• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.10
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• pp.826-834
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• 2006

A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.3
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• pp.1027-1032
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• 2013

LED is standing in the limelight as a light part of the low-carbon green energy. While LEDs are eco-friendly, efficient and durable, extreme heat rises can cause their durability to decrease, with 80% of the power supply being turned into heat energy. Heat radiation systems are important because rising temperatures affect the lifetime of LED elements. Therefore, in this paper, thermal analysis was performed for the shape of heat sink to the LED bulb. Also, it is applied the temperature control systems to our products for optimal performance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.5
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• pp.339-345
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• 2016

In this study, we numerically investigate the thermal performance of an enhanced radial heat sink with a perforation and chimney structure. We estimate the thermal performance of the enhanced radial heat sink, and compared it with that of a conventional radial heat sink. The results show that the radial heat sink with perforation has a higher thermal performance when either of the diameter and the number of perforations is high. With regards to the radial heat sink with a chimney structure, we investigate primarily the effect of the fin number, and the spacing between the chimney and the base plate on the thermal performance. The results show that there are optimal values for the fin number and the spacing between chimney and base plate. In addition, the enhanced radial heat sinks have maximum thermal performance when facing upward ($0^{\circ}$), while it has worst performance when facing sideward ($90^{\circ}$). The perforation and chimney are shown to cause thermal performance enhancements of 17% and 20%, respectively, compared with a conventional radial heat sink. The proposed method is useful for starting business, and is useful in terms of venture and entrepreneurship.

• Design & Manufacturing
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• v.10 no.3
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• pp.14-19
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• 2016

Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.380-385
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• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.12
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• pp.1156-1166
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• 2004

The shape of plate-fin type heat sink is numerically optimized to acquire the minimum pressure drop under the required temperature rise. In constrained nonlinear optimization problems of thermal/fluid systems, three fundamental difficulties such as high computational cost for function evaluations (i.e., pressure drop and thermal resistance), the absence of design sensitivity information, and the occurrence of numerical noise are commonly confronted. Thus, a sequential approximate optimization (SAO) algorithm has been introduced because it is very hard to obtain the optimal solutions of fluid/thermal systems by means of gradient-based optimization techniques. In this study, the progressive quadratic response surface method (PQRSM) based on the trust region algorithm, which is one of sequential approximate optimization algorithms, is used for optimization and the heat sink is optimized by combining it with the computational fluid dynamics (CFD).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.983-984
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.421-422
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.503-504
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• 2009