• Asian Pacific Journal of Cancer Prevention
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• 제15권23호
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• pp.10281-10287
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• 2015

Background: Development of a nanosized polymeric delivery system for erlotinib was the main objective of this research. Materials and Methods: Poly caprolactone-polyethylene glycol-polycaprolactone (PCEC) copolymers with different compositions were synthesized via ring opening polymerization. Formation of triblock copolymers was confirmed by HNMR as well as FT-IR. Erlotinib loaded nanoparticles were prepared by means of synthesized copolymers with solvent displacement method. Results: Physicochemical properties of obtained polymeric nanoparticles were dependent on composition of used copolymers. Size of particles was decreased with decreasing the PCL/PEG molar ratio in used copolymers. Encapsulation efficiency of prepared formulations was declined by decreasing their particle size. Drug release behavior from the prepared nanoparticles exhibited a sustained pattern without a burst release. From the release profiles, it can be found that erlotinib release rate from polymeric nanoparticles is decreased by increase of CL/PEG molar ratio of prepared block copolymers. Based on MTT assay results, cell growth inhibition of erlotinib has a dose and time dependent pattern. After 72 hours of exposure, the 50% inhibitory concentration (IC50) of erlotinib hydrochloride was appeared to be $14.8{\mu}M$. Conclusions: From the obtained results, it can be concluded that the prepared PCEC nanoparticles in this study might have the potential to be considered as delivery system for erlotinib.

• 한국정보기술학회논문지
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• 제16권11호
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• pp.77-84
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• 2018

본 논문에서는 T-junction 전력 분배기를 이용한 원형 편파 마이크로스트립 패치 안테나를 제안하였다. 제안된 안테나의 동작 주파수는 2.4GHz의 ISM 대역이며, 패치 안테나의 두 가장자리에 $90^{\circ}$의 위상차를 급전하여 원형 편파를 유도하였다. 안테나의 구조는 일반적인 패치 안테나와 T-junction 전력 분배기로 구성된다. 안테나의 최적화를 위해 반사계수, 축비, 방사패턴 등이 분석된다. 안테나의 임피던스 대역폭은 2.39~2.43GHz 대역에서 40MHz의 대역폭이 관찰되었으며, 축비 대역폭은 2.398~2.410GHz 대역에서 약 12MHz의 대역폭이 관찰되었다. 안테나의 방사패턴은 우회전 원형 편파로 동작하였다. 또한 안테나의 이득은 XZ 및 YZ-평면에서 각각 2.04, 3.4㏈ic가 관찰되었다.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.39-45
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• 2012

Cu-Cu 패턴의 직접접합 공정을 위하여 Buffered Oxide Etch(BOE) 및 Hydrofluoric acid(HF)의 습식 조건에 따른 Cu와 $SiO_2$의 식각 특성에 대한 평가를 수행하였다. 접촉식 3차원측정기(3D-Profiler)를 이용하여 Cu와 $SiO_2$의 단차 및 Chemical Mechanical Polishing(CMP)에 의한 Cu의 dishing된 정도를 분석 하였다. 실험 결과 BOE 및 HF 습식 식각 시간이 증가함에 따라 단차가 증가 하였고, BOE가 HF보다 더 식각 속도가 빠른 것을 확인하였다. BOE 및 HF 습식 식각 후 Cu의 dishing도 식각시간 증가에 따라 감소하였다. 식각 후 산화막 유무를 알아보기 위해 Cu표면을 X-선 광전자 분광법(X-ray Photoelectron Spectroscopy, XPS)를 이용하여 분석 한 결과 HF습식 식각 후 BOE습식 식각보다 Cu표면산화막이 상대적으로 더 얇아 진 것을 확인하였다.

• Molecules and Cells
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• 제26권5호
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• pp.481-485
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• 2008

As an inhibitor of phosphatidylcholine-specific phospholipase C (PC-PLC), D609 has been widely used to explain the role of PC-PLC in various signal transduction pathways. This study shows that D609 inhibits group IV cytosolic phospholipase $A_2$ ($cPLA_2$), but neither secretory $PLA_2$ nor a $Ca^{2+}$-dependent $PLA_2$. Dixon plot analysis shows a mixed pattern of noncompetitive and uncompetitive inhibition with $K_i=86.25{\mu}M$ for the $cPLA_2$ purified from bovine spleen. D609 also time- and dose-dependently reduces the release of arachidonic acid from a $Ca^{2+}$- ionophore A23187-stimulated MDCK cells. In the AA release experiment, $IC_{50}$ of D609 was ${\sim375}{\mu}M$, suggesting that this reagent may not enter the cells easily. The present study indicates that the inhibitory effects of D609 on various cellular responses may be partially attributable to the inhibition of $cPLA_2$.

• 한국조명전기설비학회지:조명전기설비
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• 제8권4호
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• pp.38-45
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• 1994

본 논문에서는 신호감쇄 및 연집잡음(burst noise)이 존재하는 전력선 반송 채널에서 디지틀 데이터를 복조하기 위한 BPSK(Binary Phase Shift Keying) 복조기의 설계에 대하여 논한다. 이러한 BPSK 복조기의 실현에 있어서 반송파 동기호로는 소형화 및 안정화가 요구되며, 입력주파수의 변동에 대해서 낮은 위상 오차가 필요하게 된다. 이와 같은 요구조건을 만족하기 위해서 본 논문에서는 반송주파수가 10.4[kHz]이고, 전송속도가 110[bps]인 재변조방식의 BPSK 복조기를 설계 제작하였다. 설계 제작한 반송파 동기회로는 기존의 아날로그 소자로 구성되었던 승산기(multiplier) 및 지연회로를 PLL(Phase Locked Loop) IC로 대치하여 소형화 및 안정성을 확보하였으며, PLL회로 설계시에 주위온도 등을 고려하여 주파수 인입범위를 $\pm$4[kHz], 정상위상오차를 $\pm$60로 설정하였다. 기능시험 결과로부터, BPSK 복조기의 동작기능은 정상상태에서 설계조건에 만족함을 알 수 있었다.

• 대한기계학회논문집A
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• 제24권1호
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• pp.118-123
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• 2000

Most quadruped walking robots under current research are individually controlling every joint ic make them step or walk according to an integrated strategy. Such methods are characterized by at least one pair of an actuator and a sensor installed per each 'oint so that the robots weigh execssively and move inefficiently in terms of energy expenditure. In addition, the task of controlling all the joints simultaneously is quite complex and prone to destabilize the robot motion. These respects keep the existing walking robots away from realistic applications such as transportation even if they have potentially, outstanding adaptability to swamps or uneven terrains as opposed to wheeled vehicles. So, this paper presents a new conceptual quadruped robot developed to walk and steer only with a minimal number of actuators owing to a closed-chain mechanism. To prove its actual performance including the adaptability to various types of terrains. experiments are done with the mammal-type prototype. And. it is also shown that the same concept can be easily extended to carry out different gait forms. for instance, that of spiders only with minor modifications.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 한국전기전자재료학회논문지
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• 제14권1호
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• pp.1-5
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• 2001

STI(shallow trench isolation)-CMP(chemical mechanical polishing) process have been substituted for LOCOS(local oxidation of silicon) process to obtain global planarization in the below sub-0.5㎛ technology. However TI-CMP process, especially TI-CMP with RIE(reactive ion etching) etch back process, has some kinds of defect like nitride residue, torn oxide defect, etc. In this paper, we studied how to reduced torn oxide defects after STI-CMP with RIE etch back processed. Although torn oxide defects which can occur on trench area is not deep and not severe, torn oxide defects on moat area is not deep and not severe, torn oxide defects on moat area is sometimes very deep and makes the yield loss. Thus, we did test on pattern wafers which go through trench process, APECVD process, and RIE etch back process by using an IPEC 472 polisher, IC1000/SUVA4 PAD and KOH base slurry to reduce the number of torn defects and to study what is the origin of torn oxide defects.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.723-725
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• 1998

STI CMP process are substituting gradually for LOCOS(Local Oxidation of Silicon) process to be available below sub-0.5um technology and to get planarized. The other hand, STI CMP process(especially STI CMP with RIE etch back process) has some kinds of defect like Nitride residue, Torn Oxide defect, etc. In this paper, we studied how to reduce Torn Oxide defects after STI CMP with RIE etch back process. Although Torn Oxide defects which occur on Oxide on Trench area is not deep and not sever, Torn oxide defects on Moat area is sometimes very deep and makes the yield loss. We did test on pattern wafers witch go through Trench process, APCVD process, and RIE etch back process by using an REC 472 polisher, IC1000/SUV A4 PAD and KOH base slurry to reduce the number of torn defects and to study what is the root causes of torn oxide defects.

• Archives of Pharmacal Research
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• 제20권4호
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• pp.351-357
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• 1997

A series of 4-substituted-kynurenic acid derivatives possessing several different substituents at C4-position which are consisted of both a flexible propyloxy chain and an adjunct several type of carbonyl groups has been synthesized and evaluated for their in vitro antagonist activity at the glycine site on the NMDA receptor. Of them, N-benzoylthiourea 15c and N-phenylthiourea 15a were found to have the best in vitro binding affinity with $IC_{50}$ of 3.95 and $6.04{\mu}M$, respectively. On the other hand, in compounds 12a-c and 13 the displacement of a thiourea group to an amide or a carbamate caused a significant decrease of the in vitro binding affinity. In the SAR study of the 4-substituted kynurenic acid derivatives, it was realized that the terminal substitution pattern on a flexible C4-propyloxy chain of kynurenic acid nucleus significantly influences on the binding affinity for glycine site; the binding affinity to the NMDA receptor might be increased by the introduction of a suitable electron rich substituent at C4 of kynurenic acid nucleus.