• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.141-149
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• 2017

Due to the inaccuracy of micro-machining, various special processing methods have been investigated recently. Among them, pulse electrochemical machining is a promising machining method with the advantage of no residual stress and thermal deformation. Because the cross section of the wire electrode used in this study is circular, wire-pulse electrochemical machining is suitable for micro-hole machining. By applying the response surface methodology, the experimental plan was made of three factors and three levels: machining time, duty factor, and voltage. The regression equation was obtained through experiments. Then, by referring to the main effect diagram, we fixed the duty factor and machining time with little relevance, and solved the equation for the target 900 microns to obtain the voltage value. The results obtained from the response surface methodology were approximately those of the target value when the actual experiment was carried out. Therefore, it is concluded that the optimal conditions for hole processing can be obtained by the response surface methodology.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Journal of KIISE:Databases
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• v.35 no.1
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• pp.67-83
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• 2008

In order to realize ubiquitous computing, it is essential to efficiently use the resources and the computing power of mobile devices. Among others, memory efficiency, energy efficiency, and processing efficiency are required in executing the softwares embedded in mobile devices. In this paper, query processing over XML data in a mobile device where resources are limited is addressed. In a device with limited amount of memory, the techniques of XML. stream query processing need to be employed to process queries over a large volume of XML data Recently, a technique Galled XFrag was proposed whereby XML data is fragmented with the hole-filler model and streamed in fragments for processing. With XFrag, query processing is possible in the mobile device with limited memory without reconstructing the XML data out of its fragment stream. With the hole-filler model, however, memory efficiency is not high because the additional information on holes and fillers needs to be stored. In this paper, we propose a new technique called XFLab whereby XML data is fragmented with the XML labeling scheme which is for representing the structural relationship in XML data, and streamed in fragments for processing. Through implementation and experiments, XML showed that our XFLab outperformed XFrag both in memory usage and processing time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.12
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• pp.1984-1991
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• 1997

Recently burr technology is rising in the fields of the precision manufacturing and the high quality machining, deburring has treated as a difficult problem on going to the high efficiency, automation in the FMS. Removal of burr with various shapes, dimensions and properties couldn't be standardized and has depended on manual treatment. Especially, deburring for cross hole inside owing to passing through out perpendicular to a main hole is more difficult, the electrochemical method is proper as its solution at practical aspects. Burr elimination in the cross hole drilling of governor shaft used in the automobile engine so far has been worked by a manual post-processing by a skillful worker, which becomes a factor of productivity-down and cost-up so that improvement of machining process is needed. Therefore, for the high efficiency and automation of internal deburring in the cross hole, development of electrochemical deburring technology is needed. So, the new process in the burr treatment is supposed. In this study, characteristics of electrochemical deburring through experiments were identified and factors such as electrolytic gap and electorlytic fluid contributed to removal burr height were analyzed. Also, deburring efficiency and electrolytic performance for cross hole were examined according to electrolytic current and electrochemical deburring condition corresponding to acquired edge quality was found out.

• Proceedings of the Korea Information Processing Society Conference
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• 2016.10a
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• pp.783-784
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• 2016

천공위치 안내 시스템은 천공작업 Hole의 정확한 위치를 추적하는 시스템이다. 천공작업의 정확성과 안정성, 그리고 장비 조작의 용이성을 위하여 범지구 위성 항법 시스템(Global navigation satellite system, GNSS)을 이용하여 지표면의 천공위치를 찾아주는 안내 시스템을 연구 개발하였다.

• Design & Manufacturing
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• v.15 no.4
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1517-1521
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• 2007

On this study, technical aspects were reviewed to drill a series of micro holes (${\phi}$0.10) over 200 within a few micron tolerance in diameter and position on the stainless steel material. Dedicated tools & jigs were designed and manufactured and optimum cutting conditions were found. On this micro hole drilling process, guide drill and step feeding were applied to help chip discharge, prevent drill breakage and finally improve the accuracy of positioning and roundness. The processing results indicated that most holes are distributed within a few micron tolerance in diameter and position intervals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1112-1117
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• 2006

The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.9
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• pp.400-406
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• 2003

Efficient electrodes are devised for organic luminescent device(OLED). ITO electrode is treated with $O_2$ plasma. In order to inject hole efficiently, there is proposed the shape of anode that inserted plasma polymerized films as buffer layer between anode and organic layer using thiophene monomer. In the case of device inserted the buffer layer by using the plasma polymerization after $O_2$ plasma processing for ITO transparent electrode, since it forms the stable interface and reduce the moving speed of hole, the recombination of hole and electronic are made in the emitting layer. Therefore it realized the device capability of two times in the aspect of luminous efficiency than the device which do not be inserted the buffer layer. Experiments are limited to the device that has the structure of TPD/$AIq_3$, however, the aforementioned electrodes can similarly applied to the organic luminous device and the Polymer luminous device.