• Title/Summary/Keyword: Heat sink effect

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Water Cooling Pipe Structure for Heat-Dissipation of HEV Inverter System (HEV용 인버터의 방열을 위한 수냉식 배관구조)

  • Kim, Gyoung-Man;Woo, Byung-Guk;Lee, Yong-Hwa;Kang, Chan-Ho;Chun, Tae-Won;Cho, Kwan-Yuhl
    • The Transactions of the Korean Institute of Power Electronics
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    • v.15 no.1
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    • pp.27-34
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    • 2010
  • To dissipate the heat generated from the switching devices in the inverter system of HEV, the water cooling structure is proposed. The bolt type cooling structure has a problem such as water leakage for high pressure of water, therefore the proposed cooling structure applied pipe structure in the heat sink. The heat dissipation characteristics for various structures of water channel and distance between heat source and water channel was analyzed through the simulation. heat dissipation effect for two types of water cooling structures was investigated. Based on the simulation results, two types of water cooling system for 30kW inverter system of HEV were manufactured and the heat dissipation effect was verified.

Forced Convective Cooling Characteristics with Stacked Modules of Multi-PCBs' in Telecommunication Cabinet (다중 PCB 적층 모듈구조의 정보통신용 캐비넷 강제대류 냉각특성 연구)

  • Kim, W.T.;Kim, K.S.
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.8 no.2
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    • pp.230-239
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    • 1996
  • A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.

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Study on Local Thermal Equilibrium in a Porous Medium (다공성 매질에서 Local Thermal Equilibrium에 관한 연구)

  • Jang, Seok-Pil;Kim, Seong-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.8
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    • pp.1172-1182
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    • 2002
  • In the present study a general criterion for local thermal equilibrium is presented in terms of parameters of engineering importance which include the Darcy number, the effective Prandtl number of fluid, and the Reynolds number. For this, an order of magnitude analysis is performed for the case when the effect of convection heat transfer is dominant in a porous structure. The criterion proposed in this study is more general than the previous criterion suggested by Carbonell and Whitaker, because the latter is applicable only when conduction is the dominant heat transfer mode in a porous medium while the former can be applied even when convection heat transfer prevails. In order to check the validity of the proposed criterion for local thermal equilibrium, the forced convection phenomena in a porous medium with a microchanneled structure subject to an impinging jet are studied using a similarity transformation. The proposed criterion is also validated with the existing experimental and numerical results for convection heat transfer in various porous materials that include some of the parameters used in the criterion such as a microchannel heat sink with a parallel flow, a packed bed, a cellular ceramic, and a sintered metal. It is shown that the criterion presented in this work well-predicts the validity of the assumption of local thermal equilibrium in a porous medium.

Study of Chip-level Liquid Cooling for High-heat-flux Devices (고열유속 소자를 위한 칩 레벨 액체 냉각 연구)

  • Park, Manseok;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.2
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    • pp.27-31
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    • 2015
  • Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

Characteristics of Atmospheric Circulation and Heat Source related to Winter Cold Surge in Korea (한반도 겨울철 한파와 관련된 대기 순환과 열원의 특성)

  • Kim Maeng-Ki;Shin Sung-Chul;Lee Woo-Seop
    • Journal of the Korean earth science society
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    • v.26 no.6
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    • pp.560-572
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    • 2005
  • This study investigates the characteristics of atmospheric circulation and the heat source $(Q_1)$ related to the winter cold surge in Korea from 1979 to 1999. The occurrence frequency of cold surge is about one event per year and $60\%$ of the total events occurred during the former period, before 1989. During the cold surge, the pressure pattern shows more dominant east-west dipole circulation pattern in the lower troposphere and the effect of upper level trough is stronger than normal cases. Temperature falling pattern over Korea shows that the pattern opposite to the temperature structure over Lake Baikal and temperature change has opposite signs between the low-middle level and upper level, with the boundary at 400 hPa. The analysis of heat source shows that atmospheric cooling by cold advection during the cold surge is balanced by adiabatic warming due to downward motion, indicating that the movement path of cold core is associated with that of heat sink. Therefore, the movement mechanism of the heat source and sink should be well known for understanding the maintenance mechanism of cold surge and predicting cold surges.

Cooling Characteristics on the Forced Convection of an Array of Electronic Components in Channel Flow (II) - The Effect of the Reynolds Number (without the Heat Sink) - (채널 유동장 내에 배열된 전자부품의 강제대류 냉각특성에 관한 연구(II) -레이놀즈 수의 영향(히트싱크가 부착되지 않은 경우)-)

  • Kim, Kwang-Soo;Yang, Jang-Sik
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.6
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    • pp.509-517
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    • 2006
  • Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by $5\times11$ in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is Identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented.

Control of Heat Temperature in Light Emitting Diodes with Thermoelectric Device (열전소자를 이용한 발광다이오드의 발열 온도 제어)

  • Han, S.H.;Kim, Y.J.;Kim, J.H.;Kim, D.J.;Jung, J.Y.;Kim, S.;Cho, G.S.
    • Journal of the Korean Vacuum Society
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    • v.20 no.4
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    • pp.280-287
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    • 2011
  • The heat temperature of a light emitting diode (LED) is investigated with the thermoelectric device (TED). The Peltier effect of the thermoelectric device is used to control the heat radiation and the junction temperature of high-power LEDs. For the typical specific current (350 mA) of high-power (1 W) LEDs, the LED temperature and the p-n junction temperature become $64.5^{\circ}C$ and $79.1^{\circ}C$, respectively. For 0.1~0.2 W driving power of TED, the LED temperature and the junction temperature are reduced to be $54.2^{\circ}C$ and $68.9^{\circ}C$, respectively. As the driving power of the TED increases over 0.2 W, the temperature of LED itself and the junction temperature are increased due to the heat reversed from the heat-sink to LED. As the difference of temperature between LED and the heat-sink is increased, the quantity of reversed heat becomes larger and it results to degrade the cooling capability of TED.

Endothermic Properties of Liquid Fuel Decomposition Catalyst Using Metal Foam Support (메탈폼 지지체를 이용한 액체연료 분해반응 촉매의 흡열특성)

  • Mun, Jeongin;Kim, Nari;Jeong, Byunghun;Jung, Jihoon
    • Korean Chemical Engineering Research
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    • v.59 no.4
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    • pp.481-486
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    • 2021
  • In a hypersonic vehicle to solve the heat problem generated during flight, a cooling technology is being developed which uses the endothermic effect that appears during the decomposition reaction of the mounted fuel. In this study, the decomposition reaction of n-dodecane fuel was performed using HZSM-5 as a catalyst, and the catalyst was coated on metal foam to maximize the endothermic effect of the catalytic decomposition reaction and suppress coke formation. The reactor was a stainless steel flow reactor with a outer diameter of 1.27 cm, and the reaction temperature was 550 ℃, the reaction pressure was 4 MPa, and the flow rate was 12 ml per minute. As a result of the catalytic decomposition reaction using a catalyst coated with HZSM-5 on the metal foam, the heat sink was 2887 kJ/kg as a maximum, the gas phase conversion rate was 34%, and the amount of coke produced on the metal foam decreased by about 56% as the catalyst was coated compared to the uncoated catalyst.

Heating and Cooling Effect of Portected Horticulture by Geothermal Heat Pump System with Horizontal Heat Exchanger (수평형 지열히트펌프 시스템의 시설원예 냉난방 실증 효과)

  • Ryou, Young-Sun;Kang, Youn-Ku;Kim, Young-Jung;Kang, Keun-Chun
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.05a
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    • pp.630-633
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    • 2008
  • Geothermal heat pump systems use the earth as a heat source in heating mode and a heat sink in cooling mode. These systems can be used for heating or cooling systems in farm facilities such as greenhouses for protected horticulture, cattle sheds, mushroom house and etc. A horizontal type means that a geothermal heat exchanger is laid in the trench buried in 1.2 to 1.8 m depth. Because a horizontal type has advantages of low installation, operation and maintenance costs compared to a vertical type, it is easy to be adopted to agriculture. In this study, to heat and cool farm facilities and obtain basic data for practical application of horizontal geothermal heat pump system in agriculture, a horizontal geothermal heat pump system of 10 RT was installed in greenhouse. Heating and cooling performance of this system was estimated. The horizontal geothermal heat pump used in this study had heating COP of 4.57 at soil temperature of $14^{\circ}C$ with depth of 1.75m and heating COP of 3.75 at soil temperature of $7^{\circ}C$ with the same depth. The cooling COP was 2.7 at ground temperature at 1.75m depth of $25.5^{\circ}C$ and 2.0 at the temperature of $33.5^{\circ}C$.

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A Study on the Thermal Characteristics Comparison of the LED Floodlight Luminaire using Vapor Chamber Manufacturing Technology (베이퍼챔퍼 제조기술을 적용한 LED 투광등기구의 열 특성 비교에 관한 연구)

  • Seo, Jin-Kook;Yu, Young-Moon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.1
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    • pp.15-21
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    • 2015
  • The purpose of this paper is to analyze thermal characteristics of the heat sinks to maximize the thermal diffusivity for LED floodlight. The 2 kind of samples were prepared by vapor chamber manufacturing technology using the heat pipe principle. It was analyzed the maximum temperature reduction effect and the thermal diffusion from the heat source depending on the types of chambers with 3 kind of working fluids. As a result, it was confirmed that thermal conductivity 23% increased, GVC-R type than IVC-R type.