• 해운물류연구
• /
• 제35권1호
• /
• pp.93-109
• /
• 2019

본 연구는 혼합주기모형을 해운경기 예측에 활용하기 위해 기존의 비선형 장기균형관계분석에서 통계적으로 유의한 요인들을 단기모형에 적용하였다. 가장 일반적인 단일변수(univariate) AR(1) 모형과 혼합주기모형으로부터 각각 표본외 예측을 실시하여 예측오차와 비교한 결과 혼합주기모형의 예측력이 AR(1) 모형보다 향상됨을 확인하였다. 이러한 실증분석은 새로운 고차원 혼합주기모형이 해운경기변동 예측에 유용한 모형임을 의미하며, 즉, 최근 다변수 시계열 자료가 주로 장기균형관계(long-run equilibrium)를 대상으로 하고 있는데, 고차주기와 같은 정보를 분석에 포함할 경우 단기 해운경기 분석모형의 예측력이 향상될 수 있음을 의미하는 분석결과이다.

• Journal of Electrical Engineering and Technology
• /
• 제4권4호
• /
• pp.531-537
• /
• 2009

Lightning has a broad frequency spectrum from DC to a few MHz. Consequently, the high frequency performance of grounding systems for protection against lightning should be evaluated, with the distributed parameter circuit model in a uniform soil being used to simulate grounding impedances. This paper proposes a simulation method which applies the distributed parameter circuit model for the frequency-dependent impedance of vertically driven ground rods by considering multi-layered soil structures where ground rods are buried. The Matlab program was used to calculate the frequency-dependent ground impedances for two ground rods of different lengths. As a result, an increase of the length of ground rod is not always followed by a decrease of grounding impedance, at least at a high frequency. The results obtained using the newly proposed simulation method considering multi-layered soil structures are in good agreement with the measured results.

• 한국음향학회지
• /
• 제40권4호
• /
• pp.297-303
• /
• 2021

천해 환경에서 음파가 장거리 전파되는 경우, 해저면의 비균질성으로 인해 일반적으로 사용하는 Rayleigh reflection 모델을 적용한 음파전달 모의 결과보다 더 큰 전달손실을 보이는 것으로 알려지고 있다. 이에 따라 미 해군은 경험식 기반의 해저면 반사손실(High-Frequency Bottom Loss, HFBL) 모델을 적용하여 음파 전달을 예측하고 있다. 본 연구에서는 여름철 동해 천해환경에서 중주파수(2.3 kHz, 3 kHz)를 이용한 해상실험 전달손실 측정 및 분석이 수행되었다. BELLHOP 모델을 통해 고유음선을 추적한 결과, 임계각보다 낮은 수평입사각에 대해서만 음파가 수 km 이상 장거리 전파되었으며, Rayleigh reflection 모델 기반의 전달손실 예측값과 실측 전달 손실 값과의 차이는 전달거리가 증가함에 따라 점차 증가하는 경향을 보였다. 큰 수평입사각 영역에서 Rayleigh reflection 모델과 HFBL 모델을 비교하여 HFBL의 입력값인 해저면 province 값을 추정한 후, 이를 적용한 전달 손실을 모의하여 실측 전달 손실 값과 비교하였다. 그 결과 BELLHOP 모델의 반사 손실 모델로 경험식 기반의 HFBL을 적용하여 전달 손실을 모의했을 때, 실측 전달 손실과 일치하는 것을 확인할 수 있었다.

• Journal of Mechanical Science and Technology
• /
• 제19권3호
• /
• pp.768-777
• /
• 2005

This paper shows that the performance of a nonlinear fluid engine mount can be improved by an optimal design process. The property of a hydraulic mount with inertia track and decoupler differs according to the disturbance frequency range. Since the excitation amplitude is large at low excitation frequency range and is small at high excitation frequency range, mathematical model of the mount can be divided into two linear models. One is a low frequency model and the other is a high frequency model. The combination of the two models is very useful in the analysis of the mount and is used for the first time in the optimization of an engine mount in this paper. Normally, the design of a fluid mount is based on a trial and error approach in industry because there are many design parameters. In this study, a nonlinear mount was optimized to minimize the transmissibilities of the mount at the notch and the resonance frequencies for low and high-frequency models by a popular optimization technique of sequential quadratic programming (SQP) supported by $MATLAB^{(R)}$subroutine. The results show that the performance of the mount can be greatly improved for the low and high frequencies ranges by the optimization method.

• 전자공학회논문지
• /
• 제50권4호
• /
• pp.73-80
• /
• 2013

본 논문에서는 전송선의 정확한 고주파 특성화를 위해 실험적 접근을 기반으로 한 회로모델을 제안한다. 측정 시 불가피하게 발생하는 공진현상으로 인하여 배선의 길이에 상응하는 공진주파수에서 특성 임피던스 및 전파상수를 정확히 결정하기 어렵다. 따라서 물리적 통찰 및 이론을 바탕으로 이러한 공진효과가 배제된 전송선 파라미터 결정 방법이 제시되었다. 또한 고속신호의 전파 특성화를 위해 실험적으로 결정된 파라미터를 사용한 고주파 회로모델이 제안되었다. 본 논문에서 제안한 주파수 종속 전송선 파라미터 모델은 측정을 통해 검증되었으며, 고속 신호의 전파 특성화에 유용하게 적용될 수 있다.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2017년도 추계학술대회
• /
• pp.27-28
• /
• 2017

In this paper, design method for a high frequency transformer with high insulation is presented. The insulation performance of the high frequency transformer is determined by the distance between primary and secondary windings, and the characteristics of dielectric material. For the voltage strength safty, a high frequency transformer model is designed. By using computer simulation, the transformer model is evaluated.

• Advances in materials Research
• /
• 제1권1호
• /
• pp.37-49
• /
• 2012

In this paper, we present modeling and characterization of CNT-based TSVs to be used in high-frequency RF applications. We have developed an integrated model of CNT-based TSVs by incorporating the quantum confinement effects of CNTs with the kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as a monolithic microwave capacitor with the resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine the optimized configuration for CNT-based TSVs for high frequency RF applications.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 1997년도 추계학술대회논문집; 한국과학기술회관; 6 Nov. 1997
• /
• pp.402-407
• /
• 1997

For cylindrical shells, the closed-form solutions are limited only to the cases with special boundary and/or loading conditions. Though the finite element method is certainly a powerful solution approach for the general structural dynamics problems, it is known to provide reliable solutions only in the low frequency region due to the inherent high sensitivities of structural and numerical modeling errors. Instead, the spectral element method has been proved to provide extremely accurate dynamic responses even in the high frequency region. Since the wave characteristics of a cylindrical shell becomes identical to that of a flat plate as the frequency increases, an equivalent plate model (EPM) representing the high-frequency dynamic characteristics of a cylindrical shell is introduced herein. The EPM-based spectral element analysis solutions are compared with the known analytical solutions for the corresponding cylindrical shell to confirm the validity of the present modeling approach.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 1999년도 하계종합학술대회 논문집
• /
• pp.385-388
• /
• 1999

A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.146-150
• /
• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.