• Title/Summary/Keyword: Hole-filling

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Hole-Filling Method Using Extrapolated Spatio-temporal Background Information (추정된 시공간 배경 정보를 이용한 홀채움 방식)

  • Kim, Beomsu;Nguyen, Tien Dat;Hong, Min-Cheol
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.8
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    • pp.67-80
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    • 2017
  • This paper presents a hole-filling method using extrapolated spatio-temporal background information to obtain a synthesized view. A new temporal background model using non-overlapped patch based background codebook is introduced to extrapolate temporal background information In addition, a depth-map driven spatial local background estimation is addressed to define spatial background constraints that represent the lower and upper bounds of a background candidate. Background holes are filled by comparing the similarities between the temporal background information and the spatial background constraints. Additionally, a depth map-based ghost removal filter is described to solve the problem of the non-fit between a color image and the corresponding depth map of a virtual view after 3-D warping. Finally, an inpainting is applied to fill in the remaining holes with the priority function that includes a new depth term. The experimental results demonstrated that the proposed method led to results that promised subjective and objective improvement over the state-of-the-art methods.

A study on the Additive Decomposition Generated during the Via-Filling Process (Via-Filling 공정시 발생하는 첨가제 분해에 관한 연구)

  • Lee, Min Hyeong;Cho, Jin Ki
    • Journal of the Korean institute of surface engineering
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    • v.46 no.4
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    • pp.153-157
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    • 2013
  • The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

Nonlinear Control of an Automatic Transmission Using Sliding Mode (슬라이딩모드를 이용한 자동변속기의 비선형제어)

  • 조승호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.3
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    • pp.605-614
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    • 1995
  • In the automatic transmission using planetary gear there exists nonlinearities due to the finite difference between gear ratios, which yield torque hole during shift and influence on the ride quality and life of clutch. Based on the reaction carrier and converter turbine speed sliding functions are defined. Nonlinear closed-loop control laws are derived using them. Computer simulation shows that the closed loop design is better than the open loop design and semi-closed loop design.

Hole filling for Kinect depth-image according to the causes of the holes (Kinect 깊이 영상의 홀 발생 원인 분류에 따른 홀필링)

  • Park, Yoon Su;Yun, Seok Min;Won, Chee Sun
    • Proceedings of the Korean Society of Broadcast Engineers Conference
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    • 2012.07a
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    • pp.75-78
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    • 2012
  • 본 논문에서는 키넥트(Kinect)에서 깊이 영상 생성 시 발생하는 홀(hole)들의 물리적 원인에 대해 분석하고, 원인에 따라 홀을 분류한다. 즉, 실험 영상을 통해 키넥트 적외선 패턴의 유무를 확인할 수 있으며 이를 이용하여 깊이 영상에서 나타나는 홀의 물리적 발생 원인을 확인 할 수 있다. 분류된 각각의 홀의 종류에 따라 각 홀에 적합한 홀필링 방법에 대해 논의한다.

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Optimal Ply Design of Laminated Composite Plate with a Hole Considering Vibration (진동을 고려한 원공복합적층판의 최적적층설계)

  • 홍도관;김동영;최경호;안찬우
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.13 no.6
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    • pp.423-429
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    • 2003
  • On this study. we improved the efficiency applying algorithm that is repeatedly using table of orthogonal array in discrete design space and filling a defect of gradient method in continuous design space. we showed optimal ply angle that maximized 1st natural frequency of CFRP laminated composite plate without a hole and with a hole by each aspect ratio. In the case of CFRP laminated composite plate without a hole, we confirmed the reliance and efficiency of algorithm in comparison with the result of optimization achievement repeatedly using statistical table of orthogonal array of experimental design and the BFGS optimal design method.

Filling Holes in Large Polygon Models Using an Implicit Surface Scheme and the Domain Decomposition Method

  • Yoo, Dong-Jin
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.1
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    • pp.3-10
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    • 2007
  • A new approach based on implicit surface interpolation combined with domain decomposition is proposed for filling complex-shaped holes in a large polygon model, A surface was constructed by creating a smooth implicit surface from an incomplete polygon model through which the actual surface would pass. The implicit surface was defined by a radial basis function, which is a continuous scalar-value function over the domain $R^{3}$. The generated surface consisted of the set of all points at which this scalar function is zero. It was created by placing zero-valued constraints at the vertices of the polygon model. The well-known domain decomposition method was used to treat the large polygon model. The global domain of interest was divided into smaller domains in which the problem could be solved locally. The LU decomposition method was used to solve the set of small local problems; the local solutions were then combined using weighting coefficients to obtain a global solution. The validity of this new approach was demonstrated by using it to fill various holes in large and complex polygon models with arbitrary topologies.

Primitive Based Hole Filling with Silhouette Edge (프리미티브 기반의 윤곽선을 이용한 홀 채우기)

  • 이수현;윤경현
    • Proceedings of the Korea Multimedia Society Conference
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    • 2003.05b
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    • pp.460-463
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    • 2003
  • 본 논문은 프리미티브 모델을 바탕으로 윤곽선 추출하여 효율적으로 홀 채워서 결과 영상의 질과 속도를 향상시키는 알고리즘을 제시한다. 이 알고리즘은 입력 영상에서 뷰의 위치와 방향이 바뀌어 홀이 발생하면 그 홀을 동일 프리미티브의 윤곽선을 이용하여 프리미티브 내의 영상 정보만을 이용하므로 이질감이 작고 홀 주위의 모든 점들의 영상 정보를 이용하여 결과 영상의 질을 향상 시켰다.

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A Study on the Improvement Buckling Strength of Laminated Composite Plate by Taguchi Method (다구찌법을 이용한 복합적층판의 좌굴강도 개선에 관한 연구)

  • 구경민;홍도관;김동영;박일수;안찬우;한근조
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1362-1365
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    • 2003
  • On this study. we improved the efficiency applying algorithm that is repeatedly using orthogonal array in discrete design space and filling a defect of gradient method in continuous design space. we showed optimal ply angle that maximized buckling strength of CFRP laminated composite plate without a hole and with a hole by each aspect ratio. In the case of CFRP laminated composite plate without a hole, we confirmed the reliance and efficiency of algorithm in comparison with the result optimization achievement repeatedly using statistical orthogonal array of experimental design.

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A Study on the Void Free of Via Hole Filling by Vacuum Printing Method in PCB (PCB 인쇄에서 진공인쇄 방식에 의한 Via Hole 충전의 Void Free에 관한 연구)

  • Mok, Jee-Soo;Kim, Ki-Hwan;Youn, Jong-Tae
    • Journal of the Korean Graphic Arts Communication Society
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    • v.24 no.1
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    • pp.35-44
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    • 2006
  • 본 연구에서는 PCB에 진공인쇄 방식이 적용된 스크린 인쇄방법을 이용하여 Pattern 및 Hole충전의 신뢰성을 향상시킬 수 있는 기술을 적용하였다. 새로운 dry process 기술인 직접회로 인쇄 기술은 일반적으로 사용되고 있는 wet process 중 도금, 에칭, 박리 등의 공정을 줄일 수 있어 제조원가, 공정 리드타임 감소, 폐기물 감소로 환경 친화적 공정이라고 할 수 있다. 직접회로 인쇄는 진공도 100 Pa, 인쇄압력 0.45 MPa, 인쇄 속도 30 mm/sec, 인쇄각도 85도, 스크린 마스크와 기판 사이의 Gap 2 mm에서 인쇄될 때 가장 좋은 결과를 보였다. 직접회로 인쇄에 사용된 인쇄기는 일반 PCB공정에서 사용되는 동일한 형태에 진공조건을 유지시킬 수 있도록 개선하여 사용하였다.

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