• 한국생산제조학회지
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• 제21권3호
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• pp.487-492
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• 2012

In this study we researched a spotlight in LED lighting. Ordinary LED spotlight was manufactured with characterized property of traveling straightness of LED light source, but multiple use of shell type LED, a yellow band has formed caused by light source interference between the LED. Also, there was a high miscellaneous light efficiency with losing light source homogeneity and efficiency due to light source control uneasiness. The study uses aspheric reflector and aspheric lens, so we can control the light source of LED spotlight with effectively and we reached surface light source by using COB/COM for LED module. Furthermore it can change its use by a reduced scale of light system. It has been designed to make its various application from low power consumption of bicycle lamp, up to high power consumption of automobile lamps and lighthouse.

• 전기학회논문지
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• 제57권12호
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• Current Optics and Photonics
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• 제1권6호
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• pp.626-630
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• 2017

GaN-based green light-emitting diode (LED) structures suffer from low internal quantum efficiency (IQE), known as the "green gap" problem. The IQE of LED structures is expected to be improved to some extent by exploiting the Purcell effect. In this study, the Purcell effect on the IQE of green LED structures is investigated numerically using a finite-difference time-domain simulation. The Purcell factor of flip-chip LED structures is found to be more than three times as high as that of epi-up LED structures, which is attributed to the high-reflectance mirror near the active region in the flip-chip LED structures. When the unmodified IQE is 20%, the relative enhancement of IQE can be greater than 50%, without utilizing the surface-plasmon coupling effect. Based on the simulation results, the "green gap" problem of GaN-based green LEDs is expected to be mitigated significantly by optimizing flip-chip LED structures to maximize the Purcell effect.

• 조명전기설비학회논문지
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• 제25권5호
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• pp.7-14
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• 2011

Currently high power Light Emitting Diode (LED) is in the limelight due to its characteristics of long durability, low maintenance costs, and high efficiency. Furthermore, it does not emit pollutants or poisonous gases and is a light source not using mercury, so it holds a high status in eco-friendly terms as well. In this paper, we studied a two-stage LED power drive circuit that can compensate only voltage regulation through LED output current, in order to improve efficiency of LED drive with constant current control in accordance with changes in temperature. The proposed LED drive has an advantage of reducing LED drive's voltage losses by controlling only voltage change of input power, compared with an existing circuit which controls input voltage. The suggested non-insulation compensating circuit for voltage change was verified to have improved efficiency relative to a LED drive using existing DC/DC converter.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.131-136
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• 2015

We develop the 60 W class hybrid solar LED street lamp controller. The controller is providing power via an inverter in the day with the least solar cell and battery and charging the battery for the ESS, acts as a power failure, the built-in battery. Rated output of the fabricated LED street lamp is 300 W or greater battery capacity 300 Wh, discharge time 10 hr, LED street lamp efficiency showed a very high level of light efficiency by about 127 lm/W. In addition, as a result of light distribution pattern according to the distance and the light intensity measurement will be able to ensure a very high quality, show the constant brightness in the distance from the road lights 6 m is about 35~40 lux in uniformity ratio. The proposed hybrid solar LED street lamp system showed a high energy capacity of approximately 1.5 to 152.7% power generation efficiency than typical conventional solar street lamp.

• Journal of Information Display
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• 제10권3호
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• pp.97-100
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• 2009

A backlight unit for a 42-inch LCD TV was manufactured with red, green, and blue LED lamps. The luminous and light extraction efficiencies of the LED lamps were increased by improving their light reflection structures and thermal properties. The blue, green, and red LED lamps showed different luminous efficiencies as a function of the input current. Compared to the conventional red LED lamp, however, the developed red LED lamp showed very high luminous efficiency in a low drive current. Taking these luminous efficiencies into account, the fabricated backlight unit showed high energy efficiency, low power consumption, and a wide color gamut.

• 조명전기설비학회논문지
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• 제18권3호
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• pp.20-26
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• 2004

본 논문에서는 조명용 고휘도(HB, high brightness) 백색 LED(light emitting diode)램프의 배열 및 여러 가지 등기구 글로브(globe)의 형태에 따른 광도(luminous intensity)값과 기구효율(luminaire efficiency)을 컴퓨터 시뮬레이션으로 수행하여 비교분석 하였다. 즉, LED의 배열은 가로${\times}$세로(7개${\times}$7개)가 정사각형 형태로 49개를 배열하고, LED 간격은 LED의 발광면 중심부로부터 8.2[mm], 10.0[mm], 15.0[mm]로 각각 3가지로 하였으며, 등기구의 글로브는 LED발광면 중심부에서 30[mm], 50[mm] 떨어진 거리로 구분하였다. 또한 등기구 글로브가 없을 때와 있을때로 구분하여 있을 때에는 글로브 형태를 볼록 원형과 엠보(embossing)형태로 구분하고 엠보는 8.2[mm], 5.0[mm]의 크기에 따른 선택으로 시뮬레이션 27가지로 수행하여 등기구의 글로브 형태에 따른 광도 및 기구효율을 고찰해 봄으로써 앞으로 21세기 디지털조명이라고 일컫는 LED를 사용한 LED 광원(light source) 및 등기구 개발에 많은 도움이 되고자 하였다.

• 전력전자학회논문지
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• 제11권3호
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• pp.201-208
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• 2006

최근 에너지 절약에 대한 관심이 고조되면서 기존 광원보다 효율이 좋은 광원개발이 계속되고 있으며 그 대표적인 것이 고효율 및 고출력(high-power) LED이다. 고출력 LED의 개발로 인해 일부에서는 일반 조명용으로 사용하려는 연구가 진행 중이며 풍력과 태양광 발전을 이용한 야간 조명용 전원으로 사용하려는 연구도 진행되고 있다. 이에 본 논문에서는 조명용 광원으로 직류 전원을 이용한 고출력 LED의 사용 가능성을 확인하고자 하며 기존 방식에 비하여 보다 안정적이고 효율이 좋은 새로운 LED 전원구동장치를 제안한다. 제안된 방식은 기존 방식보다 리액터의 크기를 줄일 수 있었으며 효율이 개선됨을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.17.1-17.1
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• 2011

Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as a type of implantable LED biosensor and as a therapy tool.

• 한국산학기술학회논문지
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• 제20권1호
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• pp.170-178
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• 2019

최근 에너지 절감에 대한 관심도가 높아짐에 따라 에너지 소비가 높은 형광등과 백열등을 대체하는 친환경소재인 LED의 조명을 활용하는 움직임이 활발하다. 그러나, 고출력 LED의 경우 발열에 의한 열화현상 때문에 수명이 단축되는 현상이 발생하게 된다. 이에 대한, 해결방안으로 본 논문은 LED Packing중 방열판표면의 거칠기 처리를 통하여 열전달 계수를 증대시킴으로서 LED 수명연장 효과를 평가하였다. 거칠기 공정은 사포 및 샌드블라스트를 이용하여 진행하였다. 각 표면처리 공정에 따른 거칠기 및 표면적 변화를 정량적으로 평가하였으며, 열전달 계수를 측정하였다. 샌드블라스트, 사포를 이용하여 알루미늄 표면에 거칠기처리를 진행했을 경우 미 처리 시 보다 높은 대류 열전달 계수를 얻을 수 있었고, 샌드블라스트 처리 시 약 82.76%의 높은 방열 효율 향상을 얻을 수 있어, 이를 방열판에 적용할 시 큰 경제적 부담 없이 기존대비 더 높은 방열효율 증대를 통해 LED 수명을 대폭 연장 시킬 것으로 기대된다.