Characterization of high performance CNT-based TSV for high-frequency RF applications |
Kannan, Sukeshwar
(University of Alabama)
Kim, Bruce (University of Alabama) Gupta, Anurag (University of Alabama) Noh, Seok-Ho (Andong National University) Li, Li (Cisco Systems, Inc.) |
1 | Banerjee, K. and Srivastava, N. (2006), "Are carbon nanotubes the future of VLSI interconnections?", Proceedings of the 43rd Annual Design Automation Conference, San Fransisco, CA, July. |
2 | Benabe, E. (1998), "Automated characterization of ceramic multi-layer capacitors", The Proceedings of the 52nd Advanced RF Techniques Group Conference, Rohnert Park, December. |
3 | Burke, P.J. (2002), "Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotube", IEEE T. Nanotechnol., 1(3), 129-144. DOI ScienceOn |
4 | Datta, S. (1995), Electronic transport in mesoscopic systems, Cambridge University Press, Cambridge, UK. |
5 | Datta, S. (2004), "Electrical resistance: An atomistic view", Nanotechnology, 15(7), S433-S451. DOI ScienceOn |
6 | Greenhouse, H. (1974), "Design of planar rectangular microelectronic inductors", IEEE T. Parts, Hybrids, Packaging, 10(2), 101-109. DOI |
7 | Gupta, A., Kim, B., Kannan, S., Ahn, B. and Mohhamad, F. (2010), "Development of novel carbon nanotube TSV technology", Proceedings of the 60th Electronic Components and Technologies Conference, Las Vegas, June. |
8 | Han, K.J., Swaminathan, M. and Bandyopadhyay, T. (2010), "Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions", IEEE T. Adv. Packaging, 33(4), 804-817. DOI |
9 | ITRS ORTC (2008), International Technology Roadmap for Semiconductors, A. Allan, Rev 1 (for 7/16 Public Converence Prep.), San Francisco, July. |
10 | Kannan, S., Gupta, A., Kim, B., Mohammed, F. and Ahn, B. (2010), "Analysis of carbon nanotube based through silicon via", Proceedings of the 60th Electronic Components and Technologies Conference, Las Vegas, June. |
11 | Kim, B., Kannan, S., Gupta, A., Mohammed, F. and Ahn, B. (2010), "Development of carbon nanotube based through-silicon vias", J. Nanotechnol. Eng. Med., 1(2), 121-128. |
12 | Lakshminarayanan, B., Gordon Jr., H.C. and Weller T.M. (2000), "A substrate-dependent CAD model for ceramic multilayer capacitors", IEEE T. Microw. Theory Techniq., 48(10), 1687-1693. DOI ScienceOn |
13 | Maher, J.P., Jacobsen, R.T. and Laferty, R.E. (1978), "High-frequency measurements of Q-factors of ceramic chip capacitors", IEEE T. Compon. Hybrid. Manuf. Tech., 1(3), 257-264. DOI |
14 | Naeemi, A. and Meindl J.D. (2009), Carbon nan-otube electronics, Series on Integrated Circuits and Systems, Springer, New York, NY. |
15 | Pucel, R.A. (1981), "Design considerations for monolithic microwave circuits", IEEE T. Microw. Theory Tech., 29(6), 513-534. DOI |
16 | Steinhogl, W., Schindler, G., Steinlesberger, G., Traving, M. and Engelhardt, M. (2005), "Comprehensive study of the resistivity of copper wires with lateral dimensions 100 nm and smaller", J. Appl. Phys., 97(2), 61-67. |
17 | Yu, Z. and Burke, P.J. (2005), "Microwave transport in metallic single-walled carbon nanotubes", Nano Lett., 5(7), 1403. DOI ScienceOn |
18 | Zhu, J., Yu, Y., Hou, F. and Chen, C. (2010), "Through silicon via technologies for interconnects in RF MEMS", Microsyst. Technol., 16(7), 1045-1049. DOI ScienceOn |
19 | Avron, J.E., Elgart, A., Graf, G.M., Sadun, L. and Schnee, K. (2004), "Adiabatic charge pumping in open quantum systems", Commun. Pur. Appl. Math., 57(4), 528-561. DOI ScienceOn |
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