• Title/Summary/Keyword: Hybrid Oxide Bonding

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Cu-SiO2 Hybrid Bonding (Cu-SiO2 하이브리드 본딩)

  • Seo, Hankyeol;Park, Haesung;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.17-24
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    • 2020
  • As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO2 hybrid bonding.

Shear bond strength of dental CAD-CAM hybrid restorative materials repaired with composite resin (치과용 복합레진으로 수리된 CAD-CAM hybrid 수복물의 전단결합강도)

  • Moon, Yun-Hee;Lee, Jonghyuk;Lee, Myung-Gu
    • The Journal of Korean Academy of Prosthodontics
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    • v.54 no.3
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    • pp.193-202
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    • 2016
  • Purpose: This study was performed in order to assess the effect of the surface treatment methods and the use of bonding agent on the shear bond strength (SBS) between the aged CAD-CAM (computer aided design-computer aided manufacturing) hybrid materials and added composite resin. Materials and methods: LAVA Ultimate (LU) and VITA ENAMIC (VE) specimens were age treated by submerging in a $37^{\circ}C$ water bath filled with artificial saliva (Xerova solution) for 30 days. The surface was ground with #220 SiC paper then the specimens were divided into 9 groups according to the combination of the surface treatment (no treatment, grinding, air abrasion with aluminum oxide, HF acid) and bonding agents (no bonding, Adper Single Bond 2, Single Bond Universal). Each group had 10 specimens. Specimens were repaired (added) using composite resin (Filtek Z250), then all the specimens were stored for 7 days in room temperature distilled water. SBS was measured and the fractured surfaces were observed with a scanning electron microscope (SEM). One-way ANOVA and Scheffe test were used for statistical analysis (${\alpha}=.05$). Results: Mostly groups with bonding agent treatment showed higher SBS than groups without bonding agent. Among the groups without bonding agent the groups with aluminum oxide treatment showed higher SBS. However there was no significant difference between groups except two subgroups within LU group, which revealed a significant increase of SBS when Single Bond Universal was used on the ground LU specimen. Conclusion: The use of bonding agent when repairing an aged LAVA Ultimate restoration is recommended.

Manufacturing and Evaluation of the Properties of Hybrid Bulk Material by Shock-compaction of Nanocrystalline Cu-Ni Mixed Powder (나노 구리-니켈 혼합분말의 충격압축법을 통한 복합벌크재의 제조 및 특성평가)

  • Kim, Wooyeol;Ahn, Dong-Hyun;Park, Lee Ju;Kim, Hyoung Seop
    • Journal of Powder Materials
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    • v.21 no.3
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    • pp.196-201
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    • 2014
  • In this study, nanocrystalline Cu-Ni bulk materials with various compositions were cold compacted by a shock compaction method using a single-stage gas gun system. Since the oxide layers on powder surface disturbs bonding between powder particles during the shock compaction process, each nanopowder was hydrogen-reduced to remove the oxide layers. X-ray peak analysis shows that hydrogen reduction successfully removed the oxide layers from the nano powders. For the shock compaction process, mixed powder samples with various compositions were prepared using a roller mixer. After the shock compaction process, the density of specimens increased up to 95% of the relative density. Longitudinal cross-sections of the shock compacted specimen demonstrates that a boundary between two powders are clearly distinguished and agglomerated powder particles remained in the compacted bulk. Internal crack tended to decrease with an increase in volumetric ratio of nano Cu powders in compacted bulk, showing that nano Cu powders has a higher coherency than nano Ni powders. On the other hand, hardness results are dominated by volume fraction of the nano Ni powder. The crystalline size of the shock compacted bulk materials was greatly reduced from the initial powder crystalline size since the shock wave severely deformed the powders.

Tunable Nanostructure of TiO2/Reduced Graphene Oxide Composite for High Photocatalysis

  • He, Di;Li, Yongli;Wang, Jinshu;Yang, Yilong;An, Qier
    • Applied Microscopy
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    • v.46 no.1
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    • pp.37-44
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    • 2016
  • In this study $TiO_2$/reduced graphene oxide ($TiO_2/rGO$) bipyramid with tunable nanostructure was fabricated by two-step solvothermal process and subsequent heat-treatment in air. The as-synthesized anatase $TiO_2$ nanocrystals possessed morphological bipyramid with exposed dominantly by (101) facets. Polyethylenimine was utilized during the combination of $TiO_2$ and graphene oxide (GO) to tune the surface charge, hindering the restack of graphene during solvothermal process and resulting in 1 to 5 layers of rGO wrapped on $TiO_2$ surface. After a further calcination, a portion of carbon quantum dots (CQDs) with a diameter about 2 nm were produced owing to the oxidizing and cutting of rGO on $TiO_2$. The as-prepared $TiO_2/rGO$ hybrid showed a highly photocatalytic activity, which is about 3.2 and 7.7 times enhancement for photodegradation of methyl orange with compared to pure $TiO_2$ and P25, respectively. We assume that the improvement of photocatalysis is attributed to the chemical bonding between rGO/CQDs and $TiO_2$ that accelerates photogenerated electron-hole pair separation, as well as enhances light harvest.

Effect of surface treatments and universal adhesive application on the microshear bond strength of CAD/CAM materials

  • Sismanoglu, Soner;Gurcan, Aliye Tugce;Yildirim-Bilmez, Zuhal;Turunc-Oguzman, Rana;Gumustas, Burak
    • The Journal of Advanced Prosthodontics
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    • v.12 no.1
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    • pp.22-32
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    • 2020
  • PURPOSE. The aim of this study was to evaluate the microshear bond strength (µSBS) of four computer-aided design/computer-aided manufacturing (CAD/CAM) blocks repaired with composite resin using three different surface treatment protocols. MATERIALS AND METHODS. Four different CAD/CAM blocks were used in this study: (1) flexible hybrid ceramic (FHC), (2) resin nanoceramic (RNC), (c) polymer infiltrated ceramic network (PICN) and (4) feldspar ceramic (FC). All groups were further divided into four subgroups according to surface treatment: control, hydrofluoric acid etching (HF), air-borne particle abrasion with aluminum oxide (AlO), and tribochemical silica coating (TSC). After surface treatments, silane was applied to half of the specimens. Then, a silane-containing universal adhesive was applied, and specimens were repaired with a composite, Next, µSBS test was performed. Additional specimens were examined with a contact profilometer and scanning electron microscopy. The data were analyzed with ANOVA and Tukey tests. RESULTS. The findings revealed that silane application yielded higher µSBS values (P<.05). All surface treatments were showed a significant increase in µSBS values compared to the control (P<.05). For FHC and RNC, the most influential treatments were AlO and TSC (P<.05). CONCLUSION. Surface treatment is mandatory when the silane is not preferred, but the best bond strength values were obtained with the combination of surface treatment and silane application. HF provides improved bond strength when the ceramic content of material increases, whereas AlO and TSC gives improved bond strength when the composite content of material increases.