• Journal of Electrical Engineering and Technology
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• v.7 no.3
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• pp.312-319
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• 2012

The life of a power transformer is dependent on the life of the cellulose paper, which influenced by the hot spot temperature. Thus, the determination of the cellulose paper's life requires identifying the hot spot temperature of the transformer. Currently, however, the power transformer uses a heat run test is used in the factory test to measure top liquid temperature rise and average winding temperature rise, which is specified in its specification. The hot spot temperature is calculated by the winding resistance detected during the heat run test. This paper measures the hot spot temperature in the single-phase, 154kV, 15/20MVA power transformer by the optical fiber sensors and compares the value with the hot spot temperature calculated by the conventional heat run test in the factory test. To measure the hot spot temperature, ten optical fiber sensors were installed on both the high and low voltage winding; and the temperature distribution during the heat run test, three thermocouples were installed. The hot spot temperature shown in the heat run test was $92.6^{\circ}C$ on the low voltage winding. However, the hot spot temperature as measured by the optical fiber sensor appeared between turn 2 and turn 3 on the upper side of the low voltage winding, recording $105.9^{\circ}C$. The hot spot temperature of the low voltage winding as measured by the optical fiber sensor was $13.3^{\circ}C$ higher than the hot spot temperature calculated by the heat run test. Therefore, the hot spot factor (H) in IEC 60076-2 appeared to be 2.0.

• Journal of Electrical Engineering and Technology
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• v.8 no.1
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• pp.156-162
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• 2013

This paper measures the hot spot temperatures in a single-phase, 154 kV, 15/20 MVA power transformer filled with natural ester fluid using optical fiber sensors and compares them with those calculated by conventional heat run tests. A total of 14 optical fiber sensors were installed on the high-voltage and low-voltage windings to measure the hot spot temperatures. In addition, three thermocouples were installed in the transformer to measure the temperature distribution during the heat run tests. In the low-voltage winding, the hot spot temperature was $108.4^{\circ}C$, calculated by the conventional heat run test. However, the hot spot temperature measured using the optical fiber sensor was $129.4^{\circ}C$ between turns 2 and 3 on the upper side of the low-voltage winding. Therefore, the hot spot temperature of the low-voltage winding measured using the optical fiber sensor was $21.0^{\circ}C$ higher than that calculated by the conventional heat run test.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.154-161
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• 2007

Hot spot phenomenon that occurs, during judder vibration, is locally concentrated heat due to friction between brake disk and pad. It is important to understand the reason behind hot spot phenomenon, for reduction of judder vibration. In this experimental study, experiments were performed in accordance with rotation speed of brake disk, pressure of master cylinder and pad length for achieving different aspects of hot spot phenomenon. Temperature distribution of hot spot was obtained by using the infrared camera. As the hot spot occurred, vibration was measured and frequency analysis was performed. Finite element analysis of thermal deformation of disk was performed by using temperature distribution that was achieved by experimental results. And mode shapes of disk was analyzed by finite element analysis and compared with experimental results. It was observed that the excitation frequency band of frictional contact and frictional force mainly affects the hot spot phenomenon.

• Tribology and Lubricants
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• v.19 no.5
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• pp.268-273
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• 2003

This paper presents hot spot behaviors on the rubbing surface of disk-pad type brake by using coupled thermal-mechanical analysis technique. The height of micro-asperity on the rubbing surface is usually 2∼3 ${\mu}$m in practical disk brakes. Non-uniform micro-contacts between the disk and the rigid friction pads lead to high local temperature distributions, which may cause the material degradation, and develop hot spots, thermal cracks, and brake system failure at the end for a braking period. The friction temperatures on the rubbing surface of disk brakes in which are strongly related to the hot spot and thermal related wears are rapidly concentrated on the micro-contact asperities during braking. The computed FEM results show that the contact stress, friction induced temperature and thermal strain are highly concentrated on the rubbing micro-contact asperities even though the braking speed and force are small during the braking period. This hot spot may directly produce the slippage and various thermal wears on the brake-rubbing surface.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.9
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• pp.26-32
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• 2012

This paper calculates the core and copper losses as heating sources of a 24MVA cast resin transformer, and analyzes the thermal distribution of the transformer to find out its hot-spot area by FEM program. Since the winding of the transformer is composed with many series and parallel circuits, the analyzing model of the winding is simplified and modelled by axi-symmetric domain. As the results, the maximum temperature is estimated by $137^{\circ}C$ in the upper part of the low-voltage winding. The maximum temperature has discrepancy of approximately $10^{\circ}C$, which is able to be considered as an acceptable error range in the design stage of power transformers. For the overall pattern of the temperature distribution is almost same as test results, the analyzing method can be a useful tool to find out a hot-spot area of the winding.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.229-230
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• 2002

This paper presents the hot spot behaviors on the rubbing surface of ventilated disk brake by using finite element method. The depth of asperities on the rubbing surface is usually $2-3\;{\mu}m$ so the real contact area is microscopically. Non-uniform contacts between the disk and the pads lead to high local temperatures, which may cause the material degradation, and develops hot spots, thermal cracking, and brake system failures at the end. High contact asperity flash temperatures in rubbing systems, which is strongly related to the hot spot. It was generally known that high temperature over about $700^{\circ}C$ may form martensite on the cast iron which is material for automotive disk brakes. In this paper, the contact stress, temperature distribution and strain have been presented for the specific asperities of real contact area microscopically by using coupled thermal-mechanical analysis technique.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2449-2452
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• 2007

Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

• 한국태양에너지학회:학술대회논문집
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• 2008.04a
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• pp.241-246
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• 2008

In this paper, we analyze the I-V curve and hot-spot phenomenon caused by solar cells' serial and parallel connected circuit. The mis-match loss of parallel interconnection with low Isc string decrease lower than serially interconnected one and temperature caused by hot-spot does. Also, mis-match loss of parallel interconnection with low Voc string increase more than serially interconnected one. The string having low Voc happened hot-spot phenomenon when open circuit. The bad solar cell in string gives revere bias to good solar cell and make hot-spot phenomenon. If we consider the mis-match loss, when designing PV module and array. the efficiency of PV system might increase.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.5
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• pp.705-712
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• 2003

Analysis for the thermal stress distribution in the laminated plates containing a hot-spot(local heating region) is performed. It is assumed that the local heating region induces only mechanical stress by the thermal expansion but effect of the thermal conduction is neglected. The region is regarded equivalent to a homogeneous inclusion expanding in a laminated medium. As an example, Au/YBCO/Al$_2$O$_3$laminate which is often employed for High Temperature Superconducting Fault Current Limiter(HTS FCL) has been analyzed. Effects of heat input, thickness of each layer and the got spot size upon the stress distribution in the hot-spot have been investigated. For a constant heat generation into the hot-spot, as the thickness of the Al$_2$O$_3$substrate increases, the stress in the YBCO layer is peculiarly oscillated, and the curvature of laminate has a maximum at a certain thickness of the Al$_2$O$_3$.

• Korean Chemical Engineering Research
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• v.45 no.1
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• pp.12-16
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• 2007

Temperature control of an autothermal methanol reforming reactor which uses the copper-zinc oxide catalyst was studied. Temperature at 1cm below the hot-spot point in the reactor was used for the controlled variable, and the air flow rate was used for the manipulated variable. A first order plus time delay model was identified and controller parameters were obtained by applying the IMC-PI tuning rule to the identified model. With this controller, we could control the reforming reactor temperature within ${\pm}5^{\circ}C$ over 100 hours. Change of the hot-spot point due to the catalyst degradation was investigated and it could be used to design an adaptive controller.