• Title/Summary/Keyword: Hole Processing

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Processing Control of 0402 Chip used Pb-free Solder in SMT process (무연솔더 적용한 0402 칩의 공정제어)

  • Bang, Jeong-Hwan;Lee, Chang-U;Lee, Jong-Hyeon;Kim, Jeong-Han;Nam, Won-U
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.218-221
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    • 2007
  • The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

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Laser Engraving of Plasma Sprayed Ceramic Coatings (플라즈마 용사된 세라믹 코팅층의 레이저 홈가공)

  • Bang, Se Yoon
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.1
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    • pp.142-149
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    • 1997
  • Ceramic-coated anilox roll for printing is resistant to corrosion and wear, and hence has enhanced life and quality. Laser engraving is used typically for machining holes to store ink in this roll. Since engraved hole size and shape are directly related to laser processing parameters, it is necessary to know the rela- tionships among these parameters. In this study, the parameters for engraving of ;oasma sprayed ceramic coatings with Nd:YAG laser were studied. Relationships between hole shape and processing parameters were analyzed. Cr$_{2}$O$_{3}$ceramic was found to be most suitable for Nd:YAG laser engraving. It was found that hole depth can be increased by using higher energy pulses. Effect of using different assistant gases was small to the final results. For better results, it was suggested to use a very stable laser with shorter pulses and higher pulse energy.

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3D Packaging Technology Using Femto Laser (팸토초 레이저를 이용한 3차원 패키징 기술)

  • Kim, Ju-Seok;Sin, Yeong-Ui;Kim, Jong-Min;Han, Seong-Won
    • Proceedings of the KWS Conference
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    • 2006.10a
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    • pp.190-192
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    • 2006
  • The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

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Analysis of Deformation Surrounding the Pierced Hole in the Tube Hydro-Piercing Process (하이드로 피어싱된 튜브 부위의 변형해석)

  • 최성기;김동규;문영훈
    • Transactions of Materials Processing
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    • v.13 no.2
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    • pp.154-159
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    • 2004
  • Deformation surrounding the hole in the tube during the hydropiercing process has been investigated in this study. The tube is expanded and internally pressurized between upper and lower dies, and a piercing punch is driven forcefully through a cross passage in the die and through the wall of the tube. The pressurized fluid within the tube provides support to the wall of the tube during a piercing step to form a hole in the tube having less deformation surrounding the hole in the tube. The deformation area may be fully retracted to a substantially flat form or partially retracted to a countersunk form. In this study, a mathematical model that can predict deformation surrounding the hole has been proposed and experimentally verified by actual hydropiercing test.

Accelerating Gaussian Hole-Filling Algorithm using GPU (GPU를 이용한 Gaussian Hole-Filling Algorithm 가속)

  • Park, Jun-Ho;Han, Tack-Don
    • Proceedings of the Korean Society of Computer Information Conference
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    • 2012.07a
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    • pp.79-82
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    • 2012
  • 3차원 멀티미디어 서비스에 대한 관심이 높아짐에 따라 관련 연구들이 현재 다양하게 논의되고 있다. Stereoscopy영상을 생성하기 위한 기존의 방법으로는 두 대의 촬영용 카메라를 일정한 간격으로 띄워놓고 피사체를 촬영한 후 해당 좌시점과 우시점을 생성하는 방법을 이용하였다. 하지만 이는 영상 대역폭의 부담을 가져오게 된다. 이를 해결하기 위하여 Depth정보와 한 장의 영상을 이용한 DIBR(Depth Image Based Rendering) Algorithm에 대한 연구가 많이 이루어지고 있다. 그중 Gaussian Depth Map을 이용한 Hole-Filling 방법은 DIBR에서 가장 자연스러운 결과를 보여주지만 다른 DIBR Algorithm들에 비해 속도가 현저히 느리다는 단점이 있다. 본 논문에서는 영상 생성의 고속화를 위해 GPU를 이용한 Gaussian Hole-Filling Algorithm의 병렬처리 구조를 제안하고 이를 이용한 DIBR Algorithm 생성과정을 제시한다.

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A Study on the Fabrication and Evaluation of Burnishing Drills for Aluminum Hole Making (알루미늄 홀 가공용 버니싱 드릴의 제작 및 평가에 관한 연구)

  • Ha, Jeong-Ho;Kim, Dong-Gyu;Sa, Min-Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.7
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    • pp.53-63
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    • 2022
  • Recently, the use of aluminum components in the reduction of the vehicle weight to improve fuel efficiency and reduce carbon dioxide emissions has increased. In the aluminum machining cutting process, hole-making is an important process that accounts for 30% of the machining process. Although many studies have been conducted using the continuously advancing hole processing technology, studies on the machinability of the tool depending on the type of chuck on the workpiece are still lacking. In this study, the machining performance of cemented carbide burnishing drills was compared and analyzed according to chuck type. The burnishing drill was used to create a hole in the AL6061 workpiece, and the surface roughness and dimensional accuracy of the hole were examined according to the type of chuck while monitoring the spindle load.

X-ray Image Processing for the Korea Red Ginseng Inner Hole Detection (II) - Results of inner hole detection - (홍삼 내공검출을 위한 X-선 영상처리기술 (II) - 내공검출결과 -)

  • 손재룡;최규홍;이강진;최동수;김기영
    • Journal of Biosystems Engineering
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    • v.28 no.1
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    • pp.45-52
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    • 2003
  • Red ginsengs are inspected manually by examining those in the dark room with back light illumination. Manual inspection is often influenced by physical condition of inspectors. Sometimes. the best grade, heaven. has some inner holes though it was inspected by a specialist. In order to resolve this problem, this study was performed to develop image processing algorithm to detect the inner holes in the x-ray image of ginseng. Because of little gray value difference between background and ginseng in the image. simple thresholding method was not appropriate. Modified watershed algorithm was used to differentiate the inner holes from background and normal ginseng body. Inner hole edge region detected by watershed algorithm consists of many number of blobs including normal portions. With line profile analysis with scanning one line at a time beginning the starting point. it shelved two peaks both ends representing extracting each blobs. in which setting threshold value as of lower peak value enabled us to obtain inner hole image. Once this procedure has to be done till the finishing point it is completing inner hole detection for one blob. Thus. conducting ail blobs by this procedure is completing inner detection of one whole ginseng. Detection results of the inner holes fer various size of red ginsengs were good even though there was small detection variation. 6.2%. according to position of x-rat tube.

A Study on Shear Fracture Behavior of Metal in Micro Hole Punching Process (금속 소재의 미세 홀 펀칭 시 전단 파괴 거동 연구)

  • 유준환;임성한;주병윤;오수익
    • Transactions of Materials Processing
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    • v.12 no.4
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    • pp.314-319
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    • 2003
  • In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.

The Femto Second Laser Induced Ablation on the Titanium Alloy for Various Beam Overlap Ratio (빔 중첩율에 따른 티타늄 합금의 펨토초 레이저 어블레이션)

  • Chung, Il-Young;Kang, Kyung-Ho;Kim, Jae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.11
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    • pp.17-23
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    • 2010
  • Titanium alloy is one of the hard processing materials made by the traditional manufacturing method because of the excellent mechanical strength. Ablation of titanium alloy is investigated by using a femtosecond laser which is a regenerative amplified Ti:sapphire laser with 1kHz repetition rate, 184fs pulse duration time and 785nm wavelength. Experiments are carried out under various ablation conditions with different pulse overlap ratios for the rectangular shape and micro hole. Test results show that the ablation characteristic according to pulse overlap ratio of titanium alloy seems to be as non-linear type at the different zone of energy fluence. The optimal condition of rectangular shape processing is obtained at the laser peak power 1.3mW, pulse overlap ratio of 90%, beam gap of $1\;{\mu}m$. The micro hole has a good quality from the pulse overlap ratio of 99% at the same laser peak power. With the optimal processing condition, the fine rectangular shape and micro hole without burr and thermal damage are achieved.