• Title/Summary/Keyword: High angle grain boundaries

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Radiation induced grain boundary segregation in ferritic/martensitic steels

  • Xia, L.D.;Ji, Y.Z.;Liu, W.B.;Chen, H.;Yang, Z.G.;Zhang, C.;Chen, L.Q.
    • Nuclear Engineering and Technology
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    • v.52 no.1
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    • pp.148-154
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    • 2020
  • The radiation induced segregation of Cr at grain boundaries (GBs) in Ferritic/Martensitic steels was modeled assuming vacancy and interstitialcy diffusion mechanisms. In particular, the dependence of segregation on temperature and grain boundary misorientation angle was analyzed. It is found that Cr enriches at grain boundaries at low temperatures primarily through the interstitialcy mechanism while depletes at high temperatures predominantly through the vacancy mechanism. There is a crossover from Cr enrichment to depletion at an intermediate temperature where the Cr:Fe vacancy and interstitialcy diffusion coefficient ratios intersect. The bell-shape Cr enrichment response is attributed to the decreasing void sinks inside the grains as temperature rises. It is also shown that low angle grain boundaries (LAGBs) and special Σ coincidence-site lattice (CSL) grain boundaries exhibit suppressed radiation induced segregation (RIS) response while high angle grain boundaries (HAGBs) have high RIS segregation. This different behavior is attributed to the variations in dislocation density at different grain boundaries.

Dislocation structure in hot-pressed polycrystalline $TiB_{2}$ (고온가압성형된 다결정 $TiB_{2}$내에서 전위구조)

  • Kwang Bo Shim;Brian Ralph;Keun Ho Auh
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.2
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    • pp.194-202
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    • 1996
  • Transmission electron microscopy has been used to characterize the dislocation structure in hot-pressed titanium diboride. The thin foil samples were prepared by the conventional ion beam thinning technique and reveal the main features associated with the dislocations ; low-angle grain boundaries with dislocation arrays, high-angle grain boundaries with ledges/steps on the boundary planes. The ledges/steps on the grain boundaries were characterized as the origin of defect structures such as dislocation formation or crack propagation near grain boundaries. A fraction of the high angle grain boundaries contained periodic arrays of grain boundary dislocations. The Burger's vectors of the dislocations in the $TiB_{2}$specimens were determined.

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Effects of Alloy Additions and Annealing Parameters on Microstructure in Cold-Rolled Ultra Low Carbon Steels (극저탄소 냉연강판에서 합금원소 및 어닐링조건이 미세조직에 미치는 영향)

  • Jeong, Woo Chang
    • Journal of the Korean Society for Heat Treatment
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    • v.17 no.2
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    • pp.78-86
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    • 2004
  • Effects of the annealing parameters on the formation of ferrites transformed at low temperatures were studied in cold-rolled ultra low carbon steels with niobium and/or chromium. Niobium and chromium were found to be effective in the formation of the low temperature transformation ferrites. The low temperature transformation ferrites more easily formed when both higher annealing temperature and longer annealing time, allowing substitutional alloying elements to distribute between phases, are in combination with faster cooling rate. It was found from EBSD study that the additions of niobium or chromium resulted in the increase in the numbers of high angle grain boundaries and the decrease in those of the low angle grain boundaries in the microstructures. Both granular bainitic ferrite and bainitic ferrite were characterized by the not clearly etched grain boundaries in light microscopy because of the low angle grain boundaries.

Microstructure and Mechanical Behavior of Ultrafine Grained Bulk Al Processed by High Pressure Torsion of the Al Powders (고압비틀림 성형 공정에 의한 Al 분말의 초미세결정 벌크화 및 특성 평가)

  • Joo, Soo-Hyun;Yoon, Seung-Chae;Lee, Chong-Soo;Kim, Hyong-Seop
    • Journal of Powder Materials
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    • v.17 no.1
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    • pp.52-58
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    • 2010
  • Bulk nanostructured metallic materials are generally synthesized by bottom-up processing which starts from powders for assembling bulk materials. In this study, the bottom-up powder metallurgy and High Pressure Torsion (HPT) approaches were combined to achieve both full density and grain refinement at the same time. After the HPT process at 473K, the disk samples reached a steady state condition when the microstructure and properties no longer evolve, and equilibrium boundaries with high angle grain boundaries (HAGBs) were dominant. The well dispersed alumina particles played important role of obstacles to dislocation glide and to grain growth, and thus, reduced the grain size at elevated temperature. The small grain size with HAGBs resulted in high strength and good ductility.

Microstructural Evolution during the Equal Channel Angular Pressing of Ti-6Al-4V Alloy (Ti-6AI-4V 합금의 ECAP 가공에 따른 미세조직의 변화)

  • 고영건;정원식;신동혁;이종수
    • Transactions of Materials Processing
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    • v.11 no.6
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    • pp.519-528
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    • 2002
  • The microstructural evolution during the equal channel angular pressing of Ti-6Al-4V alloy was investigated using the transmission electron microscopy (TEM). ECA pressing was carried out isothermally with route C at $600^{\circ}C$ for two types of initial microstructure, i.e., equiaxed and Widmanstatten microstructures. At an initial stage of ECA pressing, the equiaxed microstructure showed more uniform flow than the Widmanstatten microstructure. However, both microstructures were significantly refined revealing nearly equiaxed grains of 0.3$mu extrm{m}$ in diameter with high angle grain boundaries after 4 passes of ECA pressing. These ultrafine gains were found to be stable with little grain growth, when annealed up to $600^{\circ}C$ for 1hr.

Formation of Ultrafine Grains in Cu-Fe-P Alloy by Accumulative Roll-Bonding Process (ARB법에 의한 Cu-Fe-P합금의 초미세결정립 형성)

  • Lee, Seong-Hee;Han, Seung-Zeon;Kim, Hyoung-Wook;Lim, Cha-Yong
    • Korean Journal of Materials Research
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    • v.19 no.8
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    • pp.432-436
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    • 2009
  • A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

Epitaxial Growth of Boron-doped Si Film using a Thin Large-grained Si Seed Layer for Thin-film Si Solar Cells

  • Kang, Seung Mo;Ahn, Kyung Min;Moon, Sun Hong;Ahn, Byung Tae
    • Current Photovoltaic Research
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    • v.2 no.1
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    • pp.1-7
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    • 2014
  • We developed a method of growing thin Si film at $600^{\circ}C$ by hot wire CVD using a very thin large-grained poly-Si seed layer for thin-film Si solar cells. The seed layer was prepared by crystallizing an amorphous Si film by vapor-induced crystallization using $AlCl_3$ vapor. The average grain size of the p-type epitaxial Si layer was about $20{\mu}m$ and crystallographic defects in the epitaxial layer were mainly low-angle grain boundaries and coincident-site lattice boundaries, which are special boundaries with less electrical activity. Moreover, with a decreasing in-situ boron doping time, the mis-orientation angle between grain boundaries and in-grain defects in epitaxial Si decreased. Due to fewer defects, the epitaxial Si film was high quality evidenced from Raman and TEM analysis. The highest mobility of $360cm^2/V{\cdot}s$ was achieved by decreasing the in-situ boron doping time. The performance of our preliminary thin-film solar cells with a single-side HIT structure and $CoSi_2$ back contact was poor. However, the result showed that the epitaxial Si film has considerable potential for improved performance with a reduced boron doping concentration.

Effect of Calcium Doping in Low Angle Grain Boundaries of $YBa_2Cu_3O_{7-\delta}$ on Textured Metal Substrates

  • Kang, B.W.;A. Goyal;F.A. List;D.K. Christen;H. R. Kerchner;S. Sathyamurthy;Lee, D.F.;Martin, P.M.;Koreger, D.M.
    • Progress in Superconductivity
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    • v.4 no.1
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    • pp.10-13
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    • 2002
  • We report the effect of Ca doping in $YBa_2Cu_3O_{7-\delta}$ (YBCO) thin films grown on the Rolling- Assisted, Biaxially Textured Substrates (RABiTS) with the architecture of $CeO_2/YSZ/CeO_2/Ni$. Critical currents of bilayer and trilayer structures of $YBCO/Y_{0.7}Ca_{0.3}Ba_2Cu_3O_{7-\delta}$/(YCaBCO) as well as undoped YBCO for comparison have been measured in a wide range of temperatures and fields. For $6-8^{\circ}$ grain boundaries, 30% Ca-doping in bilayer structure enhances $J_c$ as high as 35%. The enhancement is larger at low temperatures and at magnetic fields. On the other hand, 30% Ca-doping in trilayer structure reduces $J_c$ as high as 60%. Combined with slightly lower $T_c$, this indicates that Ca is overdoped in this structure and degrades GBs.

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An Investigation of Sliding Wear and Microstructural Evolution of Ultra-Fine Grained Pure Al Fabricated by ARB Process (누적압연접합(Accumulative Roll-Bonding, ARB)에 의한 Al의 결정립 미세화와 마모 특성 연구)

  • Park K.S.;Lee T.O.;Kim Y.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2000.10a
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    • pp.21-24
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    • 2000
  • Ultra-fine grains were produced in pure Al using an Accumulative Rolling-Bonding (ARB) process. After several cycles of the ARB process, pure Al sheets were filled with the ultra-fine grains whose diameters were several hundred nano-meters. With ARB cycles, the nature of grain boundaries of the ultra-fine grains changed from diffusive sub-boundaries to well-defined high angle boundaries. After 7 cycles, ultra-fine polycrystals with large misorientations between neighboring grains were obtained. Sliding wear tests using a pin-on-disk type wear tester were co ducted on the ultra-fine grained pure Al. Wear rates of pure Al increased with the increase of ARB cycle numbers in spite of the increase in hardness. Worn surfaces and cross-sections were examined with optical microscopy (OM) and scanning electron microscopy (SEM) In investigate the wear mechanism of the ultra-fine grained pure Al.

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Microstructural Evolution during the Equal Channel Angular Pressing of Ti-6Al-4V Alloy (Ti-6Al-4V 합금의 ECAP 가공시 미세 조직의 변화 연구)

  • 고영건;정원식;신동혁;이종수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.177-180
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    • 2002
  • The effects of pressing temperatures on the formability and the microstructural evolution during equal channel angular pressing (ECAP) of lamellar Ti-6Al-4V alloy were investigated in this study. ECAP above isothermally 600$^{\circ}C$ was successful without producing any noticeable segments at the specimen surfaces after a single pass of pressing. After 4 passes of ECA pressing, lamellar microstructures were significantly refined revealing equiaxed grains of 0.3$\mu\textrm{m}$ in diameter consisting of high angle grain boundaries. Also these ultrafine grains were relatively stable with little grain growth when annealed up to 600$^{\circ}C$ for 1hour.

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