• Title/Summary/Keyword: IGES (Initial Graphics Exchange Specification)

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Diagnostic System of Modeling Errors Generated from IGES CAD Data Exchange (IGES CAD 데이터의 교환에서 오류 진단 시스템)

  • Park, Sang-Ho;Park, Jong-Wook;Han, Soon-Heung;Choi, Young;Yang, Jung-Sam;Lee, Byung-Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.10
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    • pp.218-225
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    • 2003
  • A diagnostic system has been developed which reports modeling errors generated when exchanging CAD data using IGES (Initial Graphics Exchange Specification) format. The system determines whether the CAD data contains errors. It also helps to define the criteria for determining the integrity and interoperability of CAD data with downstream applications of another CAD/CAM/CAE/PDM systems. The methodology of our algorithms is to analyze IGES model data by identifying errors and anomalies with respect to the diagnosis of geometry and topology. The GUI (Graphic User Interface) of the developed system helps users to input values and to visualize diagnostic results at real time.

Visualization of Diagnosed IGES by Java Native Interface (JNI를 이용하여 진단된 IGES의 가시화)

  • 박상호;윤형선;이병훈;김준형;김덕수
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.26 no.2
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    • pp.23-28
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    • 2003
  • This research explains visualization of diagnostic system of 3D CAD data, IGES (Initial Graphics Exchange Specification), by using JNI(Java Native Interface) to connect between C++ and Java programming. The diagnostic system is to analyze IGES clearly by identifying errors and anomalies with respect to the diagnosis of geometry and topology of entities. The output of the system is IGES file including . error information which can be visualized with different colors by several commercial visualization systems. The paper focuses on the visualization of the result IGES which can be extended to web based application over internet.

A study on the development of an IGES translator (IGES Translator의 개발에 관한 연구)

  • 박준철;최병규
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1995.04a
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    • pp.617-628
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    • 1995
  • 본 논문에서는 상용화된 이 기종 CAD/CAM 시스템간의 CAD 데이타 교환기능을 가지는 IGES Translator 시스템의 구조를 제안한다. 제품생산의 여러 단계에서 CAD/CAM의 사용이 보편화되어감에 따라 상용 CAD/CAM 시스템들은 응용분야에 맞는 특수한 도구로 사용되는 경향이 생겨났다. 예를 들어, ALIAS는 주로 스타일링 디자인에, I-DEAS와 PRO/ENGINEER는 엔지니어링 디자인에, EUCLID는 금형 디자인에, 그리고 OMEGA와 Z-MASTER는 NC 공구경로생성에 주로 사용되고 있다. CAD 데이타 교환을 위해 제안된 중립파일형식(Neutral File Format)중에서, IGES(Initial Graphics Exchange Specification)는 대부분의 상용 CAD/CAM 시스템에서 지원을 하고 있으며 가장 널리 쓰이는 파일형식이다. 그런데, IGES를 통한 CAD 데이타 교환은 다음과 같은 문제점들을 가지고 있다. 즉, patch의 사라짐, 경계곡선의 왜곡, patch의 overlap 또는 gap, trimming error, 곡면각의 꺾임각도 등이 그것이다. 이 논문의 목적은 이러한 문제점들을 해결할 수 있는 범용 IGES Translator를 개발하는데 있다. 이 논문의 주요한 기여 내용은 다음과 같다. 1) 주요 상용 CAD/CAM 시스템의 IGES Interface 기능의 비교 분석, 2) 주요 상용 IGES Translator의 기능 분석, 3) 사용자의 기능적 요구사항의 분석, 4) 사용자 관점 및 시스템 관점에서의 IGES Translator의 구조 제안, 5) Prototype IGES Translator의 개발 및 테스트 결과 제시.

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Development of a Diagnosis System far CAD Model Errors using OpenCASCADE (OpenCASCADE를 이용한 CAD 모델의 오류 진단 시스템의 개발)

  • Yang, Jeong-Sam;Han, Soon-Hung;Choi, Yong;Park, Sang-Ho
    • Transactions of the Korean Society of Automotive Engineers
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    • v.10 no.3
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    • pp.151-158
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    • 2002
  • Automotive engineers involved in a new car project use various CAD systems that are chosen based on work requirements. For example, engineers in Hyundai Motors are using Pro/Designer and Alias fur the style design, but they use CATIA to design parts and assemblies, ANSYS for FEM analysis, and Pro/Engineer to design engines. Because they use different CAD systems, they have difficulties in collaborative design. Data, which contains errors, is transferred between CAD systems. It is difficult to find out such errors in a large CAD model. An evaluation method for CAD models has been developed in this study. This diagnosis tool analyses a STEP or an IGES file generated from a CAD system, and produces a quantitative error report. The tool has been tested with actual data sets. This paper proposes an algorithm that produces mathematical error values of entities of IGES models that have geometrical data, and entities of STEP models that have topological data, and inspects every part off model. To develop this system, we have used the OpenCASCADE kernel, which is an open source kernel developed by Matra Datavision of France.

An Effective Data Exchange of Curves (곡선의 효율적 자료 교환)

  • 김혁진
    • Journal of the Korea Society of Computer and Information
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    • v.3 no.3
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    • pp.31-40
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    • 1998
  • Recently computer graphics and CAD systems of many kinds have been developed. and this trends will be more increased in the future because the application fields are diverse However, data exchange problems between these systems will be occurred as the system kinds increase. Standards for solving these problems are made by IGES and STEP. etc, Nevertheless, it is unsatisfactory now because data exchange between different systems is not running well with reliability and efficiency. Because vendors implement with different ways, data exchange of the curves and surfaces between different systems which are based in the geometric modeling system, does not satisfy. This paper is a research for curve conversion in the data exchange between different systems. Also this paper analyzed the transferring data which are effectively conversed the curves among the four different types of curves in the less important curve shape environment.

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Study on Application of Reverse Engineering by Generation of the Free-Form Surface (자유 곡면 생성을 통한 역공학 적용에 관한 연구)

  • Hur, Sung-Min;Choi, Jae-Won;Lee, Seok-Hee
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.10
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    • pp.168-177
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    • 2001
  • Reverse engineering has been widely used for the shape reconstruction of an object without CAD data and the measurement of clay or wood models fur the development of new products. To generate a surface from measured points by a laser scanner, typical steps include the scanning of a clay or wood model, the generation of compatible input curves, the generation of a surface and manufacturing data like G code or STL file. A laser scanner has a great potential to get geometrical data of a model for its frost measuring speed and higher precision. The data from a laser scanner are composed of many line stripes of points including small spikes and noise. A new approach using automated surface generating algorithm is introduced to deal with problems during reverse engineering process. And the input data and the generated surface are represented in IGES format, thus can be supplied to other CAD/CAM software without any data manipulation.

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A Study on the Development of Computer Aider Die Design System for Lead Frame of Semiconductor Chip

  • Kim, Jae-Hun
    • International Journal of Precision Engineering and Manufacturing
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    • v.2 no.2
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    • pp.38-47
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    • 2001
  • This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

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Development of Camera System Board Using ARM (ARM을 이용한 카메라 시스템 보드 개발에 관한 연구)

  • Choi, Young-Gyu
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.11 no.6
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    • pp.664-670
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    • 2018
  • In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.

A Study on the Development of Computer Aided Die Design System for Lead Frame, Semiconductor (반도체 리드 프레임의 금형설계 자동화 시스템 개발에 관한 연구)

  • Choe, Jae-Chan;Kim, Byeong-Min;Kim, Cheol;Kim, Jae-Hun;Kim, Chang-Bong
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.6
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    • pp.123-132
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

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Development of Progressive Die CAD/CAM System for Manufacturing Lead Frame, Semiconductor (반도체 리드 프레임 제조를 위한 프로그레시브 금형의 CAD/CAM 시스템 개발)

  • Choi, J.-C.;Kim, B.-M.;Kim, C.;Kim, J.-H.;Kim, C.-B.
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.12
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    • pp.230-238
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

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