• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.3
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• pp.111-116
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• 2004

The Ni/SiC Schottky diode was fabricated with the $\alpha$-SiC thin film grown by the ICP-CVD method on a (111) Si wafer. $\alpha$-SiC film has been grown on a carbonized Si layer in which the Si surface was chemically converted to a very thin SiC layer achieved using an ICP-CVD method at $700^{\circ}C$. To reduce defects between the Si and $\alpha$-SiC, the surface of the Si wafer was slightly carbonized. The film characteristics of $\alpha$-SiC were investigated by employing TEM (Transmission Electron Microscopy) and FT-IR (Fourier Transform Infrared Spectroscopy). Sputterd Ni thin film was used as the anode metal. The boundary status of the Ni/SiC contact was investigated by AES (Auger Electron Spectroscopy) as a function of the annealing temperature. It is shown that the ohmic contact could be acquired beyond a 100$0^{\circ}C$ annealing temperature. The forward voltage drop at 100A/cm was I.0V. The breakdown voltage of the Ni/$\alpha$-SiC Schottky diode was 545 V, which is five times larger than the ideal breakdown voltage of the silicon device. As well, the dependence of barrier height on temperature was observed. The barrier height from C- V characteristics was higher than those from I-V.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1303-1304
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• 2006

본 연구에서는 ICP-CVD (inductively coupled plasma chemical vapor deposition)를 이용해 미세결정 실리콘 (nanocrystalline silicon thin film transistor, ns-Si TFT) 초기 성장 단계에 발생하는 비정질의 Incubation layer를 줄이기 위한 실험을 수행하였다. ICP-CVD를 사용하여 증착한 Si-rich $SiN_x$ Seed layer 상의 미세절정 실리콘의 성막조건을 알아보고 특성을 평가하였다. 미세결정 실리콘 박막은 Raman Spectroscopy를 이용해 분석하였다. 미세결정 실리콘의 초기 성장 단계에 발생하는 비정질 Incubation layer를 줄이기 위하여 Si-rich $SiN_x$를 Seed layer로 사용하는 것이 효과적임을 확인하였다. 또한 Si-rich $SiN_x$ 위에서의 미세결정 실리콘 표면 형태와 Seed 성장 기회의 관계를 알아보았다. 높은 전압의 수소 플라즈마 처리는 Seed 성장 기회를 늘이고, 박막의 결정화도를 높임을 확인하였다. 얇은 Incubation layer를 가지는 35nm 이하 두께의 미세결정 실리콘이 성공적으로 증착되었다. 본 연구 결과는 bottom 게이트 방식 박막 트랜지스터에 증착되는 미세결정 실리콘의 전기적 특성 향상에 유용할 것으로 판단된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.386-387
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• 2007

ICP-CVD(Inductively Coupled Plasma-Chemical Vapor Deposition)를 이용하여 플라즈마 처리에 따른 Al이 도핑된 ZnO(AZO) 박막의 표면 부착력과 굴절율, 표면거칠기에 관한 연구를 하였다. 플라즈마 처리는 인가전압, 시간을 변수로 하였고 반응 가스는 Ar을 사용하였다. 표면조성은 AFM, 광학적 특성은 UV-Vis 분광계를 이용한 광투과도 측정으로부터 굴절률과 밴드갭을 조사하였고 표면 부착력은 접촉각 분석기(제조사:Kruss)를 사용하여 조사하였다. 플라즈마 처리 시간이 길어짐에 따라 박막 표면의 거칠기가 커지고 부착력은 증가하는 것으로 나타났다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.99-100
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• 2007

유도결합 플라즈마(ICP)를 이용한 CVD 장치에서 플라즈마를 발생시키기 위한 안테나의 구조는 매우 중요하다. 전자 온도와 전자 밀도에 직접적인 영향을 주게 되며, 뿐만 아니라 증착 물질의 두께 균일도에 결정적인 역할을 하게 된다. 본 연구에서는 플라즈마 특성 균일도 최적화를 위하여 2turn 직렬, 병렬, 혼합의 ICP 안테나의 구조에 대하여 플라즈마 특성 및 $SiO_2$ CVD 증착 특성을 계산하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1003-1006
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• 2004

We have fabricated poly-Si TFTs at 170$^{\circ}C$ using inductively coupled plasma chemical vapor deposition (ICP-CVD) and excimer laser annealing (ELA). A Poly-Si film with large grains exceeding 5000${\AA}$ and a $SiO_2$ film with high breakdown field are deposited by ICP-CVD. A high mobility exceeding 100$cm^2$/Vs with a low sub-threshold swing of 0.76V/dec was obtained.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.938-940
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• 1999

We have fabricated SiC Schottky diode for high temperature applications. SiC thin film for drift region has been deposited by ICP-CVD. In order to establish metallization conditions, we have extracted the device parameters of the Schottky diode from the forward I-V characteristics and the C-V characteristics as a function of temperature. The ideality factor was varied from 2.07 to 1.15 and the barrier height was also varied from 1.26eV to 1.92eV with increase of temperature. The reverse blocking voltage was 183 V.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.118-118
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• 1999

CVD방법에 의한 TiN 박막 형성에 있어서 ICP-CVD 방법이 대두되고 있다. 이것은 precursor에 대한 radical 형성, 식각된 패턴에서 양 벽의 self-shadowing 효과, 낮은 tress등으로 dense 한 박막을 얻을 수 있기 때문이다. TiN 박막은 Si 기판의 온도를 상온에서 50$0^{\circ}C$까지 유지하면서 TEMAT의 유량을 5-20sccm으로 변화시키면서 증착하였다. 증착 후 TiN 박막의 결정화에 따른 열처리는 Ar과 N2-가스분위기에서 in-situ로 증착하였다. 증착 후 TiN 박막증착 조건수립에 따른 플라즈마 특성진단은 전자의 온도와 밀도, 평균 전자밀도, 이온 에너지 분포, radical 분포, negative 이온분포 등으로 측정하였다. 플라즈마 변수에 따른 TiN 박막의 결정성과 상 변화는 XRD로 분석하였고, 조성비 및 TiN 박막의 원소화학적 상태, 결합에너지, 각 상에 따른 결합 에너지 천이정도, 초기 형성과정 및 반응기구 등은 RBS와 XPS로 조사하였다. TiN 박막의 표면상태, morphology 거칠기, TiN/Si(100)구조에서 계면상태 등은 SEM, AFM, 그리고 HRTEM으로 분석하였다. TiN 구조 박막의 비저항, carrier concentration 그리고 mobility 측정은 박막의 표면이 균일하고 bls-홀이 없는 것으로 하여 4-point probe 방법으로 측정하였다. 이들 분석으로부터 ICP-CVD 방법에 의하여 형성된 TiN 박막이 초고집적 반도체 소자의 contact barrier layer로서의 적용 가능성을 평가하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.538-546
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• 2006

We report on characteristics of specially designed inductively-coupled-plasma chemical vapor deposition (ICP-CVD) system for top-emitting organic light emitting diodes (TOLEDs). Using high-density plasma on the order of $10^{11}$ electrons/$cm^3$ generated by linear-type antennas connected in parallel and specially designed substrate cooling system, a 100 nm-thick transparent $SiN_{x}$ passivation layer was deposited on thin Mg-Ag cathode layer at substrate temperature below $50\;^{\circ}C$ without a noticeable plasma damage. In addition, substrate-mask chucking system equipped with a mechanical mask aligner enabled us to pattern the $SiN_x$ passivation layer without conventional lithography processes. Even at low substrate temperature, a $SiN_x$ passivation layer prepared by ICP-CVD shows a good moisture resistance and transparency of $5{\times}10^{-3}g/m^2/day$ and 92 %, respectively. This indicates that the ICP-CVD system is a promising methode to substitute conventional plasma enhanced CVD (PECVD) in thin film passivation process.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1597-1599
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• 2004

Carbon nanotubes (CNTs) are grown on the TiN-coated silicon substrate by varying the thickness of Ni and Invar426 catalyst layers at 600$^{\circ}C$ using an inductively coupled plasma-chemical vapor deposition (ICP-CVD). The Ni and Invar426 catalysts are formed using an RF magnetron sputtering system with various deposition periods. Characterization using various techniques, such as FESEM, HRTEM, and Raman spectroscopy, shows that the physical dimension as well as the crystal quality of grown CNTs are strongly changed by the kind and thickness of catalyst materials. It is also seen that Ni catalysts would be more desirable for vertical-alignment of CNTs compared with Invar426 catalysts. However, the CNTs using Invar426 catalysts display much better electron emission capabilities than those using Ni catalysts. The physical reason for all the measured data obtained are discussed to establish the relationship between structural properties and field-emissive properties of CNTs.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1862-1864
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• 2005

Carbon nanotubes [CNTs] are grown on TiN-coated Si substrates at $700^{\circ}C$ by inductively coupled plasma-chemical vapor deposition (ICP-CVD). Pre-treatment of Ni catalysts has been performed using an RF magnetron sputtering system. Structural properties and field-emission characteristics of the CNTs grown are analyzed in terms of the RF power applied and the treatment time used in the pre-treatment process. The characterization using various techniques, such as FE-SEM, AFM, and Raman spectroscopy, show that the physical dimension as well as the crystal quality of CNTs are changed by pre-treatment of Ni catalysts. It is also seen that Ni catalysts with proper grain size and uniform surface roughness may produce much better electron emission. The physical reason for all the measured data obtained are discussed to establish the relationship between the structural property and the electron emission characteristic of CNTs.