• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.6 no.4
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• pp.325-336
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• 1994

A numerical simulation of velocity and temperature fields and Nusselt number distributions is performed by using the algebraic stress model (ASM) for the velocity profiles and low Reynolds number ${\kappa}-{\varepsilon}$ model and the algebraic heat flux model(AHFM) for turbulent heat transfer in a $180^{\circ}$ bend with a constant wall heat flux. In the low Reynolds number ${\kappa}-{\varepsilon}$ model, turbulent Prandtl number is modified by considering the streamline curvature effect and the non-equilibrium effect between turbulent kinetic energy production and dissipation rate. Every heat flux term presented in the transport equation of turbulent heat flux is reduced to algebraic expressions in a way similar to algebraic stress model. Also. in the wall region, low Reynods number algebraic heat flux model(AHFM) is applied.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.353-358
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• 2000

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.293-295
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• 1987

This paper deals with the dielectric properties dielectric breakdown strength and mechanical tensile properties according to heat - treatment condition of polyurethane resin. This resin is heat - treated over a range of temperature from $50^{\circ}C$ to $150^{\circ}C$. It is shown that the dielectric dissipation factor decreases with increase of heat - treatment temperature of the sample exept for the sample heat - treated at $150^{\circ}C$. The maximum dielectric breakdown strength is appeared for the sample heat - treated for 10 hours at $100^{\circ}C$, after curing for 24 hours at room temperature. The optimal heat - treatment condition in the view point of the electrical and mechanical properties is appeared for the sample heat - treated for 10 hours at $100^{\circ}C$, after curing for 24 hours at room temperature.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.4
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• pp.563-569
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• 2008

During braking operation, the surfaces of disk have severe contact conditions and high frictional heat would be generated between disk and pad surfaces. The heat makes high temperature gradient on disk surfaces and results in thermal deformation. To enhance the frictional heat dissipation, heat pipes are embedded in the ventilated type disk along the radial direction. The temperatures of the inner vent type disk and the brake disk with heat pipes are compared at the same operating conditions. By comparison a brake disk with heat pipes has higher cooling performance than the inner vent type disk.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.75-79
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• 2013

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.166-175
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• 2002

Tank track rubbers, which undergo dynamic stresses and strains under various road conditions, leads to a result of considerable internal temperature rise due to the heat generation. Since rubber materials are not fully elastic, a part of the mechanical energy is converted into heat because of the hysteresis loss. Heat generation without adequate heat dissipation leads to heat build-up, i.e. internal temperature rise which, if excessive, exerts a bad influence upon the performance and the life of the tank track rubbers. The purpose of this paper is to predict temperature distributions of the rubber components off tank track subjected to complex dynamic loads under various read conditions. In steady state analysis temperature fields are displayed in contour shapes, and in unsteady analysis the temperature variations of some important nodes are represented graphically with respect to the running time of the tank.

• Journal of Powder Materials
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• v.28 no.6
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• pp.518-526
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• 2021

This review summarizes the recent progress in iron-oxide-based heat generators. Cancer treatment using magnetic nanoparticles as a heat generator, termed magnetic fluid hyperthermia, is a promising noninvasive approach that has gained significant interest. Most previous studies on improving the hyperthermia effect have focused on the construction of dopant-containing iron oxides. However, their applications in a clinical application can be limited due to extra dopants, and pure iron oxide is the only inorganic material approved by the Food and Drug Administration (FDA). Several factors that influence the heat generation capability of iron-oxide-based nanoparticles are summarized by reviewing recent studies on hyperthermia agents. Thus, our paper will provide the guideline for developing pure iron oxide-based heat generators with high heat dissipation capabilities.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.12
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• pp.986-993
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• 2007

The microchannel heat sink is promising heat dissipation method far high density electronic devices. The cross-sectional shape of MEMS based microchannel heat sink is limited to triangular, trapezoidal, and rectangular due to their fabrication method. And heat is added to one side surface of heat source. Therefore, those specific conditions make some complexity of heat transfer in microchannel heat sink. Though many previous research of conjugate heat transfer in microchannel was conducted, most of them did not consider heat loss. In this study, numerical investigation of conjugate heat transfer in rectangular microchannel was conducted. The method of heat loss evaluation was verified numerically. Heat distribution was different for each wall of rectangular microchannel due to thermal conductivity and distance from heat source. However, the ratio of heat from each channel wall was correlated. Therefore, the effective area correction factor could be proposed to evaluate accurate heat flux in one side heating condition.

• Transactions of the Korean Society of Automotive Engineers
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• v.2 no.2
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• pp.103-116
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• 1994

In this study the behavior of engine cooling loss and overall heat transfer coefficient were studied experimentally using naturally aspirated engine and turbo charged engine. Using turbo charging, heat dissipation was increased because of the density of the mixture was increased with increment of inlet air flow rate. Therefore, cooling loss of turbo charged engine is larger than naturally aspirated engine. As taking the measurement of surface temperature of combustion chamber, gas heat transfer coefficient was calculated and found that it has greatly affected to overall heat transfer coefficient. The empirical formula of overall heat transfer coefficient established in order to predict of engine cooling loss and express only as a function of mean piston velocity.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.