• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.88-88
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• 2010

High Voltage cross-linked polyethylene (XLPE) cables are widely used in a thermal power plant. These cables had been in service for 26 years. The insulation condition of six 6 kV XLPE cables was estimated by insulation diagnostic analyzer (IDA) with voltage amplifier. IDA was measured dissipation factor and capacitance of the whole cable as a function of frequency and voltage. This system measures in the frequency range from 0.1 to 10 Hz at each voltage level. Six XLPE cables are judged good condition, but three cables are analyzed at an aged condition.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

• Current Photovoltaic Research
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• v.6 no.2
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• pp.39-42
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• 2018

When the PV module is illuminated in a high temperature region, solar cells are also exposed to the high temperature external environment. The operating temperature of the solar cell inside the module is increased, which causes the power drops. Various efforts have been made to reduce the operating temperature and compensate the power of solar cells according to the outdoor temperature such as installing of a cooling system. Researches have been also reported to lower the operating temperature of solar cells by improving the heat dissipation properties of the backsheet. In this study, we conducted a test to measure the internal temperature of each module components and the external temperature when the light was irradiated according to the surrounding temperature. Backsheets with different thermal conductivities were compared in the test. Finally, in order to explain the temperature difference between the solar cell and the outside of the module, we proposed an evaluation method of the heat transfer characteristics of photovoltaic modules with different backsheet.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.57-60
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• 2004

This paper presents multibit Sigma-Delta ADC using Leslie-Singh Structure to Improve nonlinearity of feedback loop. 4-bit flash ADC for multibit Quantization in Sigma Delta modulator offers the following advantages such as lower quantization noise, more accurate white-noise level and more stability over single quantization. For the feedback paths consisting of DAC, the DAC element should have a high matching requirement in order to maintain the linearity performance which can be obtained by the modulator with a multibit quantizer. Thus a Sigma-Delta ADC usually adds the dynamic element matching digital circuit within feedback loop. It occurs complexity of Sigma-Delta Circuit and increase of power dissipation. In this paper using the Leslie-Singh Structure for improving nonliearity of ADC. This structure operate at low oversampling ratio but is difficult to achieve high resolution. So in this paper propose improving loop filter for single-bit feedback multi-bit quantization Sigma-Delta ADC. It obtained 94.3dB signal to noise ratio over 615kHz bandwidth, and 62mW power dissipation at a sampling frequency of 19.6MHz. This Sigma Delta ADC is fabricated in 0.25um CMOS technology with 2.5V supply voltage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.4
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• pp.309-314
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• 2012

To assess the condition of stator insulation, nondestructive and overpotential tests were performed on four high voltage motors. The stator windings under these tests have nominal ratings of 6.6 kV. After completing nondestructive tests, the AC overvoltage applied to the stator windings was gradually increasing until insulation failure in order to obtain the breakdown voltage. No. 1, No. 2, No. 3 and No. 4 of 6.6 kV motors failed near rated voltage of 18.4 kV, 19.8 kV, 19.7 kV and 21.7 kV, respectively. The breakdown voltage of four motors was higher that expected for good quality coils(14.2 kV) in 6.6 kV motors. Almost all of failures were located in a line-end coil at the exit from the core slot. The breakdown voltages and the types of defects showed strong relation to the stator insulation tests such as in the case of AC current, dissipation factor($tan{\delta}$) and partial discharge magnitude.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.231-234
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• 2005

The high temperature deformation behavior of AZ 31 Mg alloy was investigated by designing a back propagation neural network that uses a gradient descent-learning algorithm. A neural network modeling is an intelligent technique that can solve non-linear and complex problems by learning from the samples. Therefore, some experimental data have been firstly obtained from continuous compression tests performed on a thermo-mechanical simulator over a range of temperatures $(250-500^{\circ}C)$ with strain rates of $0.0001-100s^{-1}$ and true strains of 0.1 to 0.6. The inputs for neural network model are strain, strain rate, and temperature and the output is flow stress. It was found that the trained model could well predict the flow stress for some experimental data that have not been used in the training. Workability of a material can be evaluated by means of power dissipation map with respect to strain, strain rate and temperature. Power dissipation map was constructed using the flow stress predicted from the neural network model at finer Intervals of strain, strain rates and subsequently processing maps were developed for hot working processes for AZ 31 Mg alloy. The safe domains of hot working of AZ 31 Mg alloy were identified and validated through microstructural investigations.

• Proceedings of the KIPE Conference
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• 2017.07a
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• pp.96-97
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• 2017

본 논문은 Gallium Nitride-Field Effect Transistor(GaN-FET)를 적용한 고방열 및 고전력밀도 모듈형 벅 컨버터를 제안한다. Si-MOSFET를 적용한 벅 컨버터는 높은 스위칭 손실로 인해 고주파수 구동 및 자기소자 사이즈 저감에 한계가 존재하여 고전력밀도화가 어렵다. 반면, 제안된 방식은 스위칭 특성이 우수한 GaN-FET를 적용하여 고주파수 구동이 가능하며, 추가로 평면형 인덕터를 적용함으로써 자기소자의 부피 저감을 통해 컨버터의 고전력밀도화 및 모듈화가 가능하다. 특히, 방열 플레이트 및 케이스로 구성된 새로운 고방열 구조를 통해 방열효과를 극대화 시킬 수 있다. 제안된 모듈형 벅 컨버터의 타당성 검증을 위해 입력전압 48V, 출력전압 24V의 300W급 시작품 제작을 통한 실험결과를 제시한다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.438-445
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• 2017

This paper presents a low-power high-resolution band-pass ${\Sigma}{\Delta}$ ADC for accelerometer applications. The proposed band-pass ${\Sigma}{\Delta}$ ADC consists of a high-performance 6-th order feed-forward ${\Sigma}{\Delta}$ modulator with 1-bit quantization and a low-power, area-efficient digital filter. The ADC is fabricated in 180 nm 1P6M mixed-signal CMOS process with a die area of $5mm^2$. This high-resolution ADC got 90 dB peak signal to noise plus distortion ratio (SNDR) and 96 dB dynamic range (DR) over 4 kHz bandwidth, while the intermediate frequency (IF) is shifting from 100 KHz to 200 KHz. The power dissipation of the chip is 5.6 mW under 1.8 V (digital)/3.3 V (analog) power supply.

• Journal of Electrical Engineering and information Science
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• v.3 no.3
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• pp.300-305
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• 1998

This paper describes new sense amplifier with fast sensing delay time of 0.54ns and 32kb CMOS embedded SRAM with 4.67 ns access time for a 3-V power supply. It was achieved using the sense amplifier with multiple point sensing scheme and highs peed bit-line scheme. The sense amplifier saves 25% of the power dissipation compared with the conventional one while maintaining a very short sensing delay. The SRAM uses 0.5m double-polysilicon and triple-metal CMOS process technology. A die size is 1.78${\times}$mm2.13mm.