• 조명전기설비학회논문지
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• 제24권7호
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• pp.57-63
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• 2010

Photo-capacitor electrodes are attracting great attention because of their high capacitance and potential applications in electronic devices. Carbon capacitor, active carbon capacitor and its combination will be fabricated using a sandwich method as carbonaceous material on each type of storable electrode with $20{\times}15$[mm] cell size. Carbon/active carbon cell was fabricated using sol-gel process with $120[^{\circ}C]$ dry temperature in 2hour and using sintering process with $500[^{\circ}C]$ in 2hour. The effect of sintering temperature on carbon properties was also investigated with an X-ray diffraction technique to get the best sintering temperature. The detail of the fabrication process will be explained. Active carbon as carbonaceous material has a better capacitance in storable electrode with mean thickness $32[{\mu}m]$ and with particle size $1[{\mu}m]$ to $4.5[{\mu}m]$ in $20{\times}15$[mm] sample size of storable electrode.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• 조명전기설비학회논문지
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• 제13권1호
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• pp.53-59
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• 1999

$(Ba_{0.85}Ca_(0.15)TiO_3+ZnO$ 세라믹 커패시터는 ZnO를 0.1~0.4몰로 변화시켜 시편을 제조하였다. 본 연구에서는 고전압용 세라믹 커패시터의 구조적 및 전기적 특성에 관하여 연구하였다. 세라믹 커패시터의 상대밀도는 모든시료에서 높았다. 입자의 크기는 $1.0~1.22[\mum]$ 정도의 작은 크기이었으며 ZnO의 첨가량이 0.3몰일 때 가장 크게 성장하였다. 입자의 크기가 클 때 시정수는 증가하였다. 세라믹 커패시터의 온도계수는 0.12~10[kHz]에서 100[ppm]이하로 온도변화에 대해 유전율이 안정하였다. 유전 완화시간은 $[110^{\circ}C]$이상에서 계면분극의 영향으로 감소하였으며 $110[^{\circ}C]$이하에서는 상유전층의 공간전하 분극에 의해서 유전 완화시간이 증가하였다. 유전특성에 영향을 주는 절연층의 두께가 ZnO에 의해서 증가하였으며 유전율의 변화는 0.1[%]로 전압의 변동에 대해 유전율이 안정하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.41-44
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• 1998

(1-X)LTC-XHTC composites were manufactured with the variation of X in the range of 0.3 $\leq$X $\leq$0.6 and its dielectric properties were investigated. Here, LTC and HTC are PZN-BT-PT -based ceramics with quire temperature(Tc) of 100。 C-3$0^{\circ}C$, respectively. 0.6HTC-0.4LTC composite ceramics show excellent values of $\Delta$$\varepsilon$$_{r}$/$\varepsilon$[%] which were -7.1% at -2$0^{\circ}C$ and -12% at 5$0^{\circ}C$, respectively. It is thought that composite ceramics with above results can be applied to electrostrictive actuator, high voltage ceramic capacitor etc.mic capacitor etc.r etc.c.

• Transactions on Electrical and Electronic Materials
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• 제10권1호
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• pp.5-8
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• 2009

The reliability of multilayer ceramic capacitor with active thin dielectric layer was investigated by highly accelerated life test at various stress condition. The distribution of multilayer ceramic capacitor failure times is plotted as a function of time from Weibull distribution function. According to the test result, voltage acceleration factor is obtained from 2.24 to 2.96. The acceleration by temperature is much higher than other values of active thick dielectric layer. It is clear that median time to failure is affected by the stress voltage for high volumetric efficiency ceramic capacitors with active thin dielectric layer. The degradation under stress of voltage involves electromigration and accumulation of oxygen vacancy at Ni electrode interface of cathode.

• Journal of Power Electronics
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• 제19권3호
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• pp.676-690
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• 2019

This paper presents a switched capacitor (SC) based bidirectional dc-dc converter topology for high voltage gain applications. The proposed converter is able to operate with multiple integral voltage conversion ratios based on user input. The architecture of a user-friendly, inductor-less multi-voltage-gain bidirectional dc-dc converter is proposed in this study. The inductor-less or magnetic-less design of the proposed converter makes it effective in higher temperature applications. Furthermore, the proposed converter has a reduced component count and lower voltage stress across its switches and capacitors when compared to existing SC converters. An output impedance analysis of the proposed converter is presented and compared with popular existing SC converters. The proposed converter is simulated in the OrCAD PSpice environment and the obtained results are presented. A 200 W hardware prototype of the proposed SC converter has been developed. Experimental results are presented to validate the efficacy of the proposed converter.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1516-1519
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• 1996

In this paper, a study on the electrical properties of ternary compound ceramics $[(1-y-x)BaTiO_{3}-ySrTiO_{3}-xMgTiO_3]$ fabricated 7 samples with each mol[%] by using the mixed oxide method. In this case, the sintering temperature were at $1,250[^{\circ}C]$ for 2[hr]. Also made ceramic capacitors from 7 samples, temperature coefficient of the capacitance and the variation of relative dielectric constants and loss with fixed frequency (1KHZ) were studied. In some ceramic capacitors, has shown very good properties of the dielectric constants and loss. In case of BSM-11 ceramic capacitor, is sure to the commercial capacitor which shows steady properties.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권5호
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• pp.185-190
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• 2002

Capacitor material utilized in the downsizing passive devices and dynamic random access memory(DRAM) requires the physical and electrical properties at given area such as capacitor thickness reduction, relative dielectric constant increase, low leakage current and thermal stability. Common capacitor materials, $SiO_2$, $Si_3N_4$, $SiO_2$/$Si_3N_4$,TaN and et al., used until recently have reached their physical limits in their application to several hundred angstrom scale capacitor. $Ta_2O_{5}$ is known to be a good alternative to the existing materials for the capacitor application because of its high dielectric constant (25 ~35), low leakage current and high breakdown strength. Despite the numerous investigations of $Ta_2O_{5}$ material, there have little been established the clear understanding of the annealing effect on capacitance characteristic and conduction mechanism, design and fabrication for $Ta_2O_{5}$ film capacitor. This study presents the structure-property relationship of reactive-sputtered $Ta_2O_{5}$ MIM capacitor structure processed by annealing in a vacuum. X-ray diffraction patterns skewed the existence of amorphous phase in as-deposited condition and the formation of preferentially oriented-$Ta_2O_{5}$ in 670, $700^{\circ}C$ annealing. On 670, $700^{\circ}C$ annealing under the vacuum, the leakage current decrease and the enhanced temperature-capacitance characteristic stability. and the leakage current behavior is stable irrespective of applied electric field. The results states that keeping $Ta_2O_{5}$ annealed at vacuum gives rise to improvement of electrical characteristics in the capacitor by reducing oxygen-vacancy and the broken bond between Ta and O.

• 한국신뢰성학회지:신뢰성응용연구
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• 제17권1호
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• pp.66-71
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• 2017

Purpose: Polymer capacitors are known to have very high reliability as compared with liquid electrolytic capacitors, but their capacity has been reported to decrease in charge and discharge at low temperature. The purpose of this study to clarify these characteristics. Methods: In order to clarify these characteristics, charging-discharging tests were carried out for 200 hours with three different capacities and at 5 different temperature from $5^{\circ}C$ to $100^{\circ}C$. Results: As a result of the test, it was confirmed that the capacity of the polymer capacitor was decreased with higher capacity and lower temperature. Conclusion: Such a failure phenomenon was caused by the shrinkage and expansion characteristics of the polymer used therein, it is presumed that this failure phenomenon is due to the complex pore structure made by etching.

• Journal of Welding and Joining
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• 제23권3호
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.