• 전기학회논문지
• /
• 제59권3호
• /
• pp.609-613
• /
• 2010

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

• 한국전기전자재료학회논문지
• /
• 제26권2호
• /
• pp.158-163
• /
• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 마이크로전자및패키징학회지
• /
• 제10권1호
• /
• pp.7-11
• /
• 2003

반도체 칩이나 전자제품에 사용되는 부품들은 작동할 때 발열을 하게 되며 발생한 열이 적절히 제거되지 않을 경우 제품 오작동의 원인이 된다. 이러한 열을 제거하기 위해 히트싱크(heatsink)와 냉각 팬 (cooling fan)을 조합한 냉각 구조가 사용된다. 그러나 히트싱크와 냉각 팬의 조합 구조는 복잡한 형상을 취하기 때문에 전기 전자 제품의 소형화 추세에 부응하기에는 어려움이 따른다. 냉각 효율은 히트싱크의 표면적과 히트싱크 제조시 사용된 재료에 따라 달라진다. 일반적인 냉각 구조의 한계를 극복하기 위한 방안으로써, Trach-etched 멤브레인의 표면과 기공(pore)에 무전해 금도금과 구리 도금을 실행하여 크기는 작으면서 표면적을 증가시킨 마이크로 히트싱크를 제조하였다. 제조한 마이크로 히트싱크의 구조는 주사현미경(SEM)과 광학 현미경으로 관찰하였으며, 일반적인 구리보다 열효율이 우수함을 방열 특성 실험을 통해 관찰하였다.

• 한국유체기계학회 논문집
• /
• 제18권3호
• /
• pp.33-37
• /
• 2015

A numerical study on the IPM/Bridge Diode cooling and coil cooling has been performed. Results are presented as plots of thermal resistance, temperature drop and RPM-ratio. CFD analysis for conventional cooling system has been performed as a reference case. As the RPM-Ratio was increased, heatsink thermal resistance and coil temperature were decreased. IPM/Bridge Diode thermal resistance and temperature of the coil is tended to be trade-off. The temperature of coil closest to the AC-motor fan showed the most significant change in accordance with duct design. The temperature of coil located at the top of DC-motor fan showed the most significant variation as the cooling air passes the heatsink fin area.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2003년도 춘계전력전자학술대회 논문집(2)
• /
• pp.520-523
• /
• 2003

In this paper, heatsink design for high power converter is presented. There are many ways of designing heatsink, but air cooling is by far the most used and much more practical than any of the other methods. In this paper, the practical methods of cooling which include the method to reduce a noise and a vibration due to a fan and the method to design a gap resistance and a contact resistance due to mounting force between thyristor and heatsink is proposed. Finally, simulation and experimental results are described to verify validity of the proposed method.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
• /
• pp.241-244
• /
• 2000

To investigate the compact effect of the different area of an active layer and the different type of heatsink on the junction to ambient transient thermal impedance, we have characterized the thermal behavior of power MOSFETs that have three different areas of an active layer and two types of heatsink. To do so, the "cooling curve method" has been used in order to measure the junction-to-ambient transient thermal impedance Zthja that represents the thermal behavior of the devices. The measured data depiets that the larger area of an active layer gives the better-in other words. smaller-thermal impedance, and that the larger size of a heatsink improves the thermal impedance.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.30-31
• /
• 2008

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthroug(NPT) Insulated Gate Bipolar Transistor with heatsink areas has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, ANSYS and compared with experimental data by thermocam.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
• /
• 제48권4호
• /
• pp.194-202
• /
• 1999

Various ways of designing heat sink are available for commercial high power converters and among them, the method of air cooling is the most popular and practical method than any other ones. In this paper, a practical method of cooling high power converter, which includes a method of reducing noise and vibration caused by the fan and a method of estimating the gap and contact resistances existing between the thyristor and heat sink, is presented. Finally, the heat transfer analysis and implementation methods of heat sink for high power converter is presented.

• 대한기계학회논문집B
• /
• 제39권4호
• /
• pp.343-350
• /
• 2015

자연 대류 히트 싱크는 신뢰성 및 가격 경쟁력 등의 이유로 가장 널리 쓰이는 냉각 장치이며, 특히 고출력 LED 조명에 널리 사용되고 있다. 고출력 LED 조명은 일반적으로 가로등, 보안등 등에 이용되며 기울어진 형태로 사용되므로 히트 싱크 또한 기울어지게 되는데, 이러한 기울어진 히트 싱크에 대해서는 연구가 이루어지지 않아 정확한 열성능 예측이 어려웠다. 이에 본 연구에서는 평판 핀을 갖는 원통형 히트 싱크가 기울어진 경우에 대해 방열 성능을 측정하였다. 실험은 다양한 휜의 길이와 개수, 히트 싱크 베이스의 다양한 온도에 대해 경사각이 30도와 60도인 경우에 대해 수행되었다. 그리고 실험결과를 바탕으로 100,000 < $Ra_L$ < 600,000, 1/6 < H/D < 1/2, 9 < N < 72의 범위에서 적용 가능한 Nusselt 수 상관 관계식을 제시하였다.

• 한국기계가공학회지
• /
• 제18권8호
• /
• pp.24-30
• /
• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. The results of the empirical test showed that the best temperature intensification was found at 90 with 15-fins, and the heatsink installed perpendicular to the direction of the flow of air was directly connected to the air in the largest heat shield area, leading to the best cooling, and the number of fin also resulted increase in the heat discharge area, resulting in the largest cooling action with 15 fins. It was found that the rate of air flow changed in the range of 1.5m/s to 2.5m/s, but only by a deviation of about $2^{\circ}C$ to $3^{\circ}C$ from the current state of 15 fins at 2.5m/s, and the rate of air flow increased, but the performance of the heat release was not significantly increased. As a result wind speed with minimum air flow conditions of 1.5m/s can greatly contribute to the heat dissipation performance.