• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.317-318
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• 2008

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.55-60
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• 2008

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.5
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• pp.64-69
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• 2010

This study is the machining of fuel supply pipe used in large vessels. The fuel supply pipe of large vessels have effects to reduce engine exhaust because of common rail system and show excellent fuel efficiency so it is in the limelight as a vessel engine of next generation. At present, the shape of fuel supply pipe of common rail used for huge two-stroke & low-speed vessels is like a peanut hole so the second machining is necessary after the first machining. There is high error rate for machining and the materials waste caused by machining error is serious. Also, in this time the request for increasing the length of fuel supply pipe is suggested in the world market, it's judged that current methods will show higher error rate for machining. Therefore, the purpose of this study is to improve the machining process used originally. For that, the system controlling the process was developed as well as surface roughness and straightness which are evaluation items of fuel supply pipe were measured so that improved process can be observed in real time.

• Design & Manufacturing
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• v.11 no.1
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• pp.1-6
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• 2017

In these days, due to generalization of using smart mobile phone and wearable device such as smart watch, demand of Cover-glass and touch screen panel for protecting display increases. With increasing the demand of Cover-glass, slimming technique is promising for weight lightening, zero bezel. Cover-glass produced by this technique is required to decreasing thickness with increase strength. In the Cover-glass manufacturing process, mechanical processing and chemical processing has improve in the strength. Generally, Diamond electrodeposition wheel is used in mechanical process. Reinforced glass with the characteristics of the brittle and high hardness was manufactured by using a diamond electrodeposition wheel. At this time, Because of surface of the tool present non-uniform distribution of diamond particle, it has generate Loading of wheel and it has been decrease life of grinding tool, efficiency of grinding, quality and shape accuracy of workpiece. Thus Research is needed to controling particle distribution of diamond electrodeposition wheel uniformly. And it is necessary to study micro hole machining such as proximity senser hole, speaker hole positioned Cover-glass. Reinforced glass with the characteristics of the brittle and high hardness is difficult to machining. Processing of reinforced glass have generated wear of tool, micro cracks. Also, it is decreasing shape accuracy. In this paper, We conducted a study on how to control particle distribution uniformly about the diamond tool manufactured using elecetodeposition processing. It analyzed the factors that affect the arrangement of the particles in the electrodeposition process by design of experiment. And There is produced the grinding tool, which derives an optimum deposition conditions, for processing Cover-glass edge and the machinability was evaluated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.435-440
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• 2000

In this study, we aims to develop the machining technology for the ultra precision surface and profile accuracy. For this purpose, we construct the electrolytic in process grinding system (ELID grinding) and apply to the cylindrical and internal grinding. Through the various machining experiments such as SCM steel., ceramics, tungsten carbide etc., we have obtained nanometer surface roughness. And we have applied this mirror grinding technique to hydraulic manual valve and mold core of mini disk optical pick-up base. For the development of fine mechanical part machining technology, e have made multi fiber optical connector using fine grinding technology. And constructed micro drilling system with process monitoring system which is possible to drill 50${\mu}{\textrm}{m}$ diameter hole.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1056-1059
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• 2001

These days, as dynamic function and special properties to compare traditional material, $Al_20_3$ ceramic use all over the industry. But it is very difficult to process because of high hardness and brittleness. Therefore, in this paper, it was investigated that laser process parameter which can produce appropriate quality of $Al_20_3$ ceramic microhole machining.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.56-63
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• 1998

The purpose of this is to analyze experimentally how the change of cutting speed have effects on hole over size of cutting hole, surface roughness of workpiece and roundness during the deep hole machining of SM55C with solid BTA drill using BTA drilling system. Conclusion reached is as follows. (1) The diameter was expanded for 25$\mu$m at the first section and then was reduced 0$\mu$m and 15$\mu$m respectively at the 10m and 20m section comparing to the diameter of tool with respect to the variation of cutting length at 70m/min of cutting speed. 0.15mm/rev of feed. (2) It was proved that roughness was below 8.67$\mu$m for the whole section of cutting length. (3) The roundness has been below 12$\mu$m. Regarding the polygon phenomenon, it has been proved that not only uneven best at 70m/min of cutting speed. 0.15mm/rev of feed.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.117-129
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• 1998

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratio larger than 10) is recently having more attention in a wide spectrum of precision production industries. Alternative methods such as EDM. laser drilling, etc. can sometimes replace the mechanical micro-hole drilling but are not acceptable in PCB manufacture because of the inferior hole quality and accuracy. The major difficulties in micro-hole drilling are related to small signal to noise ratios, wandering motions of the inlet stage, high aspect ratios, high temperatures and so forth. Of all the difficulties. the most undesirable one is the increase of drilling force as the drill proceeds deeper into the hole. This is caused mainly from the chip effects. Peck-drilling is thus widely used for deep hole drilling despite that it suffers from low productivity. In the paper, a method of cutting force regulation is proposed to achieve continuous drilling. A PD and a sliding mode control algorithms were implemented through controlling the spindle rotating frequency. Experimental results show that the sliding mode control reduces the nominal cutting force and the variation of the cutting force better than the PD control. The advantages of the regulation, such as increase of drill life, fast stabilization of a wandering motion, and the precise positioning of the hole are verified in experiment.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.