• International Journal of Quality Innovation
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• v.6 no.3
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• pp.70-94
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• 2005

The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work-order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the IC packaging industry, this work also proposes a WIP (i.e. work-in-process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.14 no.4
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• pp.275-283
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• 2021

In this study, a driver IC for an AC-powered LED that can be manufactured with a low voltage semiconductor process is designed and the performances of the driver IC were simulated. In order to manufacture a driver IC that operates directly at AC 220V, a semiconductor manufacturing process that satisfies a breakdown voltage of 500V or higher is required. A semiconductor manufacturing process for a high-voltage device requires a much higher manufacturing cost than a general semiconductor process for a low-voltage device. Therefore, the LED driver IC is designed in series so that it can be manufactured with semiconductor process technology that implements a low-voltage device. This makes it possible to divide and apply the voltage to each LED block even if the input voltage is high. The LED lighting circuit shows a power factor of 96% at 220V. In the pnp transistor circuit, a very high power factor of 99.7% can be obtained, and it shows a very stable operation regardless of the fluctuation of the input voltage.

• Design & Manufacturing
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• v.11 no.2
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• pp.9-14
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• 2017

The design and manufacturing tehcnology of IC sockets beyond 0.3mm pitch were presented. We compared the developed IC socket with the conventional one especially on the core metal-insulation part. Advanced machining techniques were employed to provide high precision. Our wire electrodischarge machining and high speed machining centers were able to maintain the micro-scale precision. We performed an injection molding analysis using a commercial analysis tool to predict the performance of the developed IC socket. We found that the solidification of the plastic resin and the high level of the clamping force are responsible for the defects such as incomplete filling and short shot. From these results, we modified the IC socket and successfully remove the defects. We were also able to find out that the new design socket needs less maintenance cost.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.3
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• pp.23-27
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• 1999

A lot of electronic parts are used for recent vehicles. If electronic parts break down, it will bring passenger to fatal wound. The very representative trouble of electronic parts is a cut aluminium wire of a hybrid IC. In this study, I analyzed a cause of cut aluminium wire and the main results obtained on this study are summarized as follows; (1) The forces acting on the aluminium wire are because of thermal expansion of a resin. (2) The forces acting on the aluminium wire are obtained by the theoretical analysis and those results are agree well with those of the FEM.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1005-1008
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• 1998

IC testing plays a very important role in IC manufacturing process. Modern complex ASIC chips making it difficult for gate level and RLT level test generation techniques to generate good test vector in resonable time. In this paper we proposed new test pattern generation method in VHDL description to detect manufacturing faults. This method based on software testing can easily generate test vector and independent to synthesis result.

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.38-44
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• 1999

In this paper, we have constructed a self-diagnostic circuit which could detect erroneous signals in most cases that a eight-beam piezoresistive accelerometer were destroyed more than its one beam. To confirm the function of the circuit, PSPICE simulation was carried out. An IC chip was fabricated with a layout of KA 324 amplifier using a bipolar standard processing. After a package of the chip was sealed using a plastic package with 24 pins, the self-diagnostic characteristics were investigated. Then, the measured self-diagnostic characteristics of the circuit were compared with the PSPICE simulated result.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.293-296
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• 2002

This paper proposes new driving methods for designing a driver independent of the current property of organic light emitting diodes (OLED) displays. The proposed methods are the Look-Up Table (LUT) and the Pulse Width Modulation (PWM). The LUT is used to handle the amount of the current for driving the OLED display panel and the PWM is applied to represent the gray scale on the OLED display panel. Segment and common drivers were implemented using delay circuits to prevent short-circuit current and a DC-DC converter was designed to supply the drivers with a power source. In particular, tile proposed methods are used for the manufacturing of 1.8" 128$\times$128 dot passive matrix OLED display panel. The designed circuit was fabricated using 0.6w, 2-poly, 3-metal, CMOS process and applied to the Personal Communication System (PCS) phone successfully.ully.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Proceedings of the KIEE Conference
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• 1999.07f
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• pp.2786-2788
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• 1999

In this paper, a mixed mode exciting resonant inverter topology applicable to high performance electronic ballast is presented. Mixed mode exciting technique combines the attractive features of self exciting resonant inverter with those of external exciting one. The control IC is designed and manufactured by using a 0.8um CMOS process for 5V operation and has only 8 pins. This performs the operations of filament preheating, dimming control, output power regulation and protections. The mixed mode exciting resonant inverter with control IC has very simple structure, high performance and expensive manufacturing cost.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 1994.04a
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• pp.223-231
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• 1994

생산시스템 기술이 점차 확대/발전되고, 가공시스템의 고 신뢰성, 효율성 향 상에 대한 관심이 집중되면서 시스템 관련하의 다양한 분야에서 체계적인 연구가 진행되고 있다. 그중 공구관리시스템에 관해서는 지금까지 많은 연구 가 되고 있으나 단순히 재고관리 관점에서 운용되거나, 부분적으로 open-loop 상황에서 사용되고 있다. 본 연구에서는 이러한 측면에서 생산현 장에 적합하고, 공작기계와의 Interface를 고려하여 IC(Integrated Circuit)를 이용한 공구식별시스템을 구축하므로써 Manufacturing Database에서 운용되 고, 공작기계와도 공구정보를 송/수신할 수 있는 shop floor연계형 TMS(Tool Management System)를 개발하고자 한다.