• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.663-664
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• 2010

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• 대한치과보철학회지
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• 제54권3호
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• pp.193-202
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• 2016

목적: 본 연구에서는 치과용 CAD-CAM (computer aided design-computer aided manufacturing) hybrid 수복재료인 LAVA Ultimate와 VITA ENAMIC을 광중합 복합레진을 사용하여 수리할 때 표면처리방법(grinding, air abrasion with aluminum oxide, HF acid)과 접착재료(Adper Single Bond 2, Single Bond Universal)의 종류가 두 재료 사이의 전단결합강도에 어떠한 영향을 미치는지 알아보고자 하였다. 재료 및 방법: LAVA Ultimate와 VITA ENAMIC 시편을 30일간 $37^{\circ}C$의 인공타액(Xerova solution)에 보관하여 시효처리를 실시한 후 각각 SiC paper grinding한 것, grinding 후 air abrasion처리를 추가한 것, grinding 후 HF 처리한 것으로 분류하고 각각 no bonding, Adper Single Bond 2, 또는, Single Bond Universal 도포로 세분하여 9개의 group, 총 18개의 subgroup으로 나누어 실험을 실시하였다(N=10). HF 처리group에서는 도재시편을 대조군으로 추가하였다(N=10). 표면 처리 후 광중합 복합레진(Filtek Z250)을 각각의 시편에 부착하고 이를 1주일간 실온의 물에 침적시켰고 이후 전단결합강도를 측정하고 파절양상 및 표면처리 효과를 SEM으로 확인하였다. One-way ANOVA를 이용하여 group 간의 유의성을 분석하였고 사후 분석으로 Scheffe test를 실시하였다(${\alpha}=.05$). 결과: 실험 결과 접착재료 처리를 한 group들이 접착재료 처리를 하지 않은 group에 비해 모든 표면처리에서 더 높은 전단결합력을 나타내었으며, 표면처리만 시행한 group에서는 aluminum oxide air abrasion이 전단결합력의 증가에 약간의 영향을 미치는 것으로 나타났으나 통계적 유의성은 보이지 않았다. 결론: LAVA Ultimate와 VITA ENAMIC의 두 재료를 광중합 복합레진을 이용하여 수리를 실시할 경우 각각의 재료에 적합한 표면처리방법과 접착재료의 선택에 대한 연구가 더 필요할 것으로 사료된다. 특히 LAVA Ultimate의 경우 접착재료의 사용은 추천된다고 사료되었다.

• 한국분말재료학회지
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• 제21권3호
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• pp.196-201
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• 2014

In this study, nanocrystalline Cu-Ni bulk materials with various compositions were cold compacted by a shock compaction method using a single-stage gas gun system. Since the oxide layers on powder surface disturbs bonding between powder particles during the shock compaction process, each nanopowder was hydrogen-reduced to remove the oxide layers. X-ray peak analysis shows that hydrogen reduction successfully removed the oxide layers from the nano powders. For the shock compaction process, mixed powder samples with various compositions were prepared using a roller mixer. After the shock compaction process, the density of specimens increased up to 95% of the relative density. Longitudinal cross-sections of the shock compacted specimen demonstrates that a boundary between two powders are clearly distinguished and agglomerated powder particles remained in the compacted bulk. Internal crack tended to decrease with an increase in volumetric ratio of nano Cu powders in compacted bulk, showing that nano Cu powders has a higher coherency than nano Ni powders. On the other hand, hardness results are dominated by volume fraction of the nano Ni powder. The crystalline size of the shock compacted bulk materials was greatly reduced from the initial powder crystalline size since the shock wave severely deformed the powders.

• Applied Microscopy
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• 제46권1호
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• pp.37-44
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• 2016

In this study $TiO_2$/reduced graphene oxide ($TiO_2/rGO$) bipyramid with tunable nanostructure was fabricated by two-step solvothermal process and subsequent heat-treatment in air. The as-synthesized anatase $TiO_2$ nanocrystals possessed morphological bipyramid with exposed dominantly by (101) facets. Polyethylenimine was utilized during the combination of $TiO_2$ and graphene oxide (GO) to tune the surface charge, hindering the restack of graphene during solvothermal process and resulting in 1 to 5 layers of rGO wrapped on $TiO_2$ surface. After a further calcination, a portion of carbon quantum dots (CQDs) with a diameter about 2 nm were produced owing to the oxidizing and cutting of rGO on $TiO_2$. The as-prepared $TiO_2/rGO$ hybrid showed a highly photocatalytic activity, which is about 3.2 and 7.7 times enhancement for photodegradation of methyl orange with compared to pure $TiO_2$ and P25, respectively. We assume that the improvement of photocatalysis is attributed to the chemical bonding between rGO/CQDs and $TiO_2$ that accelerates photogenerated electron-hole pair separation, as well as enhances light harvest.

• The Journal of Advanced Prosthodontics
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• 제12권1호
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• pp.22-32
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• 2020

PURPOSE. The aim of this study was to evaluate the microshear bond strength (µSBS) of four computer-aided design/computer-aided manufacturing (CAD/CAM) blocks repaired with composite resin using three different surface treatment protocols. MATERIALS AND METHODS. Four different CAD/CAM blocks were used in this study: (1) flexible hybrid ceramic (FHC), (2) resin nanoceramic (RNC), (c) polymer infiltrated ceramic network (PICN) and (4) feldspar ceramic (FC). All groups were further divided into four subgroups according to surface treatment: control, hydrofluoric acid etching (HF), air-borne particle abrasion with aluminum oxide (AlO), and tribochemical silica coating (TSC). After surface treatments, silane was applied to half of the specimens. Then, a silane-containing universal adhesive was applied, and specimens were repaired with a composite, Next, µSBS test was performed. Additional specimens were examined with a contact profilometer and scanning electron microscopy. The data were analyzed with ANOVA and Tukey tests. RESULTS. The findings revealed that silane application yielded higher µSBS values (P<.05). All surface treatments were showed a significant increase in µSBS values compared to the control (P<.05). For FHC and RNC, the most influential treatments were AlO and TSC (P<.05). CONCLUSION. Surface treatment is mandatory when the silane is not preferred, but the best bond strength values were obtained with the combination of surface treatment and silane application. HF provides improved bond strength when the ceramic content of material increases, whereas AlO and TSC gives improved bond strength when the composite content of material increases.