• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.3 s.357
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• pp.26-34
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• 2007

This Paper describes a chip design technique for body composition analyzer based on the BIA (Bioelectrical Impedance Analysis) method. All the functions of signal forcing circuits to the body, signal detecting circuits from the body, Micom, SRAM and EEPROMS are integrated in one chip. Especially, multi-frequency detecting method can be applied with selective band pass filter (BPF), which is designed in weak inversion region for low power consumption. In addition new full wave rectifier (FWR) is also proposed with differential difference amplifier (DDA) for high performance (small die area low power consumption, rail-to-rail output swing). The prototype chip is implemented with 0.35um CMOS technology and shows the power dissipation of 6 mW at the supply voltage of 3.3V. The die area of prototype chip is $5mm\times5mm$.

• Journal of IKEEE
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• v.12 no.1
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• pp.1-7
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• 2008

With the recent development of portable system such as mobile communication and multimedia. Full adders are important components in applications such as digital signal processors and microprocessors. Thus It is important to improve the power dissipation and operating speed for designing a full adder. We propose a new adder with modified version of conventional Ratioed logic and Pass Transistor logic. The proposed adder has the advantages over the conventional CMOS, TGA, 14T logic. The delay time is improved by 13% comparing to the average value and PDP(Power Delay Product) is improved by 9% comparing to the average value. Layouts have been carried out using a 0.18um CMOS design rule for evaluation purposes. The physical design has been evaluated using HSPICE.

• Journal of Electrical Engineering and Technology
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• v.11 no.3
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• pp.781-789
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• 2016

Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.107-107
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• 2017

전자제품의 성능이 향상됨에 따라서 전자제품에 사용되는 부품의 고집적화가 필연적으로 요구되고 있으며, 고집적화 된 전자제품의 방열(heat dissipation)에 관한 문제점이 대두되고 있다. 방열은 전자기기의 성능과 수명을 유지하는데 있어서 중요한 문제 중 하나로서 방열 효과를 높이기 위해 다양한 연구 개발이 진행 중이다. 방열에 사용되는 소재로는 Cu가 있으며, 저렴한 가격과 상대적으로 높은 방열 효율을 가지는 장점이 있다. Cu는 전기 도금 증착 방법을 사용하여왔으나, 전기도금 방식으로 증착된 Cu 방열판은 제품에 열이 축적될 경우 Cu와 substrate 사이의 residual stress로 인해 박리나 뒤틀림 현상 등이 발생하여 high power를 사용하는 device의 방열 소재로 사용하기에는 개선해야 할 문제점이 있다. 이러한 문제점을 극복하기 위한 방법으로 magnetron sputter 증착 방법이 있으며, magnetron sputter은 대면적화가 용이하고, 다양한 물질의 증착이 가능한 장점으로 인해 hard coating 또는 thin film 증착과 같은 공정에 사용되고 있다. 특히 증착된 film의 특성을 조절하기 위해서 magnetron sputter에 pulse 또는 ICP (inductively coupled plasma) assisted 등을 적용하여 plasma 특성을 조절하는 방법 등에 관한 연구가 보고되고 있다. 본 연구에서는 pulsed magnetron sputtering 방식을 이용하여 증착된 Cu film 특성 변화를 확인하였다. 다양한 pulsing frequency와 pulsing duty ratio 조건에서, Si substrate 위에 증착된 Cu film과의 residual stress 변화를 측정하였다. Pulse duty ratio가 90% 에서 60%로 감소함에 따라서 Cu film의 residual stress가 감소하였고, pulsing frequency가 증가함에 따라 Cu film의 residual stress가 감소하는 것을 확인하였다. 증착 조건에 따른 plasma의 특성 분석을 위하여 oscilloscope를 이용하여 voltage와 current를 측정하였고, Plasma Sampling Mass spectrometer 를 이용하여 ion energy의 변화를 측정하였다. 이를 통해 plasma 특성 변화가 증착된 Cu film에 미치는 영향과 residual stress의 변화에 대한 연관성에 대하여 확인할 수 있었다.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.693-698
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• 2002

For the evaluation of the plasma display panel (PDP)'s noise, vibration and sound characteristics of fanless PDP are measured and investigated. PDP is a type of two-electrode vacuum tube which operates on the same principle as a household fluorescent light. An inert gas such as argon or neon is injected between two glass plates on which transparent electrodes have been formed, and the glass is illuminated by generating discharge. For this discharge, both high voltage and currents are needed and cause an acoustic noise. We investigated the noise characteristics connected with both a electromagnetic elements from SMPS to panel through X, Y and logic board, and a mechanical elements form panel to case through transfer path which related with vibration and heat. To reduce the noise of PDP, a discharge pulse memory design related with both higher brightness and lower power consumption is important and mechanical characteristics connected with dissipation process of both heat and vibration generated by panel discharge must be investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1222-1225
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• 2004

This paper presents multibit Sigma-Delta ADC using noise-shaped dynamic element matching(DEM). 5-bit flash ADC for multibit quantization in Sigma Delta modulator offers the following advantages such as lower quantization noise, more accurate white-noise level and more stability over single quantization. For the feedback paths consisting of DAC, the DAC element should have a high matching requirement in order to maintain the linearity performance which can be obtained by the modulator with a multibit quantizer. The DEM algorithm is implemented in such a way as to minimize additional delay within the feedback loop of the modulator Using this algorithm, distortion spectra from DAC linearity errors are shaped. Sigma Delta ADC achieves 82dB signal to noise ratio over 615H7z bandwidth, and 62mW power dissipation at a sampling frequency of 19.6MHz. This Sigma Delta ADC is designed to use 0.25um CMOS technology with 2.5V supply voltage and verified by HSPICE simulation.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.3
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• pp.218-223
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• 2007

The dissipation of high-power ultrasonic energy at the faces of the defect causes an increase in temperature. It is resulted from localized selective heating in the vicinity of cracks because of the friction effect. In this paper the measurement of size and direction of crack using UET(Ultrasound Excitation Thermography) is described. The ultrasonic pulse energy is injected into the sample in one side. The hot spot, which is a small area around the crack tip and heated up highly, is observed. The hot spot, which is estimated as the starting point of the crack, is seen in the nearest position from the ultrasonic excitation point. Another ultrasonic pulse energy is injected into the sample in the opposite side. The hot spot, the ending point of the crack, is seen in the closest distance from the injection point also. From the calculation of the coordinates of both the first hot spot and the second hot spot observed, the size and slope of the crack is estimated. In the experiment of STS fatigue crack specimen(thickness 14mm), the size and the direction of the crack was measured.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.317-322
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• 2009

Superplastic deformation behavior of a Zn-0.3 wt.% Al was investigated. Grain sizes of $1{\mu}m$ and $10{\mu}m$ were obtained by a thermomechanical treatment. A series of load relaxation and tensile tests were conducted at various temperatures ranging from RT ($24^{\circ}C$) to $200^{\circ}C$. A large elongation of 1400% was obtained at room temperature in the specimens with the grain size of $1{\mu}m$. In the case of specimens with the grain size of $10{\mu}m$, relatively lower elongation at room temperature was obtained and, as the temperature increases above $100^{\circ}C$, a high elongation of about 400 % has been obtained at $200^{\circ}C$ under the strain rate of $2{\times}10^{-4}/s$. Dynamic materials model (DMM) has been employed to explain the contribution from GBS of Zn-Al alloy. Power dissipation efficiency for GBS was evaluated as above 0.4 and found to be very close to the unity as strain rate decreased and temperature increased, suggesting that GBS could be regarded as Newtonian viscous flow.