• Journal of Welding and Joining
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• v.32 no.4
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• pp.10-14
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• 2014

Laser aided Direct Metal Tooling(DMT) process is a kind of Additive Manufacturing processes (or 3D-Printing processes), which is developed for using various commercial steel powders such as P20, P21, SUS420, H13, D2 and other non-ferrous metal powders, aluminum alloys, titanium alloys, copper alloys and so on. The DMT process is a versatile process which can be applied to various fields like the mold industry, the medical industry, and the defense industry. Among of them, the application of DMT process to the mold industry is one of the most attractive and practical applications since the conformal cooling channel core of injection molds can be fabricated at the slightly expensive cost by using the hybrid fabrication method of DMT technology compared to the part fabricated with the machining technology. The main objectives of this study are to provide various characteristics of the parts made by DMT process compared to the same parts machined from bulk materials and prove the performance of the injection mold equipped with the conformal cooling channel core which is fabricated by the hybrid method of DMT process.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• Journal of Welding and Joining
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• v.30 no.4
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• pp.44-48
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• 2012

H-beam used for stiffening the upper structure of ocean plant is cut in the various shapes. The cutting process of the H-beam is done manually and requires a long time and high cost. Therefore, automation of H-beam cutting is an important task. This research aims to develop a 3-D simulator to build the automatic H-beam cutting system and to determine the optimal cutting method. The automatic H-beam cutting system composes of 6 robots including 2 cutting robots hang to a crane and 1 conveyer. The appropriate system layout for covering the various sizes and types of H-beam was tested and determined using the simulator. The H-beam cutting system uses a hybrid type of plasma and gas cutting because of special cutting shapes of H-beam. The cutting area of each cutting method should be properly divided according to the size and shape of H-beam to shorten the total cutting time. Additionally the collision between a robot and a robot or a robot and H-beam should be avoided. The optimal cutting method for the shortest cutting time without the collision could be found for the various cutting conditions by use of the simulator. 2 simulation samples shows the availability of the simulator to find the optimal cutting method.

• Composites Research
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• v.36 no.6
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• pp.422-428
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• 2023

The electrical contact resistance between the bipolar plate (BP) and the carbon felt electrode (CFE), which are in contact by the stack clamping pressure, has a great impact on the stack efficiency because of the relatively low clamping pressure of the vanadium redox flow battery (VRFB) stack. In this study, a polyethylene (PE) composite-CFE hybrid bipolar plate structure is developed through a local heat welding process to reduce such contact resistance and improve cell performance. The PE matrix of the carbon fiber composite BP is locally melted to create a direct contact structure between the carbon fibers of CFE and the carbon fibers of BP, thereby reducing the electrical contact resistance. Area specific resistance (ASR) and gas permeability are measured to evaluate the performance of the PE composite-CFE hybrid bipolar plate. In addition, an acid aging test is performed to measure stack reliability. Finally, a VFRB unit cell charge/discharge test is performed to compare and analyze the performance of the developed PE composite-CFE hybrid BP and the conventional BP.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Journal of Welding and Joining
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• v.15 no.1
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• pp.125-134
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• 1997

This study was conducted by L9 orthogonal array to obtain optimum spray parameters for This study was conducted by L9 orthogonal array to obtain optimum spray parameters for $Cr_3C_2 - 7wt%$(80wt%Ni-20wt%Cr) coating powder. The factors were hydrogen flow rate, oxygen flow rate, gun-to-work distance, powder feed rate. And evaluation methods for the coating were surface roughness, oxygen concentration, micro-hardness, pore size and distribution, low angle ($30^{\circ}$) erosion rate, and microstructure of coating. The optimum HVOF spray conditions were proved as follows : hydroen flow rate ; 681 SLPM, oxygen flow rate ; 215 SLPM $H^2/O^2 ratio= 3.16), gun-to-work distance ; 22cm, powder feed rate; 25g/min. The hardness (Hv300) was 1147 and the erosion rate ($30^{\circ}$degree) was $3.16\times10^{-4}$g/g. It is believed that the optimized spray conditions can be improved the wear-resistance and anti-erosion characteristics of the coating.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.90-95
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• 2017

Recently, smaller and lighter products have become of interest in industry applications that increasingly demand thin plate joints of thickness 1.0 mm or less using friction stir welding. In this study, high frequency spindles that run at 3,500-6,500 rpm are introduced for thin friction stir-welded plates. Weldability tests are performed for the butt-joint method of Al5052-H32 alloy of 1.0 mm thickness under 3,500-6,500 rpm spindle revolution with 250-400 mm/min feed speed. An optical microscope was used to analyze the bid structure of the welded zone and stir zone. The tensile-strength and hardness of the welded zone were then measured.

• Journal of Welding and Joining
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• v.23 no.5
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• pp.25-29
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• 2005

Steel has been mainly used in the automotive industry, because of good mechanical properties, weldability and so on. However, there has been increase in using aluminum to reduce the weight of vehicle. This leads to improve fuel efficiency and to reduce air pollution. A steel-aluminum hybrid body structure is recently used not only to reduce the weight of vehicle but also to increase safety. In this paper, the laser beam joining method is suggested to join steel and aluminum. To avoid making brittle intermetallic compounds(IMC) that reduce mechanical properties of the joint area, only aluminum is melted by laser irradiation and wetted on the steel surface. The brittle IMC layer is formed with small thickness at the interface between steel and aluminum. By controlling the process parameters, brittle IMC layer thickness is suppressed under 10 micrometers which is a criterion to maintain good mechanical properties.

• Journal of Welding and Joining
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• v.34 no.6
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• pp.55-61
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• 2016

Recently developed ferritic heat resistance steel, T24 was used to evaluate microstructure characteristics of simulated heat affected zone. Also, correlation between the prior austenite grain size and amount of $M_{23}C_6$ carbide dissolution was discussed. With the increasing of peak temperature, Grain size steadily increased up to $1050^{\circ}C$ and then rapidly increased at $1150^{\circ}C$. Of the peak temperature $950{\sim}1050^{\circ}C$, amounts of $M_{23}C_6$carbide dissolution are low. But Most of $M_{23}C_6$ carbide that is inhibited grain growth were dissolved above $1050^{\circ}C$ and decreased volume fraction of carbide. This indicates that grain growth may be achieved through dissolution of carbide in the base material. As of welding, due to very rapid heating rate, $M_{23}C_6$ carbide exists above equilibrium solution temperature that is $800^{\circ}C$, even at $1050^{\circ}C$. So, It was confirmed that close correlation between carbide dissolution in the base material and grain growth. Calculated grain size has a linear relationship with peak temperature, on the other hand, measured grain size discontinuously increased between $950{\sim}1050^{\circ}C$ and above $1050^{\circ}C$. Grain size of heat affected zone at $1350^{\circ}C$ peak temperature showed maximum 67um and minimum 4um. Also, The number of side showed 3 to 10.

• Korean Journal of Materials Research
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• v.19 no.12
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• pp.692-698
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• 2009

Inconel 718 alloy has excellent mechanical properties at room temperature, high temperature and cryogenic conditions. UTS of base metal is about 900MPa at room temperature; this is increased up to 1300MPa after heat treatment & aging-hardening. Mechanical properties of Inconel 718 Alloy were similar to those shown in the the results for tensile test; mechanical properties of Inconel 718 alloy's GTAW were similar to those of base metal's properties at room temperature. Mechanical properties at cryogenic conditions were better than those at room temperature. Heat-treated Inconel 718, non- filler metal GTAW on Inconel 718 and GTAW used filler metal on Inconel 718's UTS was 1400MPa at cryogenic condition. As a result, the excellent mechanical properties of Inconel 718 alloy under cryogenic conditions was proved through tensile tests under cryogenic conditions. In addition, weldability of Inconel 718 alloy under cryogenic conditions was superior to that of its base-metal. In this case, UTS of hybrid joint (IS-G) at -100$^{\circ}C$ was 900MPa. Consequently, UTS of Inconel 718 alloy is estimated to increase from -100$^{\circ}C$ to a specific temperature below -100$^{\circ}C$. Therefore, Inconel 718 alloy is considered a pertinent material for the production of Lox Pipe under cryogenic conditions.