• 한국기계가공학회지
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• 제21권4호
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of Welding and Joining
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• 제19권2호
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• pp.208-214
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• 2001

In this study, we constructed a visual sensor system for weld seam tracking in real time in GMA welding. A sensor part consists of a CCD camera, a band-pass filter, a diode laser system with a cylindrical lens, and a vision board for inter frame process. We used a commercialized robot system which includes a GMA welding machine. To extract the weld seam we used a inter frame process in vision board from that we could remove the noise due to the spatters and fume in the image. Since the image was very reasonable by using the inter frame p개cess, we could use the simplest way to extract the weld seam from the image, such as first differential and central difference method. Also we used a moving average method to the successive position data or weld seam for reducing the data fluctuation. In experiment the developed robot system with visual sensor could be able to track a most popular weld seam. such as a fillet-joint, a V-groove, and a lap-joint of which weld seam include planar and height directional variation.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 2001년도 동계 학술대회 논문집
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• pp.406-412
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• 2001

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1998년도 특별강연 및 춘계학술발표 개요집
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• pp.204-207
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• 1998

• 한국도로학회논문집
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• 제12권4호
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• pp.47-51
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• 2010

도로를 주행하는 차량들을 구분하는 차종자료는 도로 및 포장의 설계와 관리 등 여러 분야에서 기초자료로 활용되고 있다. 본 연구에서는 차종구분에 차량높이라는 분류기준을 적용하기 위해 주행하는 차량의 높이를 계측할 수 있는 방법을 고안하고 현장에 장비를 설치한 후 실험을 통해서 차량길이와 차량최고높이 자료를 획득하였다. 차량높이 측정과 동시에 동영상을 촬영하여 국토해양부 12종 차종분류에 의거하여 차종분류 기준값을 작성하였다. 영상을 통해 작성된 차종자료 기준값과 측정된 차량길이와 차량높이를 토대로 판별함수를 이용한 차종분류값을 서로 비교한 결과 88.6%의 차종정확도를 확인하였다. 이를 통해 차량높이라는 분류기준을 적용하여 차종분류에 활용할 수 있는 방안을 제시하였다.

• 센서학회지
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• 제7권3호
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• pp.188-196
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• 1998

$WO_{3}$계 n-형 반도체 가스센서의 검지특성 및 전기적 특성을 조사하였다. 공기중에서 결합제가 첨가되지 않은 $WO_{3}:TiO_{2}$(4 wt. %) 센서의 낱알경계에서의 전위장벽의 크기는 0.26 V로 나타났으며, 결합제로서 $Al_{2}O_{3}$, PVA (polyvinyl alcohol ), silica sol이 첨가된 센서의 경우는 전위장벽이 각각 0.17, 0.22, 0.26 V로 관측되었다. 이들 시료를 $NO_{x}$가 120 ppm 첨가된 분위기에 노출시켰을 때, 결합제가 첨가되지 않은 센서의 경우는 낱알경계에서의 전위장벽이 0.59 V로 증가하였으며, 결합제로서 $Al_{2}O_{3}$, PVA, silica sol이 첨가된 경우는 전위장벽이 각각 0.43, 0.66, 0.52 V로 나타나, PVA가 첨가된 센서에서 전위장벽의 변화가 가장 높아 감도가 우수하게 되는 것을 알 수가 있었다. 한편 센서 최적 작동온도 이상의 온도에서 나타나는 감도의 감소는 흡착가스 입자의 탈착보다는 공기중에서 다결정이 보이는 저항의 온도 의존성에 따라 나타남이 판명되었다. 또한 결합제가 첨가되지 않은 센서와 결합제로서 Pt가 첨가된 센서의 경우, CO가 250 ppm 존재할 때까지도 전위장벽의 크기가 약 0.2 V로 공기중에서와 비슷한 크기를 나타내어, CO와 $NO_{x}$가 혼합된 분위기에서 $NO_{x}$만을 선택적으로 검지하는데 유리함이 밝혀졌다.

• 한국정보통신학회논문지
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• 제20권3호
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• pp.639-646
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• 2016

본 연구에서는 특수한 상황(미끄러짐 발생 및 회전관성이 부하로 작용하는 경우)에서의 회전 엔코더 기반 측정방법의 단점을 극복하기 위하여 광 변위센서(ADNS-9500)를 사용한 비접촉식 변위 측정방법을 제안하였다. 정확한 변위 측정을 위해 데이터 수집 보드와 랩뷰를 활용하여 실험적으로 광 변위센서의 성능을 분석하였으며, 반복실험을 통해 실험조건(측정방향, 속도, 가속도, 높이, 표면 재질)에 따른 광 변위센서의 성능특성을 파악하였다. 성능실험 결과, 광 변위센서를 사용하여 정확하게 평면운동을 측정하기 위해서는 광 변위센서와 지면(대상 물체의 표면)과의 높이를 2.4 mm-3.2 mm로 일정하게 유지시켜야 하며, 각각의 축 방향, 속도, 표면 재질을 고려하여 민감도를 수정하여 변위 계산식에 적용해야 하는 것을 확인하였다.

• Journal of Biosystems Engineering
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• 제25권6호
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• pp.457-462
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• 2000

Boom sprayers have been known by their excellency in field efficiency worker’s safety and pest control efficacy. The boom sprayer in Korea that was developed for paddy field is not suitable for upland field of which shape is irregular and inclination is steep, due to heavy chemical tank long boom width and manual on-off control of spraying. The goal of the study was to develope a boom control system that could control boom angles of left and right boom automatically and independently corresponding to local field slope. The prime mover was selected as a cultivating tractor. Main results of this study were as follows. 1. Ultrasonic sensor whose response time was 0.1s and response angle was within $\pm$20$^{\circ}$was selected to measure distance. Voltage output of the sensor(X, Volt) had a highly significant linear relationship with the vertical distance between the sensor and ground surface(Y, mm) as follows; Y=0.0036X-0.437 2. Left and right section of the boom could be folded up by a position control device(on-off control) which could control the left and right boom independently corresponding to local slope by equalizing distances between the sensor and boom at the center and left/right boom. Most reliable DB(dead band) was experimentally selected to be 75$\Omega$(6cm). 3. At traveling velocity of 0.3~0.5m/s RMS of error between desired and achieved height was less than 4.5cm The developed boom angle controller and boom linkage system were evaluated to be successful in achieving the height control accuracy target of $\pm$10cm.

• 전기학회논문지
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• 제63권1호
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• pp.99-107
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• 2014

In this paper, a landmark based localization system using a Kinect sensor is proposed and evaluated with the implemented system for precise and autonomous navigation of low cost robots. The proposed localization method finds the positions of landmark on the image plane and the depth value using color and depth images. The coordinates transforms are defined using the depth value. Using coordinate transformation, the position in the image plane is transformed to the position in the body frame. The ranges between the landmarks and the Kinect sensor are the norm of the landmark positions in body frame. The Kinect sensor position is computed using the tri-lateral whose inputs are the ranges and the known landmark positions. In addition, a new matching method using the pin hole model is proposed to reduce the mismatch between depth and color images. Furthermore, a height error compensation method using the relationship between the body frame and real world coordinates is proposed to reduce the effect of wrong leveling. The error analysis are also given to find out the effect of focal length, principal point and depth value to the range. The experiments using 2D bar code with the implemented system show that the position with less than 3cm error is obtained in enclosed space($3,500mm{\times}3,000mm{\times}2,500mm$).