• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of Welding and Joining
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• v.19 no.2
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• pp.208-214
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• 2001

In this study, we constructed a visual sensor system for weld seam tracking in real time in GMA welding. A sensor part consists of a CCD camera, a band-pass filter, a diode laser system with a cylindrical lens, and a vision board for inter frame process. We used a commercialized robot system which includes a GMA welding machine. To extract the weld seam we used a inter frame process in vision board from that we could remove the noise due to the spatters and fume in the image. Since the image was very reasonable by using the inter frame p개cess, we could use the simplest way to extract the weld seam from the image, such as first differential and central difference method. Also we used a moving average method to the successive position data or weld seam for reducing the data fluctuation. In experiment the developed robot system with visual sensor could be able to track a most popular weld seam. such as a fillet-joint, a V-groove, and a lap-joint of which weld seam include planar and height directional variation.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2001.02a
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• pp.406-412
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• 2001

• Proceedings of the KWS Conference
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• 1998.05a
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• pp.204-207
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• 1998

• International Journal of Highway Engineering
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• v.12 no.4
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• pp.47-51
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• 2010

A vehicle classification data is essential for traffic road planning and pavement. In this study, the vehicle height, vehicle criteria for classification applied to measure the height of the car driving has devised a way to install equipment. It is capable of measuring the vehicle height was confirmed to field experiments, the measurement system is obtained to the vehicle length and height data. In this experiment, results showed the accuracy of 88.6% compared to classification data using the discriminant function obtained from video replaying. The height of vehicle applying the classification criteria can be utilized to determine the vehicle class.

• Journal of Sensor Science and Technology
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• v.7 no.3
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• pp.188-196
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• 1998

The sensing and electrical characteristics of $WO_{3}$-based n-type semiconductor gas sensors are investigated. In normal air condition, $TiO_{2}$(4 wt. %)-doped $WO_{3}$-based sensor fabricated without any binder shows the grain boundary ( GB ) potential barrier height of 0.26 V. Sensors fabricated with alumina, PVA and silica sol binders show 0.17, 0.22 and 0.26 V of GB potential barrier height, respectively. In the ambience of 120 ppm $NO_{x}$ concentration, the GB potential barrier height of the sensor fablicated without binder is increased to 0.59 V. The sensors were fabricated with alumina, PVA, silica sol binders show 0.43, 0.66 and 0.52 V of potential barrier, respectively. Thus the variation of the potential barrier at GB is largest in the sensor fabricated with the PVA binder. This is found to be the main reason why the sensor fabricated with the PVA binder shows the best sensitivity. It is also found that the decrease of sensitivity at a temperature higher than the optimum operation temperature is due to the temperature dependence of the sensor resistance in normal air condition rather than the desorption of the adsorbed $NO_{x}$ gas particles. In the ambience of 250 ppm CO concentration, the GB potential barrier heights of the sensors fabricated without binder and with PVA binder are about 0.2 V showing negligible change compared to the case of normal air ambience. This fact indicates that these sensors are good candidates for the selective detection of $NO_{x}$ gas in the mixture of CO and $NO_{x}$ gases.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.3
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• pp.639-646
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• 2016

In this study, the contactless measurement method with a optical displacement sensor(ODS, ADNS 9500) was proposed to overcome flaws in a rotary encoder based measurement under particular circumstances, such as a slippage and a case of little rotational inertia. The performance tests of the optical displacement sensor using data acquisition board and National Instruments's LabVIEW program were performed to accomplish accurate displacement measurements and the performance characteristics according to measurement direction, speed, acceleration, height and surface types were discovered through the repetitive tests. The experimental results indicate that, in order to get an accurate in-plane motion, the height(distance between the ODS and the target surface) has to be maintained at the range of 2.4 mm to 3.2 mm and the sensitivity(resolution) should be modified and applied to the formulae for displacement calculation, considering its measurement direction, speed and surface type.

• Journal of Biosystems Engineering
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• v.25 no.6
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• pp.457-462
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• 2000

Boom sprayers have been known by their excellency in field efficiency worker’s safety and pest control efficacy. The boom sprayer in Korea that was developed for paddy field is not suitable for upland field of which shape is irregular and inclination is steep, due to heavy chemical tank long boom width and manual on-off control of spraying. The goal of the study was to develope a boom control system that could control boom angles of left and right boom automatically and independently corresponding to local field slope. The prime mover was selected as a cultivating tractor. Main results of this study were as follows. 1. Ultrasonic sensor whose response time was 0.1s and response angle was within $\pm$20$^{\circ}$was selected to measure distance. Voltage output of the sensor(X, Volt) had a highly significant linear relationship with the vertical distance between the sensor and ground surface(Y, mm) as follows; Y=0.0036X-0.437 2. Left and right section of the boom could be folded up by a position control device(on-off control) which could control the left and right boom independently corresponding to local slope by equalizing distances between the sensor and boom at the center and left/right boom. Most reliable DB(dead band) was experimentally selected to be 75$\Omega$(6cm). 3. At traveling velocity of 0.3~0.5m/s RMS of error between desired and achieved height was less than 4.5cm The developed boom angle controller and boom linkage system were evaluated to be successful in achieving the height control accuracy target of $\pm$10cm.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.1
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• pp.99-107
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• 2014

In this paper, a landmark based localization system using a Kinect sensor is proposed and evaluated with the implemented system for precise and autonomous navigation of low cost robots. The proposed localization method finds the positions of landmark on the image plane and the depth value using color and depth images. The coordinates transforms are defined using the depth value. Using coordinate transformation, the position in the image plane is transformed to the position in the body frame. The ranges between the landmarks and the Kinect sensor are the norm of the landmark positions in body frame. The Kinect sensor position is computed using the tri-lateral whose inputs are the ranges and the known landmark positions. In addition, a new matching method using the pin hole model is proposed to reduce the mismatch between depth and color images. Furthermore, a height error compensation method using the relationship between the body frame and real world coordinates is proposed to reduce the effect of wrong leveling. The error analysis are also given to find out the effect of focal length, principal point and depth value to the range. The experiments using 2D bar code with the implemented system show that the position with less than 3cm error is obtained in enclosed space($3,500mm{\times}3,000mm{\times}2,500mm$).