• 제목/요약/키워드: High Speed Drilling Process

검색결과 25건 처리시간 0.03초

실험계획법에 의한 마이크로 드릴링 공정의 최적 절삭조건 결정 (Determination of Optimum Micro Drilling Conditions Using Experimental Design Methods)

  • 김동우;조명우;이응숙;서태일
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.993-998
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    • 2002
  • watches, air bearings and printed circuit hoards (PCB). However, it is not easy to determine optimum cutting conditions since the micro drilling process is very sensitive to various disturbances. Also, undesirable characteristics to optimize the micro drilling are small signal-to-noise ratios, drill wandering motions and high aspect ratios. Thus, in this study, experimental design methods are applied to determine optimum cutting conditions. Suing the methods, three cutting parameters, fred, step and curving speed are optimized to minimize thrust forces. Obtained conditions are verified through required experimental works. As the results, it is shown that the experimental methods can be applied to micro drilling processes to determine Optimum Cutting Conditions.

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레이저 트레판닝 드릴링을 위한 광학 설계 (Optical Design for Trepanning Drilling)

  • 노지환;이제훈;서정;손현기;신동식
    • 한국레이저가공학회지
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    • 제10권3호
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    • pp.11-14
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    • 2007
  • A trepanning optics is the optical system which makes focus laser beam rotate and incline to the material processing surface. The trepanning optics is used in order to improve the quality of laser drilling process and control the taper of drilling diameter. In order to make trepanning optics, we can use the eccentricity of lens, scanner using two mirror, dove prism, or wedge. Among these method, in this paper wedge is used for trepanning optics. The wedge trepanning optics has advantage on the high speed of rotation. In this paper, we design the wedge trepanning optics using ray tracing. ements and engine design variables of system to satisfy the customer's requirements.

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고온선박엔진용 MoSi$_2$금속간화합물의 경도와 방전가공특성 (Hardness and EDM Processing of MoSi$_2$Intermetallics for High Temperature Ship Engine)

  • 윤한기;이상필
    • 한국해양공학회지
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    • 제16권6호
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    • pp.60-64
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    • 2002
  • This paper describes the machining characteristics of the MoSi$_2$--based composites through the process of electric discharge drilling with various tubular electrodes. In addition to hardness characteristics, microstructures of Nb/MoSi$_2$laminate composites were evaluated from the variation of fabricating conditions, such as preparation temperature, applied pressure, and pressure holding time. MoSi$_2$-based composites have been developed in new materials for jet engines of supersonic-speed airplanes and gas turbines for high-temperature generators. These high performance engines may require new hard materials with high strength and high temperature-resistance. Also, with the exception of grinding, traditional machining methods are not applicable to these new materials. Electric discharge machining (EDM) is a thermal process that utilizes a spark discharge to melt a conductive material. The tool electrode is almost -unloaded, because there is n direct contact between the tool electrode and the work piece. By combining a non-conducting ceramic with more conducting ceramic, it was possible to raise the electrical conductivity. From experimental results, it was found that the lamination from Nb sheet and MoSi$_2$ powder was an excellent strategy to improve hardness characteristics of monolithic MoSi$_2$. However, interfacial reaction products, like (Nb, Mo)SiO$_2$and Nb$_2$Si$_3$formed at the interface of Nb/MoSi$_2$, and increased with fabricating temperature. MoSi$_2$composites, with which a hole drilling was not possible through the conventional machining process, enhanced the capacity of ED-drilling by adding MbSi$_2$, relative to that of SiC or ZrO$_2$reinforcements.

피코초 레이저 및 CDE를 이용한 TSV가공기술 (TSV Formation using Pico-second Laser and CDE)

  • 신동식;서정;조용권;이내응
    • 한국레이저가공학회지
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    • 제14권4호
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    • pp.14-20
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    • 2011
  • The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

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반도체금형에서 부속부품의 재료선정 및 개선과 제작에 관한 연구 (A study on material selection for semiconductor die parts and on their modification and manufacture)

  • 김세환;최계광
    • Design & Manufacturing
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    • 제8권1호
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    • pp.27-30
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    • 2014
  • Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.

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초정밀 반도체 금형 제작을 위한 슈퍼드릴 방전가공기 전극가이드 개발과 미세홀 방전가공 (Development of Electrode Guide of Super-drill EDM and Electrical Discharge Machining of Small Hole for High Precision Semiconductor Die)

  • 박찬해;김종업;왕덕현;김원일
    • 한국기계가공학회지
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    • 제4권3호
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    • pp.32-38
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    • 2005
  • Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

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실험계획법을 이용한 M2-Cu 기능성 경사 재료의 마이크로 드릴링 특성 평가 (Characterization of Microscale Drilling Process for Functionally Graded M2-Cu Material Using Design of Experiments)

  • 심종우;최대철;신기훈;김홍석
    • 한국생산제조학회지
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    • 제24권5호
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    • pp.502-507
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    • 2015
  • In this study, a microscale drilling process was conducted to evaluate the cutting characteristics of functionally graded materials. A mixture of M2 and Cu powders were formed and sintered to produce disk specimens of various compositions. Subsequently, a microscale hole was created in the specimen by using a desktop-size micro-machining system. By using design of experiments and analysis of variance, it was found that the M2-Cu composition, spindle speed, and the interactions between these two factors had significant effects on the magnitude of cutting forces. However, the influence of feed rate on the cutting force was negligible. A mathematical model was established to predict the cutting force under a wide range of process conditions, and the reliability of the model was confirmed experimentally. In addition, it was observed that increasing the wt% of Cu in an M2-Cu specimen increased the high-frequency amplitude of cutting forces.

레이저 유도 열화학 습식에칭을 이용한 티타늄 미세구조물 제조 (Laser-induced Thermochemical Wet Etching of Titanium for Fabrication of Microstructures)

  • 신용산;손승우;정성호
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.32-38
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    • 2004
  • Laser-induced thermochemical wet etching of titanium in phosphoric acid has been investigated to examine the feasibility of this method fur fabrication of microstructures. Cutting, drilling, and milling of titanium foil were carried out while examining the influence of process parameters on etch width, etch depth, and edge straightness. Laser power, scanning speed of workpiece, and etchant concentration were chosen as major process parameters influencing on temperature distribution and reaction rate. Etch width increased almost linearly with laser power showing little dependence on scanning speed while etch depth showed wide variation with both laser power and scanning speed. A well-defined etch profile with good surface quality was obtained at high concentration condition. Fabrication of a hole, micro cantilever beam, and rectangular slot with dimension of tess than 100${\mu}{\textrm}{m}$ has been demonstrated.

회전 초음파가공 주축 개발에 관한 연구 (A Study on the Development of Rotary Ultrasonic Machining Spindle)

  • 이상평;김민엽;박종권;고태조
    • 한국기계가공학회지
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    • 제14권4호
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    • pp.160-166
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    • 2015
  • Ultrasonic machining (USM) has been considered a new, cutting-edge technology that presents no heating or electrochemical effects, with low surface damage and small residual stresses on brittle workpieces. However, nowadays, many researchers are paying careful attention to the disadvantages of USM, such as low productivity and tool wear. On the other hand, in this study, a high-performance rotary ultrasonic drilling (RUD) spindle is designed and assembled. In this system, the core technology is the design of an ultrasonic vibration horn for the spindle using finite element analysis (FEA). The maximum spindle speed of RUM is 9,600 rpm, and the highest harmonic displacement is $5.4{\mu}m$ noted at the frequency of 40 kHz. Through various drilling experiments on glass workpieces using a CVD diamond-coated drill, the cutting force and cracking of the hole entrance and exit side in the glass have been greatly reduced by this system.

다이아몬드 피복공구에 의한 SiC 강화 복합재료의 절삭특성 (Machining Characteristics of SiC reinforced Composite by multiple diamond-coated drills)

  • M. Chen;Lee, Y. M.;S. H. Yang;S. I. Jang
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.533-537
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    • 2003
  • Compared to sintered polycrystalline diamond (PCD), the deposited thin film diamond has a great advantage on the fabrication of cutting tools with complex geometries such as drills. Because of high performance in high speed machining non-ferrous difficult-to-cut materials in the field of automobiles industry, aeronautics and astronautics industry, diamond-coated drills find large potentialities in commercial applications. However, the poor adhesion of the diamond film on the substrate and high surface roughness of the drill flute adversely affect the tool lift and machining quality and they become the main technical barriers for the successful development and commercialization of diamond-coated drills. In this paper, diamond thin films were deposited on the commercial WC-Co based drills by the electron aided hot filament chemical vapor deposition (EACVD). A new multiple coating technology based on changing gas pressure in different process stages was developed. The large triangular faceted diamond grains may have great contribution to the adhesive strength between the film and the substrate, and the overlapping ball like blocks consisted of nanometer sized diamond crystals may contribute much to the very low roughness of diamond film. Adhesive strength and quality of diamond film were evaluated by scanning electron microscope (SEM), atomic force microscope (AFM), Raman spectrum and drilling experiments. The ring-block tribological experiments were also conducted and the results revealed that the friction coefficient increased with the surface roughness of the diamond film. From a practical viewpoint, the cutting performances of diamond-coated drills were studied by drilling the SiC particles reinforced aluminum-matrix composite. The good adhesive strength and low surface roughness of flute were proved to be beneficial to the good chip evacuation and the decrease of thrust and consequently led to a prolonged tool lift and an improved machining quality. The wear mechanism of diamond-coated drills is the abrasive mechanical attrition.

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