• Journal of Electrical Engineering and Technology
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• 제13권5호
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• pp.2125-2133
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• 2018

To achieve high performance speed regulation, a robust adaptive speed controller is proposed for the permanent magnet synchronous motor (PMSM) subject to parameter uncertainties and input saturations in this paper. A nonlinear adaptive control is introduced to compensate the PMSM speed tracking errors due to uncertainties, disturbances and control input saturation constraints. By combining the adaptive control and the nonlinear robust control based on the interconnection and damping assignment (IDA) strategy, a new robust adaptive control is designed for speed regulation of PMSM. Stability and robustness of the closed-loop control system involved with the constrained control inputs rather than unconstrained control inputs are validated. Simulations for PMSM control in the presence of uncertainties and saturations nonlinearities show that the proposed approach is effective to regulate speed, and the average tracking error using the proposed approach is at least 32% smaller than the compared methods.

• 정보처리학회논문지C
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• 제8C권4호
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• pp.415-420
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• 2001

VLSI 기술의 빠른 발전으로 디지털 시스템의 동작주파수가 높아짐에 따라 고속 통신시스템 의 하드웨어 설계 시 신호 무결성을 고려한 설계가 필수적이다. 디지털시스템에서의 잡음원 은 전송선에서의 전원장치, 접지 바운스, 실장 재료 등에 관련된다. 본 연구에서는 고속네트 워크/통신시스템의 기가비트 연결 설계기술에 필요한 요소들을 언급하였고, 실제 설계 신호 불연속에 영향을 미치는 커넥터의 누화 및 전송선의 표피 효과, 유전손실 등을 고려한 백플 레인보드를 시뮬레이션 하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.158-159
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• 2006

The resistance-capacitance (RC) delay of signals through interconnection materials becomes a big hurdle for high speed operation of semiconductors which contain multilayer interconnection layers. In order to reduce the RC delay, low-k materials will be used for inter-metal dielectric (IMD) materials. We have developed self-consistent simulation tool that includes neutral-species transport model, based on the relaxation continuum (RCT) model. We present the parametric study of the modeling results of a two-frequency capacitively coupled plasma (2f-CCP) with $N_2/H_2$ gas mixture that is known as promising one for organic low-k materials etching. We include the neutral transport model as well as plasma one in the calculation. The plasma and neutrals are calculated self-consistently by iterating the simulation of both species till a spatiotemporal steady state profile could be obtained.

• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• 마이크로전자및패키징학회지
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• 제19권2호
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• pp.47-53
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• 2012

최근 정보전송량이 증대됨에 따라 PCB는 고속 정보전송 및 박형화가 요구되고 있다. 하지만 기존의 전기적 PCB는 EMI, 실장밀도 등의 문제로 고속전송에 한계가 있어 기존의 전기 회로층에 광 회로층을 접목한 광 PCB가 그 해결책으로 대두되고 있다. 광 PCB 구현에서 가장 중요한 요소는 광 접속기술로 고효율, 수동정렬에 관한 연구가 활발히 이루어지고 있다. 따라서 본 논문에서는 광도파로에 렌즈를 일체형으로 제작하고 이를 보호하는 구조물을 정렬키로 사용한 장착형 광도파로 구조를 제안하였고, 광 및 구조 시뮬레이션을 통해 제안한 구조의 접속효율 및 구조적 안정성을 해석하였다. 광 시뮬레이션 결과 제안된 구조는 렌즈가 없는 구조와 비교해 송신부에서 약 1.86배, 수신부에서 약 1.42배의 높은 접속효율을 가지며, 구조 해석에서는 탈착과정에서 내부의 렌즈에 응력 및 변형이 발생하지 않음을 확인하였다. 따라서 본 논문에서 제안된 구조가 높은 접속효율을 가지고, 구조적 안정성을 가짐을 보였다.

• 정보처리학회논문지A
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• 제8A권2호
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• pp.147-156
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• 2001

A high performance routing switch is an essential device to either the high performance parallel processing or communication networks that handle multimedia transfer systems such as VOD. The high performance routing chip called STC104 is a typical example in the technical aspect which has 32 bidirectional links of 100Mbps transfer sped. It has exploited new technologies, such as wormhole routing, interval labeling, and adaptive routing method. The high speed router has been applied into some parallel processing system as a single chip. However, its performance over the various interconnection networks with multiple routing chips has not been studied. In this paper, the strucrtures and characteristics of the STC104 have been investigated in order to evaluate the high speed router. Various topology of the STC104, such as meshes, torus, and N-cube are defined and constructed. Algorithms of packet transmission have been proposed based on the interval labeling and the group adaptive routing method implemented in the interconnected network. Multicast algorithms, which are often requited to the processor networks and broadcasting systems, modified from U-mesh and U-torus algorithms have also been proposed overcoming the problems of point-to-point communication.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(1)
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• pp.155-158
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• 2001

A 640Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM, 0.25um CMOS and optical WDM interconnection is fabricated for future N-ISDN services. A 40 layer, 160mm$\times$114mm ceramic MCM realizes the basic ATM switch module with 80Gbps throughput. The basic unit ATM switch module with 80Gb/s throughput. The basic unit ATM switch MCM consists of in 8 chip advanced 0.25um CMOS VLSI and 32 chip I/O Bipolar VLSIs. The MCM employs an 40 layer, very thin layer ceramic MCM and a uniquely structured closed loop type liquid colling system is adopted to cope with the MCM's high-power dissipation of 230w. The MCM is Mounted on a 32cm$\times$50cm mother board. A three stage ATM switch is realized by optical WDM interconnection between the high-performance MCM.

• 대한전자공학회논문지TC
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• 제40권4호
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• pp.10-21
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• 2003

최근의 광 가입자 정합모듈은 매우 빠른 속도로 출현되는 다양한 서비스를 쉽고, 효율적으로 수용하기 위해 고성능의 상용 네트워크 프로세서 칩을 대부분 사용하고 있다. 지금까지 많은 밴더들이 2.5Gbps급 네트워크 프로세서를 상용화하였지만, IBM NP4GS3만 2.SGbps 이상의 우수한 패킷 처리성능을 지원한다. 그러나 IBM NP4GS3는 스위치 인터페이스로 고속 DASL(Data-Aligned Synchronous Link) 인터페이스를 사용하기 때문에, NP Forum에 의해 표준화된 CSIX-Ll인터페이스를 사용하는 스위치 패브릭과는 정합할 수가 없다. 이에 따라 본 논문에서는 IBM NP4GS3를 이용한 광 가입자 정합모듈이 표준화된 스위치 패브릭과 효율적으로 정합할 수 있도록 IBM 상용 UDASL칩과 UTOPIA-L3와 CSIX-Ll인터페이스를 상호 변환하는 FPGA를 이용한 연동 구조 및 패킷 제어방법에 대해 고찰해본다.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제48권1호
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• pp.42-47
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• 1999

This paper presents the information transmission between on-board and ground-site in MAGLEV. considering safety and high speed operation and density operation, information transmission between them is necessary. Therefore it is necessary for transmission system to ensure high speed transmission, low error rate, massive information, and reliability of information. To provide above conditions, 1.1km signal line assembly was constructed and Frequency Shift Keying(FSK) modulation and Open System Interconnection(OSI) based high-level data link control(HDLC) protocol are applied. To modulate digital signal for transmission from ground-site to on-board, carrier frequency of 70kHz is used and 90khz is used for transmission from on-board to ground-site. Transmission speed is 2400bps for consideration of train speed, quantity of information, and data error rate. And this paper introduces information monitoring considering user interface and presents the method for an effective data transmission in MAGLEV which is now being tested and intends to provide for an intelligent train operation system in future.

• 전기화학회지
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• 제10권2호
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• pp.94-103
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• 2007

반도체 소자의 고속화, 고집적화, 고신뢰성화에 대한 요구는 알루미늄 합금으로부터 구리로의 배선 물질의 변화를 유도하였다. 낮은 비저항과 높은 내열화성을 특징으로 하는 구리는 그 전기적, 재료적 특성이 알루미늄과 상이하여 배선 형성에 있어 새로운 주변 재료와 공법을 필요로 한다. 본 총설에서는 상감공정(damascene process)을 사용하는 다층 구리 배선 공정에 있어 핵심이 되는 구리 전해 도금(electrodeposition) 공정을 중심으로 확산 방지막(diffusion barrier) 및 도전층(seed layer), 바닥 차오름(bottom-up filling)을 위한 전해/무전해 도금용 유기 첨가제, 화학적 기계적 평탄화(chemical mechanical polishing) 및 표면 보호막(capping layer) 기술 등의 금속화 공정에 대한 개요와 개발 이슈를 소개하고 최근의 연구 결과를 통해 구리 배선 공정의 최신 연구 동향을 소개하였다.