• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.34-34
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• 2003

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.447-449
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• 1987

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1165-1166
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• 2011

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.1
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• pp.73-80
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• 2006

Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To assess the thermal performance of the heat-generating components arranged by $5\times11$ in flow channel, three variables are used: the velocity of the fluid at the entrance, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. Based on the experiment analysis, some conclusions can be drawn: First of all, the experiment and numerical analysis are identical comparatively; the heat transfer coefficient increases as H/B decreases. Howeve., when H/B is over 7.2, the effect of H/B is rather trivial. The effect is the biggest at the first component from the entrance, and it decreases until the fully developed flow, where it becomes very consistent. The thermal wake function calculated for each row decreases as H/B increases.

• Textile Coloration and Finishing
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• v.28 no.1
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.737-744
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• 2016

The printed circuit heat exchanger (PCHE) is regarded as a promising candidate for advanced heat exchangers for the next-generation supercritical $CO_2$ power generation owing to its high compactness and rigid structure. In this study, an innovative type of PCHE, in which the channel sizes for the heat source fluid and heat sink fluid are different, is considered for analysis. The thermal performance of the PCHE, with supercritical $CO_2$ as the working fluid, is numerically analyzed. The results have shown that the thermal performance of the PCHE decreases monotonically when the channel size of either the heat source channel or the heat sink channel, because of the decreased flow velocity. On the other hand, the thermal performance of the PCHE is found to be almost independent of the spacing between the channels. In addition, it was found that the channel cross sectional shape has little effect on the thermal performance when the hydraulic diameter of the channel remains constant.

• The Transactions of the Korean Institute of Power Electronics
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• v.22 no.4
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• pp.297-304
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• 2017

The purpose of this paper is to analyze losses because of switching devices and the secondary side circuit diodes of 500 W full bridge dc-dc converter by applying gallium nitride (GaN) field-effect transistor (FET), which is one of the wide band gap devices. For the detailed device analysis, we translate the specific resistance relation caused by the GaN FET material property into algebraic expression, and investigate the influence of the GaN FET structure and characteristic on efficiency and system specifications. In addition, we mathematically compare the diode rectifier circuit loss, which is a full bridge dc-dc converter secondary side circuit, with the synchronous rectifier circuit loss using silicon metal-oxide semiconductor (Si MOSFET) or GaN FET, which produce the full bridge dc-dc converter analytical value validity to derive the final efficiency and loss. We also design the heat sink based on the mathematically derived loss value, and suggest the heat sink size by purpose and the heat divergence degree through simulation.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.46-50
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• 2012

This paper amis at improving the heat radiation performance of thermoelectric module (TEM) for a commercialization of high-powered LED light with using a multichip LED module. In addition, a 10W multichip LED light was prepared for the heat performance on radiating of which LED light was made for a use of testing by the driving of the thermoelectric module. So, it was found that about 30% in the effect of temperature reduction was confirmed if compared with the radiation heat by heat sink only.

• KIEAE Journal
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• v.14 no.6
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• pp.81-86
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• 2014

In recent years, many researchers have considered the building energy consumption reduction accordingly to deal with abnormal climate changes and greenhouse gas reduction. However, the lighting energy use ratio has increased in spite of the development of the high efficiency lighting device. Therefore, the study aims to produce the LED lighting applications for the effective lighting heat removal by using the heat characteristics of LED lighting and analyzing the heat removal effect. In order to increase radiant heat efficiency, the heat pipe and heat sink was attached on PCB as LED lighting applications. Experiment was conducted to verify the temperature and air velocity of inside duct: thermocouples, anemometer. The heat removal effect of LED lighting applications was measured by observing the temperature of the lighting applications and the change of air velocity in duct. The experiment shows that the temperature change in the duct according to air velocity was $0.9{\sim}5.8^{\circ}C$. It is also concluded that heat removal was calculated from 33 to 81W.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.12
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• pp.15-21
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• 2015

We proposed 50W-LED modules of using Heat-pipe and Stack-fin and produced LED modules was evaluated heat dissipation characteristics with comparison of the conventional die-casting type. It verified the application of products by applying it to 150W-LED road luminaires through simulation. The LED module was measures aimed design temperature of the Stack-fin and showed 26% upward heat dissipation effect than a conventional die-casting type. The luminous efficacy of 150W-LED road luminaires using this LED module reached over 112lm/W, and the simulation results showed average of horizontal luminance, overall luminance uniformity($U_O$) and lane luminance uniformity($U_I$) that is suitable for five-lane road with the KS standards.