• 제목/요약/키워드: Heating Profile

검색결과 144건 처리시간 0.027초

환형밀폐용기내 성층화된 유체의 옆면가열에 의한 이중확산대류에 관한 수치해석 (Numerical Study of Double Diffusive Convection of a Stratified Fluid in an Annulus Due to Lateral Heating)

  • 강신형;전창덕;이진호
    • 대한기계학회논문집
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    • 제19권7호
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    • pp.1720-1730
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    • 1995
  • Finite-difference analysis was conducted to study the natural convection of a stably stratified salt-water solution in an annulus due to lateral heating. The main purpose of this study is to examine in detail the multi-layered flow structure. Calculation was thus made for R $a_{\eta}$=2*10$^{5}$ and 6.5*10$^{5}$ . Formation of layered flow structure, merging process of layers, the corresponding temperature and concentration distributions, Nusselt number variations with time are examined. Numerical results show that in each layer, the temperature profile looks 'S`-shaped and the concentration profile is uniform due to the convective mixing. The formation of the roll and the layer is governed by natural convection due to the temperature gradient and the merging process of the layer by diffusion of the concentration.ation.

초내열합금 링제품의 형상링 압연 제조 기술 (Profile Ring Rolling Manufacturing Technology of Alloy 718)

  • 김태옥;김국주;김남용;이진모;염종택
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 추계학술대회 논문집
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    • pp.425-428
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    • 2009
  • Aerospace engine application needs to stand high temperature and pressure. Because of its mechanical properties such as high strength at high temperature, Alloy 718 is used aerospace engine application about 80%. But alloy 718's mechanical properties cause some problem to manufacturing profile ring like damage of material and mold. In this study, alloy 718's mechanical properties investigated for knowing its formability and using FE-Simulation for designing profile ring roll process and mold shape. Profile ring rolling processing is designed with "Initial material$\rightarrow$Blank$\rightarrow$Linear Ring$\rightarrow$Profilering". Blank's heating temperature is setting $1100^{\circ}C$ for manufacturing a trial profile ring on the basis of FE-Simulation. As a result of manufacturing alloy 718 profile ring, it is possible to make near target profile shape ring with all of the processing condition which gives in this study.

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TDLAS에서 temperature binning 방법을 이용한 온도 측정에 대한 실험적 연구 (Experimental study on TDLAS temperature profile measurement using temperature binning method)

  • 윤성운;김세원;신명철;이창엽
    • 한국연소학회:학술대회논문집
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    • 한국연소학회 2012년도 제45회 KOSCO SYMPOSIUM 초록집
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    • pp.27-28
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    • 2012
  • Tunable diode laser absorption spectroscopy(TDLAS) measurement techniques for several gases densities and temperatures have been applied in industrial combustion systems. Accurate measurement of temperature profile is very important, especially in power plants and heating furnaces. So profile fitting and temperature binning methods are new issue for accurate measurement of temperature in laser gas sensing. Temperature binning method is applied in this study for the measurement of temperature profile using tube furnace with three temperature zones. In this study the temperature profiles of tube furnace is accurately measured within 5% error, and this technique is proved to be very promising in the field of temperature profile measurement.

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미송 대단면재의 가열법에 따른 진공건조 특성 (Vacuum Drying Characteristics Using Different Heating Methods for Douglas-fir Timber)

  • 정희석;엄창득;소범준
    • Journal of the Korean Wood Science and Technology
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    • 제32권4호
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    • pp.18-26
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    • 2004
  • 변장 14 cm 재장 2.4 m인 대단면재의 전도가열, 고주파가열 및 복합가열에 의한 진공건조특성을 조사하였다. 건조속도는 복합가열에서 가장 컸고, 고주파가열에서 가장 적었다. 비에너지는 고주파가열에서 가장 컸고, 전도가열에서 가장 적었다. 진공건조목재의 횡단방향 함수율분포는 전도가열과 복합가열의 경우 불록한 형태를 나타냈으나, 고주파가열의 경우는 한쪽 표층에서 반대쪽 표층으로 향해 증가하는 경향을 나타내었다. 건조목재의 재장방향 함수율은 전도가열과 복합가열의 경우 횡단면이 중심부위보다 낮았고 고주파가열의 경우 횡단면이 중심보다 높았다. 표면할렬과 횡단면할렬은 전도가열진공건조에서 가장 심하였다. 내부할렬은 어떠한 가열방법에 의한 건조에서도 발생하지 않았다. 복합가열 진공건조 특성은 전도가열과 고주파가열간의 절충된 중간적 경향을 나타냈다.

진공 솔더링 공정 중 웨이퍼 온도균일화 제어 (Temperature Uniformity Control of Wafer During Vacuum Soldering Process)

  • 강민식;지원호;윤우현
    • 반도체디스플레이기술학회지
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    • 제11권2호
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    • pp.63-69
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    • 2012
  • As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

회전하는 환형용기내의 옆면 가열에 의한 이중확산대류에 관한 수치해석 (Numerical study of double diffusive convection due to lateral heating in a rotating annulus)

  • 강신형;이교승;이진호
    • 대한기계학회논문집B
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    • 제21권11호
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    • pp.1422-1436
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    • 1997
  • Numerical investigations were conducted to study the convective phenomena of an initially stably stratified salt water solution with lateral heating in a uniformly rotating annulus. The method of investigation is the finite difference analysis of the basic conservation equation for an axisymmetric, unsteady, double-diffusive convection and calculation is made for R $a_{\eta}$=2*10$^{5}$ and Ta=10$^{7}$ ~ 2.5*10$^{8}$ . Formation of layered flow structure, merging process of layers, the corresponding temperature and concentration distributions, Nu variation with time are examined. Numerical results show that in each layer, the temperature profile looks 'S'-shaped and the concentration profile is uniform due to the convective mixing. At the interface between adjacent layers, the temperature changes smoothly but the concentration changes rapidly. As the effect of the rotation increases, the generation of rolls at hot wall, the formation and merging of layers are delayed. The average Nu shows the trend of conduction heat transferees the effect of the rotation increases.n increases.

주기 발열 파형을 이용한 열식 질량 유량계의 특성에 관한 수치적 연구 (A numerical study on the characteristics of a thermal mass air flow sensor with periodic heating pulses)

  • 전홍규;오동욱;박병규;이준식
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2482-2487
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    • 2007
  • Numerical simulations are conducted for the analysis of a thermal mass air flow sensor with periodic heating pulses on silicon-nitride ($Si_3N_4$) thin membrane structure. This study aims to find the locations of temperature sensors on the thin membrane and the heating pulse conditions, that the higher sensitivity can be achieved, for the development of a MEMS fabricated mass air flow sensor which is driven in periodic heating pulse. The simulations, thus, focus on the membrane temperature profile according to variation of the flow velocity, heating duration time and imposed power. The flow velocity of the simulations is ranging from 3 m/s to 35 m/s, heating duration time from 1 ms to 3 ms and imposed power from 50 mW to 90 mW. The corresponding Reynolds numbers vary from 1000 to 10000.

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n-MOSFET 정전기 방전 분석 (Electrostatic Discharge Analysis of n-MOSFET)

  • 차영호;권태하;최혁환
    • 한국전기전자재료학회논문지
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    • 제11권8호
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    • pp.587-595
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    • 1998
  • Transient thermal analysis simulations are carried out using a modeling program to understand the human body model HBM ESD. The devices were simulated a one-dimensional device subjected to ESD stress by solving Poison's equation, the continuity equation, and heat flow equation. A ramp rise with peak ESD voltage during rise time is applied to the device under test and then discharged exponentially through the device. LDD and NMOS structures were studied to evaluate ESD performance, snap back voltages, device heating. Junction heating results in the necessity for increased electron concentration in the space charge region to carry the current by the ESD HBM circuit. The doping profile adihacent to junction determines the amount of charge density and magnitude of the electric field, potential drop, and device heating. Shallow slopes of LDD tend to collect the negative charge and higher potential drops and device heating.

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SHS 법에 의한 $Ti5_Si_3$의 합성시 온도 Profile 분석 (Temperature Profile Analysis of $Ti5_Si_3$ in Self-Propagating High Temperature Synthesis)

  • 김도경;이형직;김익진;이형복
    • 한국세라믹학회지
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    • 제32권3호
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    • pp.341-348
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    • 1995
  • An analysis of the use of temperature profiles in the determination of the kinetic parameters of combustion synthesis of Ti5Si3 were investigated. From profile analysis, an apparent activation energy of 12KJ/mol was calculated. The Maximum heating rate achieved during 10wt% Ti5Si3 reaction by the product dilution method was approximately $1.5\times$104 K/s. Coupling this value with the measured wave velocity of 7.02 cm/s yields a maximum thermal gradient of 2.14$\times$103 K/cm. The value of tr (=t*) was calculated to be 1.2$\times$10-1 s and the value of td (=tx) was calculated to be 32.89 s. Using the definition of t* and the measured wave velocity, the effective thermal diffusivity, $\alpha$, was calculated to be 0.59$\times$10 $\textrm{cm}^2$/s. From these analysis, the power function, G, was also calculated.

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