• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.109-109
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• 2010

$Er^{3+}$ ion shows a stable and efficient luminescence at 1.54mm due to its $^4I_{13/2}\;{\rightarrow}\;^4I_{15/2}$ intra-4f transition. As this corresponds to the low-loss window of silica-based optical fibers, Er-based light sources have become a mainstay of the long-distance telecom. In most telecom applications, $Er^{3+}$ ions are excited via resonant optical pumping. However, if nanocluster-Si (nc-Si) are co-doped with $Er^{3+}$, $Er^{3+}$ can be excited via energy transfer from excited electrical carriers in the nc-Si as well. This combines the broad, strong absorption band of nc-Si with narrow, stable emission spectra of $Er^{3+}$ to allow top-pumping with off-resonant, low-cost broadband light sources as well as electrical pumping. A widely used method to achieve nc-Si sensitization of $Er^{3+}$ is high-temperature annealing of Er-doped, non-stoichiometric amorphous thin film with excess Si (e.g.,silicon-rich silicon oxide(SRSO)) to precipitate nc-Si and optically activate $Er^{3+}$ at the same time. Unfortunately, such precipitation and growth of nc-Si into Er-doped oxide matrix can lead to $Er^{3+}$ clustering away from nc-Si at anneal temperatures much lower than ${\sim}1000^{\circ}C$ that is necessary for full optical activation of $Er^{3+}$ in $SiO_2$. Recently, silicon-rich silicon nitride (SRSN) was reported to be a promising alternative to SRSO that can overcome this problem of Er clustering. But as nc-Si formation and optical activation $Er^{3+}$ remain linked in Er-doped SRSN, it is not clear which mechanism is responsible for the observed improvement. In this paper, we report on investigating the effect of separating the nc-Si formation and $Er^{3+}$ activation by using hetero-multilayers that consist of nm-thin SRSO or SRSN sensitizing layers with Er-doped $SiO_2$ or $Si_3N_4$ luminescing layers.

• Journal of Powder Materials
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• v.23 no.1
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• pp.8-14
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• 2016

A bulk-type Ta material is fabricated using the kinetic spray process and its microstructure and physical properties are investigated. Ta powder with an angular size in the range $9-37{\mu}m$ (purity 99.95%) is sprayed on a Cu plate to form a coating layer. As a result, ~7 mm-sized bulk-type high-density material capable of being used as a sputter material is fabricated. In order to assess the physical properties of the thick coating layer at different locations, the coating material is observed at three different locations (surface, center, and interface). Furthermore, a vacuum heat treatment is applied to the coating material to reduce the variation of physical properties at different locations of the coating material and improve the density. OM, Vickers hardness test, SEM, XRD, and EBSD are implemented for analyzing the microstructure and physical properties. The fabricated Ta coating material produces porosity of 0.11~0.12%, hardness of 311~327 Hv, and minor variations at different locations. In addition, a decrease in the porosity and hardness is observed at different locations upon heat treatment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• Journal of the Korean Institute of Telematics and Electronics
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• v.17 no.6
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• pp.65-71
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• 1980

The Sn O2-Si Heterojunction sola cells are Prepared by vacuum deposition of SnO2 on N- and P-type Si - wafers arts the effects of annealing on the Solar cell characteiistics are presented. The existence of optimumannealins temperature for maximum open-circuit voltage and short - circuit current of the solar cell is observed. The optimum tomperature, when low resistivity (7- 2.3 [$\Omega$.cm]) P-and N-type Si -wafers are used, is 500 [$^{\circ}C$] End 400 [$^{\circ}C$] when high resistivity[41-58 [$\Omega$.cm]) P-type Si-wafers are used.

• Applied Science and Convergence Technology
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• v.26 no.5
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• pp.133-138
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• 2017

We investigated the interface defect engineering and reaction mechanism of reduced transition layer and nitride layer in the active plasma process on 4H-SiC by the plasma reaction with the rapid processing time at the room temperature. Through the combination of experiment and theoretical studies, we clearly observed that advanced active plasma process on 4H-SiC of oxidation and nitridation have improved electrical properties by the stable bond structure and decrease of the interfacial defects. In the plasma oxidation system, we showed that plasma oxide on SiC has enhanced electrical characteristics than the thermally oxidation and suppressed generation of the interface trap density. The decrease of the defect states in transition layer and stress induced leakage current (SILC) clearly showed that plasma process enhances quality of $SiO_2$ by the reduction of transition layer due to the controlled interstitial C atoms. And in another processes, the Plasma Nitridation (PN) system, we investigated the modification in bond structure in the nitride SiC surface by the rapid PN process. We observed that converted N reacted through spontaneous incorporation the SiC sub-surface, resulting in N atoms converted to C-site by the low bond energy. In particular, electrical properties exhibited that the generated trap states was suppressed with the nitrided layer. The results of active plasma oxidation and nitridation system suggest plasma processes on SiC of rapid and low temperature process, compare with the traditional gas annealing process with high temperature and long process time.

• Electrical & Electronic Materials
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• v.10 no.10
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• pp.1029-1033
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• 1997

A prototype MFSFET using ferroelectric fluoride BaMgF$_4$as a gate insulator has been successfully fabricated with the help of 2 sheets of metal mask. The fluoride film was deposited in an ultrai-high vacuum system at a substrate temperature of below 30$0^{\circ}C$ and an in-situ post-deposition annealing was conducted for 20 seconds at $650^{\circ}C$ in the same chamber. The interface state density of the BaMgF$_4$/Si(100) interface calculated by a MFS capacitor fabricated on the same wafer was about 8$\times$10$^{10}$ /cm$^2$.eV. The I$_{D}$-V$_{G}$ characteristics of the MFSFET show a hysteresis loop due to the ferroelectric nature of the BaMgF$_4$film. It is also demonstrated that the I$_{D}$ can be controlled by the “write” plus which was applied before the measurements even at the same “read”gate voltage.ltage.

• Journal of Magnetics
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• v.12 no.4
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• pp.133-136
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• 2007

We have carried out the study of magnetocaloric effect for as-quenched and annealed $Fe_{91-x}Y_xZr_9$ alloys. Samples were prepared by arc melting the high-purity elemental constituents under argon gas atmosphere and by single roller melt spinning. These alloys were annealed one hour at 773 K in vacuum chamber. The magnetization behaviours of the samples were measured by vibrating sample magnetometer. The Curie temperature increases with increasing Y concentration (x=0 to 8). Temperature dependence of the entropy variation ${\Delta}S_M$ was found to appear in the vicinity of the Curie temperature. The results show that annealed $Fe_{86}Y_5Zr_9$ and $Fe_{83}Y_8Zr_9$ alloys a bigger magnetocaloric effect than that those in as-quenched alloys. The value is 1.23 J/kg K for annealed $Fe_{86}Y_5Zr_9$ alloy and 0.89 J/kg K for as-quenched alloy, respectively. In addition, the values of ${\Delta}S_M$ for $Fe_{83}Y_8Zr_9$ alloy is 0.72 J/Kg K for as-quenched and 1.09 J/Kg K for annealed alloy, respectively.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.200-205
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• 2003

Thermoelectric p-type $Fe_{0.98}$ $Mn_{ 0.02}$$Si_2$ bulk specimens have been produced by mechanical alloying and consolidation by vacuum hot pressing. The subsequent isothermal annealing was not able to fully transform the mestastable as -milled powders into the $\beta$ $-FeSi_2$ phase, so that the obtained matrix consisted of not only thermoelectric semiconducting $\beta$-FeSi$_2$ but also some residual, untransformed metallic $\alpha$ $- Fe_2$$Si_{ 5}$ and $\varepsilon$-FeSi mixtures. Interestingly, $\beta$ - $FeSi_2$ was more easily obtained in the low density specimen when compared to the high density specimen. The oxidation at 700 and $800^{\circ}C$ in air led to the phase transformation of the above described iron - silicides and the formation of a thin silica surface layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.460-463
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• 2000

The current-voltage characteristics of the sandwich system at different annealing temperatures and different bias voltages have been studied. In order to prepare the Al/V$O_X$/Al sandwich devices structure, thin films of vanadium oxide(V$O_X$) was deposited by r.f. magnetron sputtering from $V_2$$O_5$ target in 10% gas mixture of argon and oxygen, and annealed during lhour at different temperatures in vacuum. Crystall structure, surface morphology, and thickness of films were characterized through XRD, SEM and I-V characteristics were measured by electrometer. The films prepared below 20$0^{\circ}C$ were amorphous, and those prepared above 300 $^{\circ}C$were polycrystalline. At low fields electron injected to conduction band of vanadium oxide and formed space charge, current was limited by trap. Conduction mechanism at mid fields due to Schottky emission, while at high fields it changed to Fowler-Nordheim tunneling effects.

• Journal of the Korean Ceramic Society
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• v.44 no.5 s.300
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• pp.144-147
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• 2007

Calcium metaphosphate (CMP) nanofibers with a diameter of ${\sim}600nm$ were prepared using electrospun CMP/polyvinylpyrrolidone (PVP) fibers through a process of drying for 5 h in air followed by annealing for 1 h at $650^{\circ}C$ in a vacuum. The viscosity of the CMP/PVP precursor containing 0.15 g/ml of PVP was 76 cP. Thermal analysis results revealed that the fibers were crystallized at $569^{\circ}C$. The crystal phase of the as-annealed fiber was determined to be ${\delta}-CMP\;({\delta}-Ca(PO_3)_2)$. However, the morphology of the fibers changed from smooth and uniform (as-spun fibers) to linked-particle characteristics with a tubular form most likely due to the decomposition of the inner PVP matrix. It is expected that this large amount of available surface area has the potential to provide unusually high bioactivity and fast responses in clinical hard tissue applications.