• Title/Summary/Keyword: High temperature Stress

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A Study on Stress Corrosion Cracking Evaluation with Material Degradation of High Temperature Components (고온부재의 재질열화에 따른 응력부식균열 평가에 관한 연구)

  • Park, Jong-Jin;Yu, Ho-Seon;Jeong, Se-Hui
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.4
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    • pp.1123-1132
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    • 1996
  • It has been reported that high temperature structural components represent the phenomenon of material degradation according to a long term service under high temperature and pressure. Especially, fossile power plant components using the fossil fuel and heavy oil are affected by dewpoint corrosion of $H_2SO_4$produced during a combustion. Therefore, the service materials subjected to high temperature and pressure may occur the stress corrosion cracking. The object of this paper is to investigate SCC susceptibility according to the material degradation of the high temperature structural materials in dewpoint corrosive environment-$H_2SO_4$.The obtained results are summarized as follows : 1) In case of secondary superheater tube, the fractograph of dimple is observed at the concentration of $H_2SO_4$-5%. When the concentration of $H_2SO_4$ is above 10%, the fracture mode is shifted from a transgranular fracture to an quasi-intergranular fracture according to the increment of concentration. 2) In the relationship between [$\Delta$DBTT]$_sp$ and SCC susceptibility, it is confirmed that the greater material degradation degree is, the higher SCC susceptibility is. In addition, it can be known that SP test is useful test method to evaluate SCC susceptibility for high temperature structural components. 3) When [$\Delta$DBTT]$_sp$ is above 17$17^{\circ}C$ the SCC fracture behavior is definitely observed with SCC susceptibility of above 0.4.

Enhanced Tolerance of Chinese Cabbage Seedlings Mediated by Bacillus aryabhattai H26-2 and B. siamensis H30-3 against High Temperature Stress and Fungal Infections

  • Lee, Young Hee;Jang, Su Jeong;Han, Joon-Hee;Bae, Jin Su;Shin, Hyunsuk;Park, Hee Jin;Sang, Mee Kyung;Han, Song Hee;Kim, Kyoung Su;Han, Sang-Wook;Hong, Jeum Kyu
    • The Plant Pathology Journal
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    • v.34 no.6
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    • pp.555-566
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    • 2018
  • Two rhizobacteria Bacillus aryabhattai H26-2 and B. siamensis H30-3 were evaluated whether they are involved in stress tolerance against drought and high temperature as well as fungal infections in Chinese cabbage plants. Chinese cabbage seedlings cv. Ryeokgwang (spring cultivar) has shown better growth compared to cv. Buram-3-ho (autumn cultivar) under high temperature conditions in a greenhouse, whilst there was no difference in drought stress tolerance of the two cultivars. In vitro growth of B. aryabhattai H26-2 and B. siamensis H30-3 were differentially regulated under PEG 6000-induced drought stress at different growing temperatures (30, 40 and $50^{\circ}C$). Pretreatment with B. aryabhattai H26-2 and B. siamensis H30-3 enhanced the tolerance of Chinese cabbage seedlings to high temperature, but not to drought stress. It turns out that only B. siamensis H30-3 showed in vitro antifungal activities and in planta crop protection against two fungal pathogens Alternaria brassicicola and Colletotrichum higginsianum causing black spots and anthracnose on Chinese cabbage plants cv. Ryeokgwang, respectively. B. siamensis H30-3 brings several genes involved in production of cyclic lipopeptides in its genome and secreted hydrolytic enzymes like chitinase, protease and cellulase. B. siamensis H30-3 was found to produce siderophore, a high affinity iron-chelating compound. Expressions of BrChi1 and BrGST1 genes were up-regulated in Chinese cabbage leaves by B. siamensis H30-3. These findings suggest that integration of B. aryabhattai H26-2 and B. siamensis H30-3 in Chinese cabbage production system may increase productivity through improved plant growth under high temperature and crop protection against fungal pathogens.

Molecular dynamic studies for elastic constant of SiC crystal at high temperature (고온에서 SiC 결정의 탄성율에 대한 분자동역학연구)

  • Park, B.W.;Shin, H.R.;Kim, J.H.;Im, J.I.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.20 no.5
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    • pp.232-236
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    • 2010
  • Silicon carbide (SiC) ceramics are widely used in the application of high-temperature structural devices due to their light weight as well as superior hardness, fracture toughness, and temperature stability. In this paper, we employed classical molecular dynamics simulations using Tersoff's potential to investigate the elastic constants of the SiC crystal at high temperature. The stress-strain characteristics of the SiC crystal were calculated with the LAMMPS software and the elastic constants of the SiC crystal were analyzed. Based on the stress-strain analysis, the SiC crystal has shown the elastic deformation characteristics at the low temperature region. But the slight plastic deformation behavior was shown as applied the high strain over $1,000^{\circ}C$. Also the elastic constants of the SiC crystal were changed from about 475 GPa to 425 GPa as increased the temperature to $1,250^{\circ}C$.

Study on Thermal Stress of Porcelain Insulator for T/L (송전용 자기애자의 열충격 특성 연구)

  • Han, Se-Won;Cho, Han-Goo;Choi, In-Hyuk;Lee, Dong-Ill
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.208-209
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    • 2006
  • This study presents the thermal stress characteristics of TL porcelain insulators(healthy and ageing) by the accelerating thermal mechanical ageing test with forced temperature gradient. The test temperature gradient is $95^{\circ}C(-35{\sim}60^{\circ}C)$, it was focused to high temperature thermal stress as compared with IEC 60575 standard. There was no a discrimination in the case of healthy aluminous porcelain insulators, dissimilarly in crystoballite insulators according to this test method. It was indicated that the long tenn reliability by thermal stress was conformed reasonably through the conventional accelerating ageing test methods.

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Stress Analysis in Cooling Process for Thermal Nanoimprint Lithography with Imprinting Temperature and Residual Layer Thickness of Polymer Resist

  • Kim, Nam Woong;Kim, Kug Weon
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.4
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    • pp.68-74
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    • 2017
  • Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

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A Study on the Fatigue Crack Propagation Behavior of Cr-Mo-V Alloy with Micro Defects at High Temperature. (미소 원공결함을 갖는 Cr-Mo-V강의 고온피로 크랙전파거동)

  • Song, Samhong;Kang, Myungsoo
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.12
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    • pp.70-77
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    • 1996
  • Fatigue tests were carried out at high temperature on a Cr-Mo-V steel in order to assess the fatigue life of components used in power plants. The characteristics of high temperature fatigue were divided in terms of cycle-dependent fatigue and time-dependent fatigue, each crack propagation rate was examined with respect to fatigue J-integral range, .DELTA. J$_{f}$and creep J-integral range, .DELTA. J$_{c}$. The fatigue life was evaluated by analysis of J-integral value at the crack tip with a dimensional finite element method. The results obtained from the present study are summarized as follows : The propagation characteristics of high temperature fatigue cracks are determined by .DELTA. J$_{f}$for the PP(tensile plasticity-compressive plasticity deformation) and PC(tensile plasticity - compressive creep deformation) stress waveform types, and by .DELTA. J$_{c}$for the CP(tensile creep- compressive plasticity deformation) stress waveform type. The crack propagation law of high temperature fatigue is obtained by analysis of J-integral value at the crack tip using the finite element method and applied to examine crack propagation behavior. The fatigue life is evaluated using the results of analysis by the finite element method. The predicted life and the actual life are close, within a factor of 2.f 2.f 2.

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Joule Heating Effects and Initial Resistance in Electromigration Test (EM시험에서의 Joule Heating 영향 및 초기저항값)

  • Ju, Cheol-Won;Gang, Hyeong-Gon;Han, Byeong-Seong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.6
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    • pp.436-441
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    • 1999
  • Joule heating effect in EM(Electromigration) test were performed on a bend test structure. EM test is done under high current densities(1.0-2.5MA/cm2), which leads to joule heating. Since joule heating is added to the controlled oven(stress) temperature, themetal line temperature is higher than the stress temperature. The increase in the stress temperature due to joule heating is important because EM phenomena and metal line failure are related to the stress temperature. In this paper, metal line was stressed with a current density of 1.0 MA/$cm^2$, 1.5MA/$cm^2$, 2.0MA/$cm^2$, 2.5MA/$cm^2$, for 1200 sec and temperature increase due to joule heating was less than $10^{\circ}C$. Also it took 30 minutes for the metal line to equalized with oven temperature. Recommendations are given for the EM test to determine the initial resistance of EM test structure under stress temperature and current density.

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A Thermal Stress Analysis for Suggested Shape of Al Hybrid Brake Disc (제안된 알루미늄 복합체 제동 디스크 형상의 열응력 해석)

  • Lim, Choong-Hwan;Goo, Byeong-Choon
    • Proceedings of the KSR Conference
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    • 2011.05a
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    • pp.283-288
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    • 2011
  • The high heat resistant material for brake disc is required for higher speed trains. Although Aluminum is very expensive, it which has high thermal conductivity and low density has been adapted to high performance light-weight brake disc. In this study, we carry out the thermal stress analysis for suggested shape of Al hybrid brake disc which was designed to meet the optimal point between a performance and economic side. And we compare the results from the analysis to results of conventional disc at the same braking speed. The result show that the temperature on braking surface of Al hybrid disc is lower than the temperature on conventional disc surface, whereas the maximum thermal stress is larger than stress on conventional disc.

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A Study of the Effect of Stress Waveform on the Behavior of High Temp. Fatigue Crack Propagation Using J Parameters (J파라미터를 이용한 고온피로균열전파 거동에 미치는 응력파형 영향의 연구)

  • Hur, Chung-Weon;Park, Won-Jo
    • Journal of the Korean Society of Safety
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    • v.15 no.2
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    • pp.8-12
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    • 2000
  • The fatigue crack propagation tests were performed in triangular and holding-time stress waveforms at $650^{\circ}C$. The behavior of fatigue crack propagation was investigated according to waveform. The analysis of high temperature fatigue crack propagation by the stress intensity factor range ${\Delta}K$, elastic fracture mechanics parameter, was not available. The behaviors of high temperature fatigue crack propagation by the J-integral(${\Delta}J_f$, J' and ${\Delta}J_c$), elasto-plastic fracture mechanics parameter, were investigated in a number of stress waveforms. The fast-fast waveform exhibited cycle-dependent(fatigue type), the slow-fast and the hold time with 500sec waveforms appear to be time-dependent(creep type) and the fast-slow and the hold time with 5, 25sec waveforms exhibited conbined behavior of both types(fatigue-creep conbined type).

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A Study on Coupled Field Analysis of 3-D Gas Turbine Blade (3차원 가스터빈 블레이드의 연성 해석에 관한 연구)

  • Park Keun-Hyung;Min Taeg-Ki;Park Chang-Soo
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.2
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    • pp.38-43
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    • 2006
  • A turbine blade operates under high temperature, high pressure, and the loads have the characteristics that the amplitudes change. Therefore, it is important to perform a stress analysis considering thermal and pressure loads. The purpose of this study is to investigate the effects of these loads on gas turbine blade through thermal stress analysis. The analysis results shows that pressure in gas fluid flow around blade is high in leading edge part, Gas temperature is connections with pressure of flow around blade. The distribution of stress from blade is appearing as is different at suction side and pressure side.