• Geophysics and Geophysical Exploration
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• v.6 no.4
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• pp.180-186
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• 2003

We have developed an one-dimensional (ID) inversion program that can invert multiple frequency small-loop EM data from horizontal coplanar (HCP) and vertical coplanar (VCP) configurations. The inverse problem is solved using least-squares method with active constraint balancing (ACB) method and Jacobian matrix is calculated analytically. Tests using synthetic data from simple ID models indicate that conductivity and depth of each layer can be estimated properly when both real and imaginary data are used together.

• Geophysics and Geophysical Exploration
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• v.6 no.4
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• pp.187-194
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• 2003

A small-loop electromagnetic (EM) system using multiple frequencies has advantages in survey speed and cost despite of limitation on its depth of investigation. Therefore, small-loop EM surveys have been frequently used on various site investigations involving engineering and environmental problems. We have developed a subsurface imaging technique using small loop EM data. We used a one-dimensional (ID) inversion method to reconstruct a subsurface image from frequency EM sounding data. Tests using simulated data show that the method can reasonably recover the subsurface resistivity structure. Also, the method was tested on field data obtained with multiple frequency small loop EM system at a farm in Chunchon, Korea. The resistivity image obtained form field data compares favorably with the image from the dipole-dipole resistivity survey.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1109-1112
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• 2003

본 연구는 switching mode 의 Power NMOSFET failure mode 에 관하여 분석하고 원인을 규명하였다. 분석된 power NMOSFET은 30V급이며, vender A의 상용화 제품이다. 발생한 failure mode는 power switch 회로에서 특정 ID 를 detect 하지 못하는 mode 였다. 측정결과 source voltage 가 저하되었으며, power NMOSFET DC 동작특성 분석 결과 Vgs 변화에 따라 Id 가 저하되었다. Fail 된 power MOSFET 특성값 reference는 동일 LOT의 양품을 선정하였다. De-cap후 Inversion 과 Accumulation mode 별로 Photoemission spectrum analyzer(PSA) 분석 방법을 적용하였다. 결과 accumulation mode 에서 intensity가 감소하였으며, forward diode mode에서 국소적으로 변화하는 영역이 검출되었다. SEM 분석결과 gate metal 과 source metal 의 micro-contact 이 이루어져 있었다. 이 경우 gate metal 과 source metal 사이 close loop 를 형성하여 gate charge량을 변화시켜 power NMOSFET의 출력을 저하하는 failure mode가 발생됨을 분석할 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.9
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• pp.1375-1380
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• 1989

Mobility reduction parameters are extracted using a method based on the exploitatiion of Id-Vg and Gm-Vg characteristics of short channel n-MOSFETs in strong inversion region at room temperature. It is found that the reduction of the maximum field effect mobility, \ulcornerFE,max, with the channel length is due to i) the difference between the threshold voltage and the gate voltage which corresponds to the maximum transconductance, and ii) the channel length dependence of the mobility attenuation coefficient, \ulcorner The low field mobility, \ulcorner, is found to be independent of the channel length down to 0.25 \ulcorner ofeffective channel length. Also, the channel length reduction, -I, the mobility attenuation coefficient, \ulcorner the threshold voltage, Vt, and the source-drain resistance, Rsd, are determined from the Id-Vg and -gm-Vg characteristics n-MOSFETs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.6
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• pp.655-661
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• 2013

In this paper, the 1/f noise characteristics of n-channel MOSFET (NMOSFET) and p-channel MOSFET (PMOSFET) are analyzed in depth as a function of body bias. The normalized drain current noise, $S_{ID}/I_D{^2}$ showed strong dependence on the body bias in the sub-threshold region for both NMOSFET and PMOSFET, and NMOSFET showed stronger dependence than PMOSFET on the body bias. On the contrary, both of NMOSFET and PMOSFET do not exhibit the dependence of $S_{ID}/I_D{^2}$ on body bias in strong inversion region, although the noise mechanisms of two MOSFETs are different from each other.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.4
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• pp.413-417
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• 2023

Gallium Oxide (Ga₂O₃) is preferred as a material for next generation power semiconductors. The Ga₂O₃ should solve the disadvantages of low thermal resistance characteristics and difficulty in forming an inversion layer through p-type ion implantation. However, Ga₂O₃ is difficult to inject p-type ions, so it is being studied in a heterojunction structure using p-type oxides, such as NiO, SnO, and Cu₂O. Research the lateral-type FET structure of NiO/Ga₂O₃ heterojunction under the Gate contact using the Sentaurus TCAD simulation. At this time, the VG-ID and VD-ID curves were identified by the thickness of the Epi-region (channel) and the doping concentration of NiO of 1×10¹⁷ to 1×10¹⁹ cm-3. The increase in Epi region thickness has a lower threshold voltage from -4.4 V to -9.3 V at I_D = 1×10^-8 mA/mm, as current does not flow only when the depletion of the PN junction extends to the Epi/Sub interface. As an increase of NiO doping concentration, increases the depletion area in Ga₂O₃ region and a high electric field distribution on PN junction, and thus the breakdown voltage increases from 512 V to 636 V at I_D =1×10^-3 A/mm.