• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.191-194
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• 1998

In this paper, the physical and conductivity properties due to the electron beam irradiation for low density polyethylene using insulating materials of the distribution cable and ultra-high voltage cable are studied. The specimens of the low density polyethylene of thickness 100[$\mu\textrm{m}$] irradiated as each 1 [Mrad], 2[Mrad], 4[Mrad], 8[Mrad], 16[Mrad] and virgin are used in this experiment. In order to measure the conductivity properties, the micro electrometer is used, the range of temperature and app1ying voltage are 20 to 120[$^{\circ}C$], from 100 to 1000[V] respectively So. as a result of the conductivity properties, it is confirmed that the conductivity is increased nearly to 50[$^{\circ}C$], and is not changed until the crystalline melting point from the temperature over 60[$^{\circ}C$] because of the defects of morphology and the formation of many trap centers by means of electron beam irradiation

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.256-258
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• 2003

Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like $AgIn_2$, $Ag_2In$, $Ag_3In$ etc. These compounds are determined by ratio of two metals. From phase diagram of Ag-In alloy, we can get the ratio of $Ag_2In$, that has high melting point about 700$^{\circ}C$, approximately 2:1. This ratio was made by controlling of film thickness. And bonding was executed by annealing and adding pressures at a time. The joint of these wafers had been observed by SEM. And we had also seen the EDS (Energy Dispersive Spectroscopy) data to analysis the component of samples.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.896-897
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• 2006

In the viewpoint of engineering, materials problem is a key problem, which determines whether the exploitation of fusion energy will be success. The most important class of fusion materials is plasma-facing materials (PFM). W, as high Z high melting-point metal is one of the most important candidate materials due to its high plasma erosion resistance. Improving the ductility of W and W based alloy, lowering its ductile-brittleness transition temperature for meeting the requirements of fusion application is an important task. In this paper, severalpowder meatllurgy methods of fabricating W and W based materials are being investigated.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.1
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• pp.70-74
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• 2012

Copper die casting motor (CDM) has a better design flexibility than aluminium die casting motor (ADM) because of the higher conductivity of copper. However, CDM has an economic and manufacturing weak point due to high copper price and high melting temperature compared to ADM. This paper describes a comparison of the design parameters, specifications, performances and material cost between CDM and ADM of 5.5kW_6P.

• Journal of Powder Materials
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• v.23 no.1
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• pp.15-20
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• 2016

Niobium is one of the most important and rarest metals, and is used in the electronic and energy industries. However, it's extremely high melting point and oxygen affinity limits the manufacture of Nb coating materials. Here, a Nb coating material is manufactured using a kinetic spray process followed by hot isotactic pressing to improve its properties. OM (optical microscope), XRD (X-ray diffraction), SEM (scanning electron microscopy), and Vickers hardness and EPMA (electron probe micro analyzer) tests are employed to investigate the macroscopic properties of the manufactured Nb materials. The powder used to manufacture the material has angular-shaped particles with an average particle size of $23.8{\mu}m$. The porosity and hardness of the manufactured Nb material are 0.18% and 221 Hv, respectively. Additional HIP is applied to the manufactured Nb material for 4 h under an Ar atmosphere after which the porosity decreases to 0.08% and the hardness increases to 253 Hv. Phase analysis after the HIP shows the presence of only pure Nb. The study also discusses the possibility of using the manufactured Nb material as a sputtering target.

• KIEE International Transactions on Electrophysics and Applications
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• v.2C no.6
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• pp.309-313
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• 2002

In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.221-223
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• 1999

In this work, samples were manufactured variously by changing conventional calcining and sintering conditions and we tried the utilization by making the heat treatment time, which is demanded to high-Tc phase formation, much shorter. We found out optimal heat treatment conditions with the analysis on formation process at superconducting phase in term of the change of calcining and sintering time and then, examined X-ray diffraction(XRD) patterns, scanning electron microscope(SEM) measurement and energy dispersive X-ray spectrometer(EDX) of the samples manufactured under heat treatment conditions which we suggest here. As a result, 2223 high-$T_c$, phase of (Bi,Pb)SrCaCuO superconductor starting with ($Bi_l$ xPbx,)$_2$$Sr_2$$Ca_2$$Cu_3$$O_y$, composition was formed from 1 hr sintering sample at temperature nearby melting point and also the completed sample with calcining and sintering time of 9 hr was formed high-$T_c$.low-$T_c$ phase appearing in sight above the critical temperature of liquid $N_2$.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.385-390
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• 2004

An unique ceramic material produced through unidirectional solidification with eutectic composition of two-phase oxides was introduced recently. This composite material has the microstructure of coupled networks of two single crystals interpenetrate each other without grain boundaries. Depending on this microstructure this material, called Melt Growth Composite (MGC), can sustain its room temperature strength up to 1$700^{\circ}C$ (near its melting point) and offer strong oxidization-resistant ability, making its characteristics quite ideal for the gas turbine application. The research project on MGC started in 2001 with the objective of establishing component technologies for MGC application to the high temperature components of the gas turbine engine. MGC turbine nozzles are expected to improve efficiency of gas turbine. However, reduction of the thermal stress is required since high thermal stress is easily generated in MGC turbine nozzles due to temperature distribution. Firstly, the hollow nozzle shape was optimized to reduce thermal stress using numerical analysis. From the results of the first hot gas flow tests, the thermal stress due to span-wise temperature distribution was required to be reduced, and separated nozzle to three pieces was designed. This was tested in hot gas flow at 140$0^{\circ}C$ level, and temperature distributions on the nozzle surface were obtained and stress field was evaluated.

• Journal of the Korean Society of Safety
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• v.19 no.3 s.67
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• pp.51-56
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• 2004

Conductive polymer blends and composites are widely used for different safety application such as electrostatic charge dissipation(ESD), electromagnetic interference(EMI) shielding, electrostatic prevention and safety chemical sensor. In order to prepare a impedance-type humidity sensor that is durable at high humidities and high temperature, electically conductive polymer blends based on diallyldimethylammonium chloride(DADMAC) and epoxy were prepared in this study. The polymer blends type conductive ionomer exhibits reaction each other DADMAC and epoxy in FT-IR and DSC analysis. The blends material was traced by new peak at 1600cm-1 and appeard improvement of thermal resistance by melting point shift. Alumina substrate was deposited a pair of gold electrodes by screen printing. The blend material were spin-coated with a thin film type on the surface of alumina substrate. The polymer bleld type sensor exhibits a linear impedance increasing better than DADMAC coated humidity sensor. Also it shows good sensitivity, low hysteresis and durability against high humidity.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.12
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• pp.1403-1410
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• 2011

Creep characteristic is an important failure mechanism when evaluating engineering materials that are soft material as polymers or used as mechanical elements at high temperatures. One of the popular thermo-elastic polymers, Polymethyl methacrylate(PMMA) which is used broadly for engineering polymer, as it has excellent mechanical and thermal properties compared to other polymers, was studied for creep characteristic at various level of stresses and temperatures. From the experimental results, the creep limit of PMMA at room temperature is 85 % of tensile strength. which is higher than that of PE (75%)at room temperature. Also the creep limits decreased to nil linearly as the temperatures increased, up to $120^{\circ}C$ of the melting point($267^{\circ}C$). Also the first and third stage among the three creep stages were non-existent nor were there any rupture failure which occurred for many metals at high temperatures.