• Bulletin of the Korean Chemical Society
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• v.35 no.5
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• pp.1523-1528
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• 2014

Silicon quantum dots (Si QDs) were synthesized by etching silicon nanopowder with aqueous hydrofluoric acid (HF) and nitric acid ($HNO_3$). Then, the hydride-terminated Si QDs (H-Si QDs) were functionalized by 1- octadecene (ODE). By only controlling the etching time, the maximum luminescence peak of octadecylterminated Si QDs (ODE-Si QDs) was tuned from 404 nm to 507 nm. The average optical gap was increased from 2.60 eV (ODE-Si QDs-5 min) for 5 min of etching to 3.20 eV (ODE-Si QDs-15 min) for 15 min of etching, and to 3.40 eV (ODE-Si QDs-30 min) for 30 min of etching. The electron affinities (EA), ionization potentials (IP), and quasi-particle gap (${\varepsilon}^{qp}_{gap}$) of the Si QDs were determined by cyclic voltammetry (CV). The quasi-particle gaps obtained from the CV were in good agreement with the average optical gap values from UV-vis absorption. In the case of the ODE-Si QDs-30 min sample, the difference between the quasi-particle gap and the average optical gap gives the electron-hole Coulombic interaction energy. The additional electronic levels of the ODE-Si QDs-30 min and ODE-Si QDs-15 min samples determined by the CV results are interpreted to have originated from the Si=O bond terminating Si QD.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.6
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• pp.209-215
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• 2015

Following the semiconductor industry's growing, various types of toxic gases and caustic chemicals, HF(Hydrofluoric acid), HCI (Hydochloric acid), $H_2O_2$ (Hydrogen peroxide), $H_2SO_4$ (Sulfuric acid), and Piranha, were using on the semiconductor manufacturing process. Therefore many gas leakage accidents that produce huge losses of lives were caused by the processes. This research deeply considers two basic solutions that the necessity of MSDS education on university for reducing damage of lives and protecting life from chemical leak accidents such as a HF accident in Gumi, Korea and the use of GHS, REACH and the comprehension of propriety about using MSDS for keeping safety from conflagrations by released poison chemical materials.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.262-267
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• 2004

Ultrasonic machining has been known as one of the conventional machining methods in the glass fabrication processes. In ultrasonic machining, typically, glass is removed by the impulse energy of the abrasive generated by the ultrasonic power. However, when the machining feature decrease under hundreds of micrometers, as conventional ultrasonic machining uses only the impulse energy of the abrasive, the speed of ultrasonic machining decreases significantly and the surface roughness becomes deteriorated. To overcome this size effect, the chemicals which can erode glasses, such as HF, XF, etc, are added to the slurry. The chemical-assisted ultrasonic machining method, so called, is another alternating effective way for micro machining of glasses. In previous work, we used the hydrofluoric acid (HF) as an additive chemical. But, as the HF solution is too poisonous to be used as a ultrasonic process additive, it is needed to be substituted by other safe chemicals. As results of the machinability comparison of several chemicals, the GST-500F was selected to replace the HF. The GST-500F (pH $4.0{\pm}1.0$) is non-volatile, odorless. During experimental works, it was shown that the machining rate increases 1.5 times faster than the conventional ultrasonic machining. The machining load also decreases. However, the enlargement of the hole diameter and significant tool wear are still the problems to be solved.

• The Journal of Korean Academy of Prosthodontics
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• v.33 no.4
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• pp.693-704
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• 1995

This study was performed to evaluate effective surface conditioning method of In-Ceram core to improve bonding with resin cement. The surface of each sample was avraded with glass bead for 20 seconds and then subjected to one of the following conditions : no modification, sandblasting with $50{\mu}m$ slumimum oxide powders for 20 seconds, etching with 20% hydrofluoric acid for 5, 10, and 15 minutes(half of the etched samples were coated with silane), and sandblasting with $250{\mu}m$ aluminum oxide powders and silica coating whith Silicoater MD system(Kulzer, Germany). The surface morphology changes were examined with scanning electronic microscope(SEM. and the shear bond strength of In-Ceram core samples to resin cement(Panavis 21, Kurayay, Japan) were measured. It was concluded that : 1. By SEM observation, 20% HF acid etching did not create clear microretentive structure and surface roughness diminished with increace in etching time. Sandblasting was more effective than 20% hydrofluoric acid etching in producing microretentive structure. 2. The bond strengths of all In-Ceram core samples surface conditioned were increased that that of control group. 3. Silica coating showed higher bond strength than etching with 20% hydrofluoric acid. 4. The use of silane coating was more effective in improving bond strength than lengthening etching time.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.781-784
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• 1988

The formation and properties of porous silicon layer(PSL) formed by anodic reaction in hydrofluoric acid solution have been studied. Many micropores are formed randomly inside of PSL and the anodization is achieved uniformly-toward the thickness direction. Current density, resistivity and HF concentration in P-type PSL formation are found to play important roles in determining the formation and properties of PSL.

• The Journal of Advanced Prosthodontics
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• v.12 no.4
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• pp.189-196
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• 2020

PURPOSE. The aim of the present study was to investigate the effects of surface treatments on the bond strengths between polymer-containing restorative materials and two dual-cure resin cements. MATERIALS AND METHODS. In the present study, rectangular samples prepared from Lava Ultimate (LU) and Vita Enamic (VE) blocks were used. The specimen surfaces were treated using CoJet sandblasting, 50 ㎛ Al₂O₃ sandblasting, % 9 HF (hydrofluoric) acid, ER,Cr:YSGG laser treatment, and Z-Prime. Dual-cure resin cements (TheraCem and 3M RelyX U 200) were applied on each specimen's treated surface. A micro-tensile device was used to evaluate shear bond strength. Statistical analysis was performed using the SAS 9.4v3. RESULTS. While the bond strength using TheraCem with LU or VE was not statistically significant (P=.164), the bond strength using U200 with VE was statistically significant (P=.006). In the TheraCem applied VE groups, Z-Prime and HF acid were statistically different from CoJet, Laser, and Sandblast groups. In comparison of TheraCem used LU group, there was a statistically significant difference between HF acid and other surface treatments. CONCLUSION. The bonding performance between the restorative materials and cements were material type-dependent and surface treatment had a large effect on the bond strength. Within the limitations of the study, the use of both U200 and TheraCem may be suggested if Z-prime was applied to intaglio surfaces of VE. The cementation of LU using TheraCem is suitable after HF acid conditioning of the restoration surfaces.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.1
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• pp.25-32
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• 2017

In this paper, a fabrication method of low-loss tapered optical fibers coupler using hydrofluoric acid with surface tension driven is proposed. The proposed fabrication method is very simple compared to flame-based method, and shows low excess insertion losses compared to polishing method. The adiabatic-tapered structure along the coupling region of the coupler shows wavelength independent characteristic over the C-band in optical communication system, and will enable promising applications.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.12
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• pp.2085-2091
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• 2003

An ultrasonic machining process has been known as efficient and economical means fer precision machining of glass or ceramic materials. However, because of its complexity, the mechanism of the machining process is still not well understood. Therefore, it is hard to optimize the process parameters effectively. The conventional ultrasonic machining which uses the abrasive slurry only, furthermore, is time-consuming and gives the relatively rough surface. In order to increase the material removal rate and improve the integrity of the machined surface, we have introduced the novel ultrasonic machining technique, Chemical-assisted UltraSonic Machining(CUSM). The desktop-style micro ultrasonic machine has been developed and the z-axis feed is controlled by the constant load control algorithm. To obtain the chemical effects, the low concentration HF(hydrofluoric acid) solution, which erodes glass, added to alumina slurry. Through various experiments and comparison with conventional results, the superiority of CUSM is verified. MRR increases over 200%, the surface roughness is improved and the machining load decreases dramatically.

• Analytical Science and Technology
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• v.22 no.3
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• pp.247-253
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• 2009

Porous silicon films are electrochemically etched from crystalline silicon wafers in an aqueous solution of hydrofluoric acid(HF). Careful control of etching conditions (current density, etch time, HF concentration) provides films with precise, reproducible physical parameters (morphology, porosity and thickness). The etched pattern could be varied due to (1) current density controls pore size (2) etching time determines depth and (3) complex layered structures can be made using different current profiles (square wave, triangle, sinusoidal etc.). The optical interference spectrum from Fabry-Perot layer has been used for forensic applications, where changes in the optical reflectivity spectrum confirm the identity. We will explore a method of identifying the specific pattern code and can be used for identities of individual code with porous silicon based encoded nanosized smart particles.

• Applied Science and Convergence Technology
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• v.24 no.6
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• pp.289-292
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• 2015

The etching processes of glass in aqueous hydrofluoric acid (HF) solutions were used to improve the current density of solar cell. In this study, the textured glass substrate has been etched by solution and the $TiO_2$ thin films have been prepared on this textured glass. After the $TiO_2$ film deposition the surface has been etched by HF under different concentration and the etched $TiO_2$ thin films had a longer electron lifetime and higher haze ratio as well as light scattering, resulting in 1.7 times increment of dye-sensitized solar-cell(DSSC) efficiency. Increases in the surface root-mean-square roughness of glass substrates from 80 nm to 1774 nm enhanced haze ratio in above 300 nm wavelength. In particular, haze ratio of etched $TiO_2$ films on textured glass showed gradually increasing tendency at 550 nm wavelength by increasing of HF concentration up to 10M, suggesting a formation of crater with various sizes on its surface.