• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of the Korean Society of Propulsion Engineers
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• v.17 no.2
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• pp.31-38
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• 2013

This research analyzed the acoustic emission signals collected from the pin loading tests and investigated the effect of hygrothermal exposure on the fracture behavior of the pin-jointed carbon fiber/epoxy composites. The composite specimens include: the Base specimen that has not been exposed to any environments, the RT specimen that has been immersed in room temperature water, and the HT specimen that has been immersed in high temperature water. According to the pin loading test, the RT and the HT specimens showed 2.2% and 13% decreases in the bearing strength compared to the Base specimen, respectively. The analysis of the acoustic emission signals showed different fracture acceleration points for three types of the specimens. Furthermore, for the RT and the HT specimens, the event from the matrix crack signals in the composites decreased. This shows the effect of the hygrothermal conditions on the acoustic emission signals. Additionally, upon investigating the fracture behaviors of the pin-jointed composites, the exposing specimens to hygrothermal environments decreases the interfacial characteristics of the composites.

• International Journal of Aeronautical and Space Sciences
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• v.2 no.2
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• pp.65-72
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• 2001

This paper demonstrates an explicit-implicit, finite element analysis for linear as well as nonlinear hygrothermal stress problems. Additional features, such as moisture diffusion equation, crack element and virtual crack extension(VCE) method for evaluating J-integral are implemented in this program. The Linear Elastic Fracture Mechanics(LEFM) Theory is employed to estimate the crack driving force under the transient condition for an existing crack. Pores in materials are assumed to be saturated with moisture in the liquid form at the room temperature, which may vaporize as the temperature increases. The vaporization effects on the crack driving force are also studied. The ideal gas equation is employed to estimate the thermodynamic pressure due to vaporization at each time step after solving basic nodal values. A set of field equations governing the time dependent response of porous media are derived from balance laws based on the mixture theory. Darcy's law is assumed for the fluid flow through the porous media. Perzyna's viscoplastic model incorporating the Von-Mises yield criterion are implemented. The Green-Naghdi stress rate is used for the invariant of stress tensor under superposed rigid body motion. Isotropic elements are used for the spatial discretization and an iterative scheme based on the full Newton-Raphson method is used for solving the nonlinear governing equations.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.4
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• pp.1347-1355
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• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

• Journal of the Korea Institute of Military Science and Technology
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• v.8 no.3 s.22
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• pp.124-130
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• 2005

In this paper, the effects of matrix hygrothermal aging and residual stress changes on $Avimid^{(R)}$ K3B/IM7 laminates in $80^{\circ}C$ water were studied. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, the change in residual stresses. After 500 hours fully saturated aging of the neat resin, the weight gain was 1.55% increase with the diffusion coefficient $7{\times}10^{-6}m^2/s$ and the fracture toughness was decreased about 41%. After 100 hours fully saturated aging of the $[+45/0/-45/90]_s$ K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was 0.41% increase with the diffusion coefficient $1{\times}10^{-6}m^2/s$ and the loss of the microcracking fracture toughness was 43.8% of the original toughness. To see whether the residual stress influenced the fracture toughness, two ply $[90^{\circ}/0^{\circ}]$ laminates were put in $80^{\circ}C$ water from 2 hours to 8 hours. The changes in residual stress in 8 hours are less than 3MPa. Because the 3MPa change is not sufficient to degrade the laminates, the main factor to degrade the microcracking fracture toughness was the degradation of the matrix fracture toughness.

• Journal of the Korean Society of Safety
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• v.11 no.4
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• pp.143-150
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• 1996

This is an explicit-Implicit, finite element analysis for linear as well as nonlinear hygrothermal stress problems. Additional features, such as moisture diffusion equation, crack element and virtual crack extension(VCE ) method for evaluating J-integral are implemented in this program. The Linear Elastic Fracture Mechanics(LEFM) Theory is employed to estimate the crack driving force under the transient condition for and existing crack. Pores in materials are assumed to be saturated with moisture in the liquid form at the room temperature, which may vaporize as the temperature increases. The vaporization effects on the crack driving force are also studied. The Ideal gas equation is employed to estimate the thermodynamic pressure due to vaporization at each time step after solving basic nodal values. A set of field equations governing the time dependent response of porous media are derived from balance laws based on the mixture theory Darcy's law Is assumed for the fluid flow through the porous media. Perzyna's viscoplastic model incorporating the Von-Mises yield criterion are implemented. The Green-Naghdi stress rate is used for the invariant of stress tensor under superposed rigid body motion. Isotropic elements are used for the spatial discretization and an iterative scheme based on the full newton-Raphson method is used for solving the nonlinear governing equations.

• Journal of the Korean Society of Propulsion Engineers
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• v.9 no.4
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• pp.23-30
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• 2005

The Hygrothermal aging of the laminates of $Avimid^(R)$ K3B/IM7 in $80^{\circ}C$ water was studied as a function of immersion time prior to forming microcracks. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, the change in residual stresses or the interfacial damage between the fiber and the matrix. The times to saturation in $80^{\circ}C$ water for the laminates and for the neat resin were 100 hours and 500 hours. After 500 hours aging of the neat resin, the glass transition temperature was changed less than 1% by DSC test, and the weight gain was 1.55% increase with the diffusion coefficient $7\times10^{-6}m/s^2$ and the fracture toughness was decreased about 41%. After 100 hours fully saturated aging of the ${[+45/0/-45/90]}_s$ K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was 0.41% increase with the diffusion coefficient $1\times10^{-6}m/s^2$. In 100 hours, the loss of the fracture toughness of the laminates was 43.8% of the original toughness by the microcracking fracture toughness criterion. Therefore, the main factor to degrade the microcracking toughness of the laminates could be the degradation of the matrix fracture toughness.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• v.y2005m4
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• pp.31-34
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• 2005

Hygrothermal aging of the laminates of $Avimid^{R}$ K3B/IM7 in $80^{\circ}C$ water was studied as a function of immersion time prior to forming microcracks. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, change in residual stresses or interfacial damage between the fiber and matrix. The times to saturation in $80^{\circ}C$ water for the laminates and the neat resin are 100 hours and 500 hours. After 500 hours aging of the neat resin in $80^{\circ}C$ water, the glass transition temperature was changed less than $1\%$ by DSC test and the weight gain was $1.55\%$ increase. After 500 hours aging, the fracture toughness of the neat resin was decreased about $37\%$ by 3-point bending test. After 100 hours aging of the [+45/0/-45/90]s K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was $0.41\%$ increase. The $80^{\circ}C$ water diffusion rate into the neat resin was faster than into the laminates. In 100 hours, the loss of the microcracking toughness of the laminates was $28\%$ of the original toughness by our own microcracking fracture toughness criterion.