• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.237-240
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• 2003

Gas turbines are extensively used in flight propulsion, electrical power generation, and other industrial applications. During its life span, a turbine blade is taken out periodically for repair and maintenance. This includes re-coating the blade surface and re-drilling the cooling holes/channels. A successful laser re-drilling requires the measurement of a hole within the accuracy of ${\pm}0.15mm$ in position and ${\pm}3^{\circ}$ in orientation. Detection of gas turbine blade/vane cooling hole position and orientation thus becomes a very important step for the vane/blade repair process. The industry is in urgent need of an automated system to fulfill the above task. This paper proposes approaches and algorithms to detect the cooling hole position and orientation by using a vision system mounted on a robot arm. The channel orientation is determined based on the alignment of the vision system with the channel axis. The opening position of the channel is the intersection between the channel axis and the surface around the channel opening. Experimental results have indicated that the concept of cooling hole identification is feasible. It has been shown that the reproducible detection of cooling channel position is with +/- 0.15mm accuracy and cooling channel orientation is with +/$-\;3^{\circ}$ with the current test conditions. Average processing time to search and identify channel position and orientation is less than 1 minute.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• Design & Manufacturing
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• v.11 no.1
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• pp.1-6
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• 2017

In these days, due to generalization of using smart mobile phone and wearable device such as smart watch, demand of Cover-glass and touch screen panel for protecting display increases. With increasing the demand of Cover-glass, slimming technique is promising for weight lightening, zero bezel. Cover-glass produced by this technique is required to decreasing thickness with increase strength. In the Cover-glass manufacturing process, mechanical processing and chemical processing has improve in the strength. Generally, Diamond electrodeposition wheel is used in mechanical process. Reinforced glass with the characteristics of the brittle and high hardness was manufactured by using a diamond electrodeposition wheel. At this time, Because of surface of the tool present non-uniform distribution of diamond particle, it has generate Loading of wheel and it has been decrease life of grinding tool, efficiency of grinding, quality and shape accuracy of workpiece. Thus Research is needed to controling particle distribution of diamond electrodeposition wheel uniformly. And it is necessary to study micro hole machining such as proximity senser hole, speaker hole positioned Cover-glass. Reinforced glass with the characteristics of the brittle and high hardness is difficult to machining. Processing of reinforced glass have generated wear of tool, micro cracks. Also, it is decreasing shape accuracy. In this paper, We conducted a study on how to control particle distribution uniformly about the diamond tool manufactured using elecetodeposition processing. It analyzed the factors that affect the arrangement of the particles in the electrodeposition process by design of experiment. And There is produced the grinding tool, which derives an optimum deposition conditions, for processing Cover-glass edge and the machinability was evaluated.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.48-52
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• 2004

Ultrasonic machining is effective for machining of extreme hard and brittle materials, including glass, ceramic, carbide, graphite. The major machining principle involves the direct hammering as well as the impact of abrasive panicles on the workpiece. Also, it involve cavitation erosion. The general workpiece is flat side. This study attempted micro hole machining of a curved surface of glass tube. Ultrasonic machining is fault of the slow machining speed. An experiment does and got 16 seconds validity machining time as increasing the processing speed. Moreover, entrance crack and surface roughness was similar both machining speed is slow and fast. Several micro hole of glass tube machined using one micro tool, but tool wear is infinitesimal.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.84-89
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• 1998

BTA drilling among the deep hole drilling is using for the improvement of productivity and the high-efficient working. As the deep hole drilling with BTA drill is satisfied with the required quality by one-pass processing, more deeper hole depth, the accuracy of materials is affected by bending vibration and cutting speed. This paper is studied that the shapes of material (surface roughness, roundness) is affected by cutting condition compared actual roundness with lobe shape with modeling of computer through the experiments in the BTA drilling system with BTA drill.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Laser Solutions
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• v.18 no.2
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• pp.11-13
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• 2015

Pressure-drop in a micro-channel is critical when a hole diameter is less then 100um with the high aspect ratio, more than 40. To minimize these pressure loss for micro-channel applications is important and there would be the best hole diameter, taper angle, and their combinations. In this work, the parametric study for laser drilling of anodized material is conducted to obtain the micro-channel hole with high aspect ratio.

• Transactions of Materials Processing
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• v.28 no.3
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• pp.154-158
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• 2019

The hole expansion tests using conical punch, flat punch or hemispherical punch are widely used for stretch flangeability verification of HSS. In this study, we investigate the strain distribution on the shear edges of the hole expansion test using grid marking and a projector. A small crack at the edge is distributed, resulting in a large gap between the HER and the crack strain. The strain distribution at the edges is irregular due to anisotropy of sheet metal. While an edge perpendicular to the rolling direction indicate a lower strain level compared to an edge parallel to the rolling direction, edge cracks occur at the edge perpendicular to the rolling direction. To predict the manifestation of edge cracks in FE analysis, the result of the hole expansion test with a crack strain measurement may well be a better tool than FLD. In this case, the level of strain and the direction of the edge relative to the rolling direction should be well considered.

• Journal of the Korea Society of Computer and Information
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• v.24 no.4
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• pp.169-176
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• 2019

Wireless sensor networks are used to monitor and control areas in a variety of military and civilian areas such as battlefield surveillance, intrusion detection, disaster recovery, biological detection, and environmental monitoring. Since the sensor nodes are randomly placed in the area of interest, separation of the sensor network area may occur due to environmental obstacles or a sensor may not exist in some areas. Also, in the situation where the sensor node is placed in a non-relocatable place, some node may exhaust energy or physical hole of the sensor node may cause coverage hole. Coverage holes can affect the performance of the entire sensor network, such as reducing data reliability, changing network topologies, disconnecting data links, and degrading transmission load. It is possible to solve the problem that occurs in the coverage hole by finding a coverage hole in the sensor network and further arranging a new sensor node in the detected coverage hole. The existing coverage hole detection technique is based on the location of the sensor node, but it is inefficient to mount the GPS on the sensor node having limited resources, and performing other location information processing causes a lot of message transmission overhead. In this paper, we propose an Adjacent Matrix-based Hole Coverage Discovery(AMHCD) scheme based on connectivity of neighboring nodes. The method searches for whether the connectivity of the neighboring nodes constitutes a closed shape based on the adjacent matrix, and determines whether the node is an internal node or a boundary node. Therefore, the message overhead for the location information strokes does not occur and can be applied irrespective of the position information error.