon, Ikgeun;Han, Gayoung;Sohn, Hoon;Yun, Wonjun
    • Smart Structures and Systems
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    • v.24 no.6
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    • pp.803-812
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    • 2019
  • Triplex composite is an epoxy-bonded joint structure, which constitutes the secondary barrier in a liquefied natural gas (LNG) carrier. Defects in the triplex composite weaken its shear strength and may cause leakage of the LNG, thus compromising the structural integrity of the LNG carrier. This paper proposes an autonomous triplex composite inspection (ATCI) system for visualizing and classifying hidden defects in the triplex composite installed inside an LNG carrier. First, heat energy is generated on the surface of the triplex composite using halogen lamps, and the corresponding heat response is measured by an infrared (IR) camera. Next, the region of interest (ROI) is traced and noise components are removed to minimize false indications of defects. After a defect is identified, it is classified as internal void or uncured adhesive and its size and shape are quantified and visualized, respectively. The proposed ATCI system allows the fully automated and contactless detection, classification, and quantification of hidden defects inside the triplex composite. The effectiveness of the proposed ATCI system is validated using the data obtained from actual triplex composite installed in an LNG carrier membrane system.

Experimental Facility for Measuring the Cooling Performance of a Piezoelectric Fan (피에조 팬 냉각 성능 측정을 위한 실험장치 구축)

  • Oh, Myong Hun;Park, Soo Hyun;Ko, Jae Ik;Choi, Minsuk
    • Journal of the Korean Society of Visualization
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    • v.16 no.3
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    • pp.52-58
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    • 2018
  • In this study, an experimental facility has been built to measure the cooling performance of a piezoelectric fan. The facility is composed of a heat source made of $50{\mu}m$ Ni-Cr foil, a piezoelectric fan and a rotary fan for cooling the heat source. For two cases where the foil is vertical or horizontal, the surface temperature on the foil has been measured by an IR camera with and without cooling and the cooling performance of both fans has been analyzed. With cooling by both fans, the rotary fan lowers the surface temperature of the foil as a whole, while the piezoelectric fan lowers the surface temperature at the center of the foil locally. It is also found that the cooling effectiveness of the piezoelectric fan is higher on the horizontal foil than on the vertical foil because the natural convection interferes with the jet from the piezoelectric fan.

Thermography-based coating thickness estimation for steel structures using model-agnostic meta-learning

  • Jun Lee;Soonkyu Hwang;Kiyoung Kim;Hoon Sohn
    • Smart Structures and Systems
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    • v.32 no.2
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    • pp.123-133
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    • 2023
  • This paper proposes a thermography-based coating thickness estimation method for steel structures using model-agnostic meta-learning. In the proposed method, a halogen lamp generates heat energy on the coating surface of a steel structure, and the resulting heat responses are measured using an infrared (IR) camera. The measured heat responses are then analyzed using model-agnostic meta-learning to estimate the coating thickness, which is visualized throughout the inspection surface of the steel structure. Current coating thickness estimation methods rely on point measurement and their inspection area is limited to a single point, whereas the proposed method can inspect a larger area with higher accuracy. In contrast to previous ANN-based methods, which require a large amount of data for training and validation, the proposed method can estimate the coating thickness using only 10- pixel points for each material. In addition, the proposed model has broader applicability than previous methods, allowing it to be applied to various materials after meta-training. The performance of the proposed method was validated using laboratory-scale and field tests with different coating materials; the results demonstrated that the error of the proposed method was less than 5% when estimating coating thicknesses ranging from 40 to 500 ㎛.